WO2005047975A2 - Dispense geometry and conductive template to achieve high-speed filling and throughput - Google Patents
Dispense geometry and conductive template to achieve high-speed filling and throughput Download PDFInfo
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- WO2005047975A2 WO2005047975A2 PCT/US2004/038088 US2004038088W WO2005047975A2 WO 2005047975 A2 WO2005047975 A2 WO 2005047975A2 US 2004038088 W US2004038088 W US 2004038088W WO 2005047975 A2 WO2005047975 A2 WO 2005047975A2
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- droplets
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Definitions
- the field of invention relates generally to imprint lithography. More particularly, the present invention is directed to reducing the time required to fill the features of a template with imprinting material during imprint lithography processes.
- Micro-fabrication involves the fabrication of very small structures, e.g., having features on the order of micro-meters or smaller. One area in which micro- fabrication has had a sizeable impact is in the processing of integrated circuits.
- micro-fabrication provides greater process control while allowing increased reduction of the minimum feature dimension of the structures formed.
- Other areas of development in which micro-fabrication has been employed include biotechnology, optical technology, mechanical systems and the like.
- An exemplary micro-f brication technique is shown in United States patent number 6,334,960 to Willson et al .
- Willson et al disclose a method of forming a relief image in a structure. The method includes providing a substrate having a transfer layer. The transfer layer is covered with a polymerizable fluid composition. A mold makes mechanical contact with the polymerizable fluid.
- the mold includes a relief structure, and the polymerizable fluid composition fills the relief structure.
- the polymerizable fluid composition is then subjected to conditions to solidify and to polymerize trie same, forming a solidified polymeric material on the transfer layer that contains a relief structure complimentary to that of the mold.
- the mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material.
- the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a. relief image is formed in the transfer layer.
- the time required and the minimum feature dimension provided by this technique are dependent upon, inter alia, the composition of the polymerizable material.
- the present invention is directed to a method for dispensing a plurality of spaced-apart droplets of liquid on a substrate that features minimizing the distance liquid in the droplets must travel to reach an adjacent droplet to form a contiguous lay of the liquid on the substrate.
- the time required to fill the features of the pattern and cover the substrate is minimized. This increases the throughput of the imprinting process.
- the method includes disposing a plurality of spaced-apart droplets on the substrate, each of which has a unit volume associated therewith.
- a spacing between adjacent droplets of a subset of the plurality of droplets is selected to be a function of a smallest unit volume associated with the subset. As a result, the distance between adjacent droplets is minimized and is merely dependent upon the resolution of droplet dispensing apparatus.
- a conductive template and of a method forming conductive templates that includes providing a substrate; forming a mesa on the substrate; and forming a plurality of recessions and projections on the mesa with a nadir of the recessions comprising electrically conductive material and the projections comprising electrically insulative material.
- the mesa be substantially transparent to a predetermined wavelength of radiation, for example ultraviolet radiation.
- indium tin oxide is a suitable material from which to form the electrical conductive material.
- indium tin oxide is difficult to pattern due to its resistance to etch. Nonetheless, the present method provides a manner in which to form a conductive template with indium oxide suitable for use in imprint lithography.
- FIG. 1 is a perspective view of a lithographic system in accordance with the present invention
- Fig. 2 is a simplified elevation view of a lithographic system shown in Fig. 1
- Fig. 3 is a simplified representation of material from which an imprinting layer, shown in Fig. 2, is comprised before being polymerized and cross-linked, ⁇
- Fig. 4 is a simplified representation of cross- linked polymer material into which the material shown in Fig. 3 is transformed after being subjected to radiation
- Fig. 5 is a simplified elevation view of a mold spaced-apart from the imprinting layer, shown in Fig.
- Fig. 6 is a top down view showing an array of droplets of imprinting material deposited upon a region of the substrate shown above in Fig. 2 in accordance with a first embodiment of the present invention
- Fig. 7 is a simplified schematic view of cantilevering impingement of a mold, shown in Fig. 2, impinging upon the array of droplets, shown in Fig. 6, in accordance with one embodiment of the present invention
- Figs. 8-11 are top down views showing the compression of droplets, shown above in Fig. 6, employing cantilevering impingement of mold, shown in Fig. 7; [0015] Fig.
- FIG. 12 is a bottom up view of a mold having individually addressable electrical conductors in accordance with an alternate embodiment of the present invention
- Fig. 13 is a side cross-sectional view of the template shown in Fig. 12
- Fig. 14 is a top down view of a substrate employed to fabricate the template shown in accordance with yet another embodiment of the present invention
- Fig. 15 is a side cross-sectional view of a region of the substrate, shown in Fig. 14, taken across lines 15-15;
- Figs. 16-23 are side cross-sectional views of the region shown in Fig. 15 demonstrating the various processes employed to fabricate the template shown in
- Fig. 24 is a top down view of the region shown in Fig. 6, with the droplets of imprinting material disposed in an array according to yet a fourth embodiment of the present invention
- Fig. 25 is a top down view showing the compression of droplets, shown above in Fig. 24, employing mold, shown in Fig. 2, in accordance with a fifth embodiment of the present invention
- Fig. 26 is a cross-sectional view of a template in accordance with a sixth embodiment of the present invention
- Fig. 27 is a top down view of a substrate employed to fabricate the template, shown in Fig. 26, in accordance with a seventh embodiment of the present invention
- Fig. 28 is a cross-sectional view of a region of the substrate shown in Fig. 27 taken along lines 28-
- Figs. 29-30 are cross-sectional views of the region shown in Fig. 28 demonstrating the various processes employed to fabricate the template shown in
- Fig. 1 depicts a lithographic system 10 in accordance with one embodiment of the present invention that includes a pair of spaced-apart bridge supports 12 having a bridge 14 and a stage support 16 extending therebetween. Bridge 14 and stage support 16 are spaced- apart. Coupled to bridge 14 is an imprint head 18, which extends from bridge 14 toward stage support 16 and provides movement along the Z-axis. Disposed upon stage support 16 to face imprint head 18 is a motion stage 20. Motion stage 20 is configured to move with respect to stage support 16 along X- and Y-axes.
- imprint head 18 may provide movement along the X- and Y-axes, as well as the Z-axis
- motion stage 20 may provide movement in the Z-axis, as well as the X- and Y-axes.
- An exemplary motion stage device is disclosed, in United States patent application number 10/194,414, filed July 11, 2002, entitled “Step and Repeat Imprint Lithography Systems,” assigned to the assignee of the present invention, and which is incorporated by reference herein in its entirety.
- a radiation source 22 is coupled to system 10 to impinge actinic radiation upon motion stage 20. As shown, radiation source 22 is coupled to bridge 14 and includes a power generator 23 connected to radiation source 22. Operation of system is typically controlled by a processor 25 that is in data communication therewith.
- Mold 28 includes a plurality of features defined by a plurality of spaced-apart recessions 28a and protrusions 28b.
- the plurality of features defines an original pattern that is to be transferred into a substrate 30 positioned on motion stage 20.
- imprint head 18 and/or motion stage 20 may vary a distance "d" between mold 28 and substrate 30.
- Radiation source 22 is located so that mold 28 is positioned between radiation source 22 and substrate 30.
- mold 28 is fabricated from material that allows it to be substantially transparent to the radiation produced by radiation source 22.
- mold 28 may be formed from materials that includes quartz, fused-silica, silicon, sapphire, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers or a combination thereof.
- Further template 26 may be formed from the aforementioned materials, as well as metal.
- a flowable region such as an imprinting layer 34, is disposed on a portion of surface 32 that presents a substantially planar profile.
- An exemplary flowable region consists of imprinting layer 34 being deposited as a plurality of spaced-apart discrete droplets 36 of material 36a on substrate 30, discussed more fully below.
- An exemplary system for depositing droplets 36 is disclosed in United States patent application number 10/191,749, filed July 9, 2002, entitled “System and Method for Dispensing Liquids," and which is assigned to the assignee of the present invention, and which is incorporated by reference herein in its entirety.
- Imprinting layer 34 is formed from a material 36a that may be selectively polymerized and cross-linked to record the original pattern therein, defining a recorded pattern.
- Material 36a is shown in Fig. 4 as being cross-linked at points 36b, forming cross-linked polymer material 36c.
- the pattern recorded in imprinting layer 34 is produced, in part, by mechanical contact with mold 28. To that end, distance “d” is reduced to allow imprinting droplets 36 to come into mechanical contact with mold 28, spreading droplets 36 so as to form imprinting layer 34 with a contiguous formation of material 36a over surface 32.
- distance “d” is reduced to allow sub-portions 34a of imprinting layer 34 to ingress into and to fill recessions 28a.
- material 36a is provided with the requisite properties to completely fill recessions 28a while covering surface 32 with a contiguous formation of material 36a.
- sub-portions 34b of imprinting layer 34 in superimposition with protrusions 28b remain after the desired, usually minimum, distance "d” , has been reached, leaving sub-portions 34a with a thickness t x and sub-portions 34b with a thickness t 2 - Thicknesses w t ⁇ " and "t" may be any thickness desired, dependent upon the application.
- t x is selected so as to be no greater than twice the width u of sub-portions 34a, i.e., ti ⁇ 2u, shown more clearly in Fig. 5.
- radiation source 22 produces actinic radiation that polymerizes and crosslinks material 36a, forming cross-linked polymer material 36c.
- the composition of imprinting layer 34 transforms from material 36a to cross-linked polymer material 36c, which is a solid.
- cross- linked polymer material 36c is solidified to provide side 34c of imprinting layer 34 with a shape conforming to a shape of a surface 28c of mold 28, shown more clearly in Fig. 5.
- imprint head 18, shown in Fig. 2 is moved to increase distance "d" so that mold 28 and imprinting layer 34 are spaced-apart .
- additional processing may be employed to complete trie patterning of substrate 30.
- substrate 30 and imprinting layer 34 may be etched to transfer the pattern of imprinting layer 34 into substrate 30, providing a patterned surface 34c.
- the material from which imprinting layer 34 is formed may be varied to define a relative etch rate with respect to substrate 30, as desired.
- the material from which imprinting layer 34 is formed may be varied to define a relative etch rate with respect to substrate 30, as desired.
- FIGs. 2, 3 and 6 for molds having very dense features, e.g., recessions 28a on the order of nanometers, spreading droplets 36 over a region 40 of substrate 30 in superimposition with mold 28 to fill the recessions 28a can require long periods of time, thereby slowing throughput of the imprinting process .
- droplets 36 are dispensed to minimize the time required to spread over substrate 30 and to fill recessions 28a.
- droplets 36 are dispensing droplets 36 as a two-dimensional matrix array 42 so that a spacing, shown as Si and S 2 , between adjacent droplets 36 is minimized.
- a spacing shown as Si and S 2
- droplets 36 of matrix array 42 area arranged in six columns n ⁇ - 6 and six rows m ⁇ -m 6 .
- droplets 36 may be arranged in virtually any two-dimensional arrangement on substrate 30. What is desired is maximizing the number of droplets 36 in matrix array 42, for a given total volume, V t , of imprinting material 36 necessary to form a desired patterned layer. This minimizes the spacing S x and S 2 between adjacent droplets.
- each of droplets 36 in the subset have substantially identical quantities of imprinting material 36a associated therewith, defined as a unit volume, V u
- V u the total number of droplets 36 in matrix array 42
- n n ⁇ xn 2 where i is that number of droplets along a first direction and n 2 is the number of droplets along a second direction
- template 26 is positioned so that surface 28c of mold 28 forms an oblique angle ⁇ with respect to substrate surface 30a of substrate 30, referred to as cantilevering impingement.
- An exemplary apparatus that facilitates formation of angle ⁇ is disclosed in United States patent application number 09/698,317, filed October 27, 2000 and entitled "High-Precision Orientation Alignment and Gap Control Stages for Imprint Lithography Processes," which is incorporated by reference in its entirety herein.
- mold 28 As a result of the cantilevering impingement of mold 28, as a distance between mold 28 and substrate 30 decreases, a sub-portion of mold 28 will come into contact with a sub- set of droplets 36 in matrix array 42 before the remaining portions of mold 28 contact the one edge of mold 28 contact the remaining droplets 36 of matrix array 42. As shown, mold 28 contacts all of droplets 36 associated with column n s , substantially concurrently. This causes droplets 36 to spread and to produce a contiguous liquid sheet 46 of imprinting material 36a extending from edge 40a of region 40 toward droplets in columns n ⁇ -n 5 . One edge of liquid sheet 46 defines a liquid-gas interface 46a that functions to push gases in volumes 44 away from edge 40a and toward edges 40b, 40c and 40d.
- Volumes 44 between droplets 36 in columns n ⁇ -n 5 define gas passages through which gas may be pushed to the portion of perimeter of region 40. In this manner, interface 46a in conjunction with the gas passages reduces, if not prevents, trapping of gases in liquid sheet 46. [0037] Referring to Figs . 7 and 9, as template 26 is moved toward substrate 30, rotation of mold 28 occurs to allow imprinting material 36a associated with subsequent subsets of droplets 36 in columns n 4 and n 5 to spread and to become included in contiguous fluid sheet 46.
- Template 26 continues to rotate so that mold 28 subsequently comes into contact with droplets 36 associated with columns n 2 and n 3 so that the imprinting material 36a associated therewith spreads to become included in contiguous sheet 46, shown in Fig. 10. The process continues until all droplets 36 are included in contiguous sheet 46, shown in Fig. 11. As can be seen, interface 46a has moved toward edge 40c so that there is an unimpeded path for the gases (not shown) in the remaining volume 44a of region 40 to travel thereto. This allows gases in volume 44as to egress from region 40 vis-a-vis edge 40c. In this manner, the trapping of gases in imprinting layer 34, shown in Fig. 5, having surface 34c is reduced, if not avoided.
- sequential spreading of droplets 36 in matrix array 42 column-by-column, as described with respect to Figs. 7-11 may be achieved without requiring cantilevering impingement of mold 28.
- This may be achieved by employing electromagnetic forces to move imprinting material 36a across region 40 and/or toward mold 128.
- mold 128 includes a plurality of individually addressable conductive elements, shown as qi-q ⁇ forming nadirs 118a of recessions 128a of mold 128.
- Sub-portions 118b of body 150 flanking sub-portions 118b are in superimposition with protrusions 128b and do not include any conductive material there.
- one manner in which to form a template includes obtaining a body 150 and identifying four regions 150a, 150b, 150c and 150d on which to form a template.
- body 150 consists of a standard 6025 fused silica.
- Four templates, shown as templates 126, 226, 326 and 426, are formed, concurrently, in four separate areas of body 150.
- fabrication of template 126 is discussed with the understanding that the discussion with respect to template 126 applies with equal weight to templates 226, 326 and 426.
- body 150 typically measures 152.4 mm on a side.
- Body 150 has a chrome layer 130 present on an' entire side 112 thereof.
- a photoresist 132 layer covers chrome layer 130.
- Photoresist layer 132 is patterned and developed away to expose a region 134 surrounding a central portion 136 of side 112. Central portion 136 typically has dimensions measuring 25 mm on a side. Typically, photoresist layer 132 is patterned employing a laser writer. After photoresist layer 132 has been developed away, chrome layer 130 in superimposition with region 134 is etched away using any suitable etching techniques, e.g., ammonium nitrate or plasma etch. In this manner, a portion of body 150 in superimposition with region 134 is exposed. Thereafter, suitable post etching processes may occur, e.g., an oven bake or other cleaning processes.
- suitable etching techniques e.g., ammonium nitrate or plasma etch.
- a suitable etching technique would involve a buffered oxide etch (BOE) . This occurs for a sufficient amount of time to provide a desired height, h, for mesa 133, as measured from surface 112 of body 150, shown in Fig. 18. An exemplary height is 15 microns. Thereafter, the remaining portion of photoresist layer 132 is removed and any remaining portions of chrome layer 130 on central portion 136 are removed. A layer of photoresist material 134 is deposited over template 126, shown in Fig. 19.
- BOE buffered oxide etch
- Regions of photoresist material 134 in superimposition with mesa 133 are patterned and developed away to expose regions 136 of body 150, using standard techniques, leaving patterned photoresist layer 138, shown in Fig. 20. Thereafter, a layer of indium tin oxide (ITO) 140 is deposited on template 126 to cover patterned photoresist layer 138, shown in Fig. 21.
- ITO is a suitable material for use with mold 128, because it is electrically conductive and substantially transparent to the wavelength of radiation produced by radiation source22, shown in Fig. 2.
- a lift-off process is employed to remove patterned photoresist layer 138, shown in Fig.
- a patterned ITO layer 142 with regions 144 of body 150 being exposed, is formed, shown in Fig. 22.
- a layer 146 of silicon oxide Si0 146 is deposited, shown in Fig. 23. This forms mold 128, with silicon oxide layer 146 being patterned so that silicon oxide is not in superimposition with ITO material in ITO layer 142 that is in superimposition with regions 144, shown in Fig. 13.
- the nadir of recessions 128a are formed from ITO, and protrusions 128b are formed from Si0 2 .
- protrusions 128a are formed from an electrically insulative material, it is realized that the electromagnetic field, EMi, proximate to recess 128a is greater than the electromagnetic field, EM 2 , that is proximate to protrusions 128b.
- voltage source 120 is in electrical communication with conductive elements q ⁇ -q using any suitable coupling technique known, shown in Fig. 12. In the present example, conductive elements qi-qe are formed to extend beyond mold 128 and voltage source 120 is connected thereto.
- droplets 136 and 236 may be arranged in virtually any matrix array. As shown, droplets 136 and 236 are arranged in two sets. The quantity of imprinting material 36a in each of droplets 136 is substantially identical, and the quantity of imprinting material 36a in each of droplets 236 is substantially identical. The quantity of imprinting material in each of droplets 236 is substantially greater than the quantity of imprinting material 36a in each of droplets 136.
- template 128 may be employed and conductive elements qi-q ⁇ may be activated sequentially, as discussed above, or concurrently.
- template 526 may be employed. Template 526 is formed from a body 550 of a suitable material, such as fused silica. An exemplary material is standard 6025 fused silica having measurements, on a side, of approximately 152.4 mm.
- body 550 has a chrome layer 530 present on an entire side 512 thereof.
- a mesa 533 is formed on body 550 in the manner discussed above with respect to Figs. 16-18.
- a layer of indium tin oxide (ITO) 534 is then deposited over the entire side 512 of body 550 using standard techniques, shown in Fig. 30.
- ITO indium tin oxide
- Deposited atop of the ITO layer 534 is a silicon oxide layer Si0 2 that is patterned and etched employing standard techniques to form recessions 528a and protrusions 528b, shown in Fig. 26. In this manner, the nadir of recessions 128a are formed from ITO and protrusions 528b are formed from ITO. Understanding that protrusions 528a are formed from an electrically insulative material, it is realized that the electromagnetic field, EMi, proximate to recess 528a is greater than the electromagnetic field, EM 2 , which is proximate to protrusions 528b.
- imprinting material 36a proximate to mold 528 is more likely to be drawn into recessions 528a, thereby reducing the time required to conform material 36a to mold 528.
- the embodiments of the present invention described above are exemplary. Many changes and modifications may be made to the disclosure recited above, while remaining within the scope of the invention.
- the use of electromagnetic filed may prove beneficial in ensuring that imprint material fully fill the features on the mold, thereby avoiding discontinuities in the imprinting layer. Such discontinuities occur when imprinting material fails to fill the recessions of the mold. This may be due to various environment and material based parameters, such as capillary attraction between a protrusion and a surface in superimposition therewith. Applying an electromagnetic ield to attract imprinting material to the mold will overcome these properties. Therefore, the scope of the invention should not be limited by the above description, but instead should be determined with reference to the appended claims along with their full scope of equivalents.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04818716A EP1682340A2 (en) | 2003-11-12 | 2004-11-05 | Dispense geometry and conductive template to achieve high-speed filling and throughput |
JP2006539967A JP2007516862A (en) | 2003-11-12 | 2004-11-05 | Distributing geometry and conductive templates for fast filling and throughput |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/706,537 | 2003-11-12 | ||
US10/706,537 US20050098534A1 (en) | 2003-11-12 | 2003-11-12 | Formation of conductive templates employing indium tin oxide |
US10/714,088 US20050106321A1 (en) | 2003-11-14 | 2003-11-14 | Dispense geometery to achieve high-speed filling and throughput |
US10/714,088 | 2003-11-14 |
Publications (2)
Publication Number | Publication Date |
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WO2005047975A2 true WO2005047975A2 (en) | 2005-05-26 |
WO2005047975A3 WO2005047975A3 (en) | 2006-02-02 |
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PCT/US2004/038088 WO2005047975A2 (en) | 2003-11-12 | 2004-11-05 | Dispense geometry and conductive template to achieve high-speed filling and throughput |
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EP (1) | EP1682340A2 (en) |
JP (1) | JP2007516862A (en) |
KR (1) | KR20060126967A (en) |
TW (1) | TWI292347B (en) |
WO (1) | WO2005047975A2 (en) |
Cited By (4)
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CN100435979C (en) * | 2005-06-24 | 2008-11-26 | 精工爱普生株式会社 | Droplet discharge method, electro-optical device, and electronic device |
WO2011108750A1 (en) * | 2010-03-03 | 2011-09-09 | Fujifilm Corporation | Pattern transfer method and apparatus |
US8609006B2 (en) | 2009-08-31 | 2013-12-17 | Fujifilm Corporation | Pattern transfer apparatus and pattern forming method |
US8696969B2 (en) | 2009-02-04 | 2014-04-15 | Asml Netherlands B.V. | Imprint lithography method and apparatus |
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US8707890B2 (en) * | 2006-07-18 | 2014-04-29 | Asml Netherlands B.V. | Imprint lithography |
US8142702B2 (en) * | 2007-06-18 | 2012-03-27 | Molecular Imprints, Inc. | Solvent-assisted layer formation for imprint lithography |
US20090212012A1 (en) * | 2008-02-27 | 2009-08-27 | Molecular Imprints, Inc. | Critical dimension control during template formation |
JP5289006B2 (en) * | 2008-11-19 | 2013-09-11 | 株式会社東芝 | Pattern forming method and program |
JP5377053B2 (en) * | 2009-04-17 | 2013-12-25 | 株式会社東芝 | Template, manufacturing method thereof, and pattern forming method |
JP5281989B2 (en) * | 2009-08-26 | 2013-09-04 | 富士フイルム株式会社 | Pattern transfer apparatus and pattern forming method |
JP5296641B2 (en) * | 2009-09-02 | 2013-09-25 | 東京エレクトロン株式会社 | IMPRINT METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, AND IMPRINT DEVICE |
JP5460541B2 (en) * | 2010-03-30 | 2014-04-02 | 富士フイルム株式会社 | Nanoimprint method, droplet arrangement pattern creation method, and substrate processing method |
JP5983218B2 (en) * | 2012-09-11 | 2016-08-31 | 大日本印刷株式会社 | Method for producing template for nanoimprint lithography |
JP6540089B2 (en) * | 2015-02-25 | 2019-07-10 | 大日本印刷株式会社 | Pattern forming method, pattern forming apparatus and program for pattern formation |
US11556055B2 (en) * | 2020-06-19 | 2023-01-17 | Canon Kabushiki Kaisha | Systems and methods for generating drop patterns |
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- 2004-11-05 KR KR1020067009140A patent/KR20060126967A/en not_active Application Discontinuation
- 2004-11-05 JP JP2006539967A patent/JP2007516862A/en active Pending
- 2004-11-05 EP EP04818716A patent/EP1682340A2/en not_active Withdrawn
- 2004-11-05 WO PCT/US2004/038088 patent/WO2005047975A2/en active Application Filing
- 2004-11-11 TW TW093134440A patent/TWI292347B/en active
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US8696969B2 (en) | 2009-02-04 | 2014-04-15 | Asml Netherlands B.V. | Imprint lithography method and apparatus |
US8609006B2 (en) | 2009-08-31 | 2013-12-17 | Fujifilm Corporation | Pattern transfer apparatus and pattern forming method |
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US9176376B2 (en) | 2010-03-03 | 2015-11-03 | Fujifilm Corporation | Pattern transfer method and apparatus |
Also Published As
Publication number | Publication date |
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EP1682340A2 (en) | 2006-07-26 |
TWI292347B (en) | 2008-01-11 |
TW200523040A (en) | 2005-07-16 |
WO2005047975A3 (en) | 2006-02-02 |
KR20060126967A (en) | 2006-12-11 |
JP2007516862A (en) | 2007-06-28 |
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