WO2005047975A3 - Dispense geometry and conductive template to achieve high-speed filling and throughput - Google Patents

Dispense geometry and conductive template to achieve high-speed filling and throughput Download PDF

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Publication number
WO2005047975A3
WO2005047975A3 PCT/US2004/038088 US2004038088W WO2005047975A3 WO 2005047975 A3 WO2005047975 A3 WO 2005047975A3 US 2004038088 W US2004038088 W US 2004038088W WO 2005047975 A3 WO2005047975 A3 WO 2005047975A3
Authority
WO
WIPO (PCT)
Prior art keywords
achieve high
throughput
conductive template
speed filling
dispense
Prior art date
Application number
PCT/US2004/038088
Other languages
French (fr)
Other versions
WO2005047975A2 (en
Inventor
Sidlgata V Sreenivasan
Ian M Mcmackin
Byung-Jin Choi
Ronald D Voisin
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/706,537 external-priority patent/US20050098534A1/en
Priority claimed from US10/714,088 external-priority patent/US20050106321A1/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Priority to EP04818716A priority Critical patent/EP1682340A2/en
Priority to JP2006539967A priority patent/JP2007516862A/en
Publication of WO2005047975A2 publication Critical patent/WO2005047975A2/en
Publication of WO2005047975A3 publication Critical patent/WO2005047975A3/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

The present invention is directed to a method that employs a dispense geometry, a conductive template (26) with molds or recesses (28) having 'surface (28)', to treat deposits on substrate (30) surface (30a), and a method of forming the conductive template to achieve high-speed filling and throughput during imprint lithography processes.
PCT/US2004/038088 2003-11-12 2004-11-05 Dispense geometry and conductive template to achieve high-speed filling and throughput WO2005047975A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04818716A EP1682340A2 (en) 2003-11-12 2004-11-05 Dispense geometry and conductive template to achieve high-speed filling and throughput
JP2006539967A JP2007516862A (en) 2003-11-12 2004-11-05 Distributing geometry and conductive templates for fast filling and throughput

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/706,537 2003-11-12
US10/706,537 US20050098534A1 (en) 2003-11-12 2003-11-12 Formation of conductive templates employing indium tin oxide
US10/714,088 US20050106321A1 (en) 2003-11-14 2003-11-14 Dispense geometery to achieve high-speed filling and throughput
US10/714,088 2003-11-14

Publications (2)

Publication Number Publication Date
WO2005047975A2 WO2005047975A2 (en) 2005-05-26
WO2005047975A3 true WO2005047975A3 (en) 2006-02-02

Family

ID=34595369

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/038088 WO2005047975A2 (en) 2003-11-12 2004-11-05 Dispense geometry and conductive template to achieve high-speed filling and throughput

Country Status (5)

Country Link
EP (1) EP1682340A2 (en)
JP (1) JP2007516862A (en)
KR (1) KR20060126967A (en)
TW (1) TWI292347B (en)
WO (1) WO2005047975A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435979C (en) * 2005-06-24 2008-11-26 精工爱普生株式会社 Droplet discharge method, electro-optical device, and electronic device
US8707890B2 (en) * 2006-07-18 2014-04-29 Asml Netherlands B.V. Imprint lithography
US8142702B2 (en) * 2007-06-18 2012-03-27 Molecular Imprints, Inc. Solvent-assisted layer formation for imprint lithography
US20090212012A1 (en) * 2008-02-27 2009-08-27 Molecular Imprints, Inc. Critical dimension control during template formation
JP5289006B2 (en) * 2008-11-19 2013-09-11 株式会社東芝 Pattern forming method and program
NL2003875A (en) * 2009-02-04 2010-08-05 Asml Netherlands Bv Imprint lithography method and apparatus.
JP5377053B2 (en) * 2009-04-17 2013-12-25 株式会社東芝 Template, manufacturing method thereof, and pattern forming method
JP5281989B2 (en) * 2009-08-26 2013-09-04 富士フイルム株式会社 Pattern transfer apparatus and pattern forming method
JP2011071500A (en) 2009-08-31 2011-04-07 Fujifilm Corp Pattern transfer apparatus and pattern forming method
JP5296641B2 (en) * 2009-09-02 2013-09-25 東京エレクトロン株式会社 IMPRINT METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, AND IMPRINT DEVICE
JP5283647B2 (en) 2010-03-03 2013-09-04 富士フイルム株式会社 Pattern transfer method and pattern transfer apparatus
JP5460541B2 (en) * 2010-03-30 2014-04-02 富士フイルム株式会社 Nanoimprint method, droplet arrangement pattern creation method, and substrate processing method
JP5983218B2 (en) * 2012-09-11 2016-08-31 大日本印刷株式会社 Method for producing template for nanoimprint lithography
JP6540089B2 (en) * 2015-02-25 2019-07-10 大日本印刷株式会社 Pattern forming method, pattern forming apparatus and program for pattern formation
US11556055B2 (en) * 2020-06-19 2023-01-17 Canon Kabushiki Kaisha Systems and methods for generating drop patterns

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244848A (en) * 1989-03-16 1990-09-28 Fujitsu Ltd Burst communication control method
US5817376A (en) * 1996-03-26 1998-10-06 Minnesota Mining And Manufacturing Company Free-radically polymerizable compositions capable of being coated by electrostatic assistance
US6234379B1 (en) * 2000-02-28 2001-05-22 Nordson Corporation No-flow flux and underfill dispensing methods
WO2001047003A2 (en) * 1999-12-23 2001-06-28 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
US20020177319A1 (en) * 2000-07-18 2002-11-28 Chou Stephen Y. Fluid pressure bonding
US6580172B2 (en) * 2001-03-02 2003-06-17 Motorola, Inc. Lithographic template and method of formation and use
US6646662B1 (en) * 1998-05-26 2003-11-11 Seiko Epson Corporation Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244848A (en) * 1989-03-16 1990-09-28 Fujitsu Ltd Burst communication control method
US5817376A (en) * 1996-03-26 1998-10-06 Minnesota Mining And Manufacturing Company Free-radically polymerizable compositions capable of being coated by electrostatic assistance
US6646662B1 (en) * 1998-05-26 2003-11-11 Seiko Epson Corporation Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
WO2001047003A2 (en) * 1999-12-23 2001-06-28 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
US6234379B1 (en) * 2000-02-28 2001-05-22 Nordson Corporation No-flow flux and underfill dispensing methods
US20020177319A1 (en) * 2000-07-18 2002-11-28 Chou Stephen Y. Fluid pressure bonding
US6580172B2 (en) * 2001-03-02 2003-06-17 Motorola, Inc. Lithographic template and method of formation and use
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes

Also Published As

Publication number Publication date
EP1682340A2 (en) 2006-07-26
TWI292347B (en) 2008-01-11
TW200523040A (en) 2005-07-16
KR20060126967A (en) 2006-12-11
WO2005047975A2 (en) 2005-05-26
JP2007516862A (en) 2007-06-28

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