Images

Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
  • H01Q9/04—Resonant antennas
  • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
  • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
  • H01Q9/285—Planar dipole
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/12—Supports; Mounting means
  • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
  • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
  • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
  • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Definitions

• the present invention relates to wireless IC devices, and, in particular, to a wireless IC device used in an RFID (Radio Frequency Identification) system.
• RFID Radio Frequency Identification
• RFID systems have been developed as an article management system in which communication is established in a non-contact manner between a reader/writer that generates an induction field and an IC tag (hereinafter referred to as a wireless IC device) which is affixed to an article and which stores predetermined information, whereby information is exchanged.
• a wireless IC device used in an RFID system is described in “Musen IC Tagu Katsuyo-no Subete” (“All About Wireless IC Tags”), Nikkei BP Mukku-sha, pp. 112-126.
• a wireless IC device of the above-described type includes a wireless IC chip mounted on a strap substrate, and the strap substrate is connected to an antenna substrate.
• the wireless IC chip and the strap substrate are directly electrically connected to each other by an Au bump, and the strap substrate and the antenna substrate are directly, electrically connected to each other.
• the wireless IC device since, in the wireless IC device, a center frequency and impedance are set on an antenna side, in order for the device to be matched to a plurality of frequencies and impedances, it is necessary to provide separate antennas for the individual frequencies and impedances. Accordingly, the wireless IC device is not suitable for limited production of diversified products.
• the strap substrate and the antenna substrate are directly electrically connected to each other, a heating step is required.
• materials which can be used for the antenna substrate are limited to heat resistant materials.
• the center frequency and impedance are changed. In particular, in frequency bands greater than the UHF band, even a minute change causes changes to the center frequency and the impedance. Thus, extremely high precision is required when manufacturing the wireless IC device.
• preferred embodiments of the present invention provide a wireless IC device in which a frequency characteristic and an impedance can be determined without depending on an antenna and whose production is made easier.
• a preferred embodiment of the present invention provides a wireless IC device having a flexible sheet provided with a wireless IC chip and radiation plates, wherein the wireless IC chip is connected to a feeder circuit which is provided on the sheet and which has a predetermined resonant frequency and a predetermined impedance, and wherein the feeder circuit and the radiation plates are coupled to each other.
• the radiation plates have a function of radiating a transmitting signal supplied from the feeder circuit and a function of receiving and supplying a received signal to the feeder circuit. Transmission to and reception from the wireless IC chip is performed by the feeder circuit.
• the frequency of the transmitting signal radiated from the radiation plates and the frequency of the received signal supplied to the wireless IC chip are substantially determined by a resonant frequency of the feeder circuit. In other words, a center frequency is determined by the feeder circuit, regardless of the shape or configuration of the radiation plates.
• a center frequency is determined by the feeder circuit, regardless of the shape or configuration of the radiation plates.
• a cutout arranged to adjust the resonant frequency and the impedance is preferably provided in an electrode pattern of the feeder circuit.
• the resonant frequency and the impedance can be easily adjusted.
• by forming the radiation plates with flexible metal films on the sheet handling of the wireless IC device is facilitated.
• the wireless IC chip and the feeder circuit may be provided on a first main surface of the sheet, and the radiation plates may be provided on a second main surface opposite to the first main surface.
• the feeder circuit and the radiation plates may be capacitively coupled with each other through the sheet.
• a single sheet may be used for the wireless IC device, and the existence of a capacitor improves anti-surge functionality.
• a surge can be reduced by a capacitor since it is a current having a low frequency up to about 200 MHz, so that the wireless IC chip is prevented from being damaged or destroyed due to a surge.
• the wireless IC chip and the feeder circuit may be disposed on a first main surface of a flexible first sheet, and the radiation plates may be disposed on a first main surface of a flexible second sheet.
• the sheets may be bonded to each other so that the first main surfaces of the sheets oppose each other, and the feeder circuit and the radiation plates may be coupled with each other.
• the feeder circuit and the radiation plates may be directly electrically coupled to each other or may be capacitively coupled through an adhesive layer. Since the wireless IC chip, the feeder circuit, and the radiation plates are coated with two sheets, these members are protected from the outside air and, for example, moisture.
• capacitive coupling the coupling does not require a heating step, and sheet materials can be selected without regard to the heat resistance of the materials.
• the wireless IC chip and the feeder circuit may be provided on a first main surface of a flexible first sheet
• the radiation plates may be provided on a first main surface of a flexible second sheet.
• the sheets may be bonded to each other so that the first main surface of the first sheet and a second main surface opposite to the first main surface of the second sheet oppose each other, and the feeder circuit and the radiation plates may be capacitively coupled with each other by the second sheet. In this case, the coupling does not require a heating step.
• a frequency characteristic and impedance are determined by a feeder circuit without depending on radiation plates for signal transmission to and reception from the exterior.
• various types of frequencies and impedances can be utilized, which is suitable for diversified production.
• high precision is not required when connecting the feeder circuit and the radiation plates.
• production is facilitated, which is particularly advantageous in producing a wireless IC device used in frequencies greater than the UHF band.
• FIGS. 1A and 1B are exploded perspective views showing a first preferred embodiment of a wireless IC device according to the present invention; wherein FIG. 1A shows a back surface and FIG. 1B shows a front surface.
• FIG. 2 is a sectional view showing the first preferred embodiment of the present invention.
• FIG. 3 is an exploded perspective view showing first and second sheets included in second, third, and fourth preferred embodiments of the wireless IC device according to the present invention.
• FIGS. 4A and 4B show a second preferred embodiment of the present invention; wherein FIG. 4A is a sectional view of a state before bonding, and FIG. 4B is a sectional view of a state after bonding.
• FIGS. 5A and 5B show a third preferred embodiment of the present invention; wherein FIG. 5A is a sectional view of a state before bonding, and FIG. 5B is a sectional view of a state after bonding.
• FIGS. 6A and 6B show a fourth preferred embodiment of the present invention; wherein FIG. 6A is a sectional view of a state before bonding, and FIG. 6B is a sectional view of a state after bonding.
• a wireless IC device 1 a that is a first preferred embodiment is configured such that, as shown in FIG. 1A , radiation plates 11 are formed of a thin metal film, such as a flexible aluminum foil or metal deposition film on a second main surface (back surface) 10 b of a flexible dielectric sheet 10 (for example, a resin film such as PET, or paper), and, as shown in FIG. 1B , a feeder circuit 15 is provided on a first main surface (front surface) 10 a .
• a wireless IC chip 5 is mounted on the feeder circuit 15 .
• FIG. 1B shows an enlarged view of the feeder circuit 15 on which the wireless IC chip 5 is mounted.
• the wireless IC chip 5 is a known device which includes a clock circuit, a logic circuit, and a memory circuit, and which stores necessary information.
• the wireless IC chip 5 transmits and receives predetermined high frequency signals.
• Terminal electrodes of the wireless IC chip 5 are electrically connected to electrode patterns 15 a and 15 b of the feeder circuit 15 via Au bumps 6 (see FIG. 2 ), with the electrodes disposed above the electrodes patterns 15 a and 15 b .
• the electrical connection may be provided by solder or by a conductive adhesive other than the Au bumps 6 .
• the feeder circuit 15 is also formed of a metal thin film, such as flexible aluminum foil or metal deposition film. Ends 16 of the electrode patterns 15 a and 15 b oppose ends 12 of the radiation plates 11 , with the sheet 10 disposed therebetween, whereby capacitive coupling is established.
• the wireless IC device 1 a uses the radiation plates 11 to receive a high frequency signal (for example, the UHF frequency band) radiated from a reader/writer (not shown), causes the feeder circuit 15 capacitively coupled with the radiation plates 11 to resonate, and supplies energy to the wireless IC chip 5 .
• the wireless IC device 1 a extracts predetermined energy from the received signal, and in the feeder circuit 15 , matches the information stored in the wireless IC chip 5 with a predetermined frequency by using the energy as a drive source. After that, a transmitting signal is conveyed to the radiation plates 11 through the capacitive coupling, and the signal is transmitted and transferred from the radiation plates 11 to the reader/writer.
• the feeder circuit 15 has a predetermined resonant frequency and a predetermined impedance.
• the resonant frequency and the impedance are adjusted by changing the depths and/or widths of cutouts 17 provided in the electrode patterns 15 a and 15 b .
• the impedance is increased.
• an inductance increases and a center frequency (fo) decreases.
• Such adjustment is performed by trimming the electrode patterns 15 a and 15 b with a laser or other suitable cutting method.
• the resonant frequency can be finely adjusted to about 868 MHz, about 915 MHz, about 953 MHz, and other desired frequencies.
• the frequency of the transmitting signal radiated from the radiation plates 11 , and the frequency of the received signal supplied to the wireless IC chip 5 are substantially determined by the resonant frequency of the feeder circuit 15 .
• the center frequency is determined by the feeder circuit 15 regardless of the shape or configuration of the radiation plates 11 .
• capacitive coupling between the radiation plates 11 and the feeder circuit 15 improves anti-surge functionality. Since a surge is a current having a low frequency up to about 200 MHz, the surge can be prevented by a capacitor, and the wireless IC chip 5 can be prevented from being broken due to a surge. In addition, since the radiation plates 11 and the feeder circuit 15 are capacitively coupled, a heating step is not required to couple the radiation plates 11 with the feeder circuit 15 . Accordingly, various types of materials can be used for the sheet 10 without regard to the heat resistance of the material.
• an electrical length of each of the radiation plates 11 is about 1 ⁇ 4 of resonant frequency ⁇ , and the radiation plates 11 have a total of about 1 ⁇ 2 of resonant frequency ⁇ .
• the electrical length of the radiation plates 11 is not necessarily an integer multiple of ⁇ /2.
• the frequency of the signal radiated from the radiation plates 11 is substantially determined by the resonant frequency of the feeder circuit 15 .
• a frequency characteristic is not dependent on the electrical length of the radiation plates 11 .
• the electrical length of the radiation plates 11 is an integer multiple of ⁇ /2 so as to maximize the gain. This point also preferably applies to second, third, and fourth preferred embodiments, which are described below.
• each of second, third, and fourth preferred embodiments is formed by bonding two sheets 21 and 22 made of a flexible dielectric or insulator.
• a feeder circuit 15 is formed with a metal thin film, such as flexible aluminum foil or metal deposition film.
• a wireless IC chip 5 is mounted on the feeder circuit 15 .
• radiation plates having relatively large areas are formed with a metal thin film, such as flexible aluminum foil or metal deposition film.
• the feeder circuit 15 has substantially the same configuration as the feeder circuit 15 shown in the first preferred embodiment.
• the wireless IC chip 5 is electrically connected to two electrode patterns 15 a and 15 b , with the wireless IC chip 5 disposed above the electrode patterns 15 a and 15 b .
• the feeder circuit 15 has a predetermined resonant frequency and a predetermined impedance. As in the first preferred embodiment, the resonant frequency and the impedance are adjusted by changing the depths and/or widths of cutouts
• the first sheet 21 and the second sheet 22 are bonded to each other by heat bonding so that a first main surface 21 a and a first main surface 22 a oppose each other. Ends 16 of the feeder circuit 15 and ends 26 of the radiation plates 25 are directly, electrically coupled.
• the wireless IC device 1 b includes radiation plates 25 to receive a high frequency signal (for example, the UHF frequency band) radiated from a reader/writer (not shown), causes the feeder circuit 15 , which is directly and electrically coupled with the radiation plates 25 , to resonate, and supplies energy to the wireless IC chip 5 .
• the wireless IC device 1 b extracts predetermined energy from the received signal, and in the feeder circuit 15 , matches information stored in the wireless IC chip 5 with a predetermined frequency by using the energy as a drive source. Subsequently, a transmitting signal is conveyed to the radiation plates 25 through the direct, electrical coupling, and the signal is transmitted and transferred from the radiation plates 25 to the reader/writer.
• the operation and advantages of the wireless IC device 1 b according to the second preferred embodiment are similar to those of the wireless IC device 1 a according to the first preferred embodiment.
• the wireless IC chip 5 , the feeder circuit 15 , and the radiation plates 25 are coated with two sheets 21 and 22 .
• the wireless IC chip 5 , the feeder circuit 15 , and the radiation plates 25 are protected from the outside air, which includes moisture. In other words, rust or other corrosion does not occur in the feeder circuit 15 and the radiation plates 25 , disengagement of the wireless IC chip 5 is effectively prevented.
• connected portions between the ends 16 of the feeder circuit 15 and the ends 26 of the radiation plates 25 will not shift even if they are not fixed to one another.
• second main surfaces 21 b and 22 b opposite to the first main surfaces 21 a and 22 a of the sheets 21 and 22 necessary information (for example, advertisement information or a bar code) can be printed.
• the first sheet 21 and the second sheet 22 are bonded to each other through an adhesive layer 29 so that a first main surface 21 a and a first main surface 22 a oppose each other.
• Ends 16 of the feeder circuit 15 and ends 26 of radiation plates 25 are capacitively coupled with each other through an adhesive layer 29 so as to oppose each other.
• the wireless IC device 1 c uses radiation plates 25 to receive a high frequency signal (for example, the UHF frequency band) radiated from a reader/writer (not shown), causes the feeder circuit 15 capacitively coupled with the radiation plates 25 to resonate, and supplies energy to the wireless IC chip 5 .
• the wireless IC device 1 c extracts predetermined energy from the received signal, and in the feeder circuit 15 , matches information stored in the wireless IC chip 5 with a predetermined frequency by using the energy as a drive source. After that, a transmitting signal is conveyed to the radiation plates 25 through the capacitive coupling, and the signal is transmitted and transferred from the radiation plates 25 to the reader/writer.
• the operation and advantages of the wireless IC device 1 c according to the third preferred embodiment are similar to those of the wireless IC device 1 a according to the first preferred embodiment.
• the advantages of a construction in which the wireless IC chip 5 , the feeder circuit 15 , and the radiation plates 25 are coated with two sheets 21 and 22 are similar to that of the wireless IC device 1 b according to the second preferred embodiment.
• a first sheet 21 and a second sheet 22 are bonded to each other by heat bonding so that a first main surface 21 a and a second main surface 22 b oppose each other. Ends 16 of the feeder circuit 15 and ends 26 of radiation plates 25 are capacitively coupled to each other with the second sheet 22 provided therebetween.
• the wireless IC device 1 d uses the radiation plates 25 to receive a high frequency signal (for example, the UHF frequency band) radiated from a reader/writer (not shown), causes the feeder circuit 15 capacitively coupled with the radiation plates 25 to resonate, and supplies energy to the wireless IC chip 5 .
• the wireless IC device 1 d extracts predetermined energy from the received signal, and in the feeder circuit 15 , matches information stored in the wireless IC chip 5 with a predetermined frequency by using the energy as a drive source. After that, a transmitting signal is conveyed to the radiation plates 25 through the capacitive coupling, and the signal is transmitted and transferred from the radiation plates 25 to the reader/writer.
• the operation and advantages of the wireless IC device 1 d according to the fourth preferred embodiment are similar to those of the wireless IC device 1 a according to the first preferred embodiment.
• the advantages of a construction in which the wireless IC chip 5 , the feeder circuit 15 , and the radiation plates 25 are coated with two sheets 21 and 22 are similar to that of the wireless IC device 1 b according to the second preferred embodiment.
• the wireless IC device according to the present invention is not limited to the above-described preferred embodiments, and can be variously modified within the scope of the present invention.
• wireless IC chip 5 For example, a detailed construction of the wireless IC chip 5 is optional, and specific shapes of the feeder circuit 15 , and the radiation plates 11 and 25 are optional.
• the present invention is useful in a wireless IC device used in an RFID system.
• it is superior in determining a frequency characteristic and impedance without depending on an antenna and in ease of production.

Abstract

Description

Claims (9)

Applications Claiming Priority (3)

Related Parent Applications (1)

Publications (2)

Family

ID=38609118

Family Applications (1)

Country Status (5)

Cited By (9)

Families Citing this family (113)

Citations (85)

Family Cites Families (9)

• 2007
  • 2007-03-02 JP JP2008510752A patent/JP4572983B2/en active Active
  • 2007-03-02 WO PCT/JP2007/054051 patent/WO2007119304A1/en active Application Filing
  • 2007-03-02 CN CN2007800009470A patent/CN101346852B/en active Active
  • 2007-03-02 EP EP07715145.4A patent/EP2009736B1/en active Active
• 2008
  • 2008-01-29 JP JP2008017051A patent/JP4321657B2/en active Active
  • 2008-03-05 US US12/042,399 patent/US7518558B2/en active Active

Patent Citations (101)

Non-Patent Citations (27)

Also Published As

Similar Documents

Legal Events