US5991163A - Electronic circuit board assembly and method of closely stacking boards and cooling the same - Google Patents

Electronic circuit board assembly and method of closely stacking boards and cooling the same Download PDF

Info

Publication number
US5991163A
US5991163A US09/190,521 US19052198A US5991163A US 5991163 A US5991163 A US 5991163A US 19052198 A US19052198 A US 19052198A US 5991163 A US5991163 A US 5991163A
Authority
US
United States
Prior art keywords
boards
frame
high speed
terminals
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US09/190,521
Inventor
Peter Marconi
Theodore W. Bilodeau
Michael John Rigby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nexabit Networks Inc
WSOU Investments LLC
Original Assignee
Nexabit Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexabit Networks Inc filed Critical Nexabit Networks Inc
Priority to US09/190,521 priority Critical patent/US5991163A/en
Assigned to NEXABIT NETWORKS, INC. reassignment NEXABIT NETWORKS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BILODEAU, THEODORE W., MARCONI, PETER, RIGBY, MICHAEL J.
Priority to CA002350135A priority patent/CA2350135A1/en
Priority to PCT/IB1999/001781 priority patent/WO2000030421A1/en
Priority to EP99952737A priority patent/EP1166607A1/en
Priority to AU64831/99A priority patent/AU6483199A/en
Publication of US5991163A publication Critical patent/US5991163A/en
Application granted granted Critical
Assigned to OMEGA CREDIT OPPORTUNITIES MASTER FUND, LP reassignment OMEGA CREDIT OPPORTUNITIES MASTER FUND, LP SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WSOU INVESTMENTS, LLC
Assigned to WSOU INVESTMENTS, LLC reassignment WSOU INVESTMENTS, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ALCATEL LUCENT
Anticipated expiration legal-status Critical
Assigned to WSOU INVESTMENTS, LLC reassignment WSOU INVESTMENTS, LLC RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: OCO OPPORTUNITIES MASTER FUND, L.P. (F/K/A OMEGA CREDIT OPPORTUNITIES MASTER FUND LP
Assigned to OT WSOU TERRIER HOLDINGS, LLC reassignment OT WSOU TERRIER HOLDINGS, LLC SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WSOU INVESTMENTS, LLC
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185Mounting of expansion boards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184Mounting of motherboards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1429Housings for circuits carrying a CPU and adapted to receive expansion cards

Definitions

  • the present invention relates to electronic circuit board mounting assemblies and techniques for closely stacking pluralities of such boards in relatively confined frames and housings; being more particularly directed to methods of packaging a significant number of high power, high frequency, very sensitive, large circuit boards into a confined width chassis and effectively cooling, managing electromagnetic radiation, and providing quiescent signal planes for high speed communication paths.
  • the electronic circuit board assembly mounting art is replete with varied mechanical layouts and techniques for permitting the insertion or plug-in and removal of pluralities of stacks of electronic boards or cards within confined frames, cages and housings.
  • this space should be as large as possible.
  • all boards may be vertically mounted and with high densities in standard width enclosures; all airflow is strictly vertical, a low impedance airflow path is maintained; and a power distribution scheme is used to separate high current noisy supply voltages from low voltage sensitive interface logic, and with tight electromagnetic radiation containment.
  • a primary object of the invention accordingly, is to provide a new and improved method of assembling and a novel mounting assembly for, closely positioned pluralities of similar electronic circuit boards containing high speed, sensitive interconnect circuits and also requiring large power supply currents, and that are not subject to the above-described and other disadvantages of prior art constructions, but that, to the contrary, enable high packing densities with all vertical board mounting and air cooling, and with isolated quiescent zones for the high speed interconnect circuits.
  • a further object is to provide in such a novel assembly, a low impedance airflow design along with a superior electromagnetic radiation suppression technique.
  • the invention embraces a method of assembling closely positioned pluralities of similar electronic circuit boards (I/O or memory, for example) provided with powering terminals and requiring high speed communication (such as switching or other logic interfacing as later more fully described) between said circuit boards and adapted for substantially uniform cooling of the closely positioned boards.
  • I/O electronic circuit boards
  • memory for example
  • the method comprises, parallely stacking an upper set of similar spaced groups of closely spaced boards in an upper section of a frame with an intermediate space provided between the groups, and with the powering terminals aligned near the upper edges of the boards, and terminals provided for high speed interfacing near the lower edges of the boards; parallely stacking a lower set of similar spaced groups of closely spaced boards in a lower section of the frame with a similar intermediate space provided between the groups, and with the powering terminals of the boards aligned near the lower edges of the boards, and terminals provided for high speed logic interfacing, aligned near the upper edges of the boards facing the high speed interfacing terminals of the lower edges of the boards of the upper groups of boards; mounting a power backplane to support the set of groups of upper section boards and extending across the upper section of the frame, and mounting a similar power backplane to support the set of groups of the lower section boards and extending across the lower section of the frame; and positioning a plurality of parallel closely spaced high speed logic boards (such as a switching
  • the resulting preferred assembly thus comprises a card cage system containing circuit boards that is divided into four equal-size outer quadrants surrounding a center column. Boards installed in the center column are substantially larger. All boards installed in the upper two outer quadrants and the upper half of the central column are installed upwards, and all similar boards installed in the lower two outer quadrants and the lower half of the central column are installed upside down, rotated 180°. All boards have their power terminals located in the same position (their outer edges), with the power terminals at the top for the upper boards and at the bottom for the lower boards.
  • All boards have their high speed interfaces at the inner edges of the board such that all high speed interfaces with the logic boards are placed in the center of the card cage where the high speed logic boards (switch fabric or CPU) are located such that all high speed inter-board communication occurs in a very small area.
  • Backplanes that span the upper and lower halves of the card cage are comprised of three separate printed circuit boards (PCBs) stacked one on top of the other and mounted to a frame which makes them appear to be boards as one uniform backplane.
  • the top and bottom backplanes are identical with the bottom rotated 180° from the top.
  • the top and bottom backplanes distribute power only and contain no logic signals.
  • the center backplane, which carries all logic signals, contains no power distribution voltages, only logic signals.
  • Each one of these two different PCBs can be optimized for the function it must perform.
  • FIG. 1A of which is a diagrammatic view of the board placement in accordance with the principles of the invention
  • FIGS. 1B and 1C are isometric views of a mounting assembly embodying the technique of the invention in the preferred form of the format of FIG. 1A;
  • FIG. 2 is an isometric view upon an enlarged scale of a preferred mounting channel structure particularly useful in the assembly of FIGS. 1B and C.
  • an electronic circuit board assembly is shown, as in the before-mentioned standard 19-inch or other card cage frame or housing G, holding closely positioned pluralities, for example, of similar electronic I/O (or memory) boards C 1 , C 2 , etc. containing high speed signal circuits and provided with powering terminals; and, in the illustrative and preferred application of the present invention, requiring high speed switching amongst the I/O terminals of the boards as, for example, for the type of internally cached multiple DRAM switching systems described in Mukesh Chatter U.S. Pat. No. 5,799,209, issued Aug. 25, 1998, and the corresponding foreign counterpart of which appears in PCT publication-WO97/24725.
  • Front-to-rear mounting slots or channels M shown in FIGS. 1B and 1C as extending transversely within the frame, receive the boards in vertical parallel stacks--an upper set of similar spaced groups C 1 and C 2 of closely spaced boards in an upper section of the frame (mounted in the left quadrant and in the right quadrant, respectively), and with an intermediate central column space S provided between the groups C 1 and C 2 .
  • Powering terminals E are shown aligned near the upper edges of the boards C 1 and C 2
  • lower edge terminals T are provided for high-speed switching interfacing connection over the later-described main backplane F, with central logic boards here shown as a switching fabric comprising vertical logic boards D, disposed in the central space S between the boards C 1 and C 2 .
  • similar mounting slots or channels M' FIG. 1B, hold a lower set of similar vertical spaced quadrant groups C 1 ' and C 2 ' of closely spaced boards, with a similar intermediate central space S' provided between the groups C 1 ' and C 2 '.
  • the powering terminals E' for these groups of boards are aligned near the lower edges of the lower set of boards C 1 ' and C 2 ' and terminals T' for interfacing connection with the switching fabric are provided near the upper edges of the boards, 180° oppositely to the mounting of the upper sets of boards C 1 and C 2 , and facing the switching terminals T of the lower edges of the boards of the upper groups of boards.
  • This assembly permits all of the high-speed switching signals to the upper and lower groups of I/O memory boards to end up next to each other and right at the switch fabric boards D (or, in other applications, CPU or other logic) in the area between interfacing connector terminals T and T'.
  • An upper power backing plane P is horizontally mounted to provide board plug-in power connection and to support the lateral edges of the set of groups C 1 , and C 2 of the upper section boards and extends across the upper section of the frame, FIGS. 1B and 1C. This is the zone where the relatively heavy currents are being circulated (for example, driven by -48 volts at the power terminals E).
  • a similar power backing plane P' is symmetrically mounted to support and power the set of groups C 1 ' and C 2 ' of the lower section boards and also extends horizontally across the lower section of the frame.
  • These high power backplanes P and P' may be constructed, for example, of copper-clad fiberglass (FR4) and support the high power high current requirements of the operation of the I/O board system.
  • the main backplane F between the upper and lower backplanes P and P' is where all the high speed interconnect circuits are routed through interfacing terminals T and T'. Not only is there high-speed communication between I/O boards in the quadrants and the switch fabric modules in the center, but also between the I/O boards themselves.
  • the parallel closely spaced logic switching boards D comprising the switching fabric, thus, are centrally mounted in the frame and extend in the space S, between the groups of boards of the upper and lower section sets of boards, and with the backplane F extending horizontally intermediately of the frame between the upper and lower section backplanes P and P' and isolatively separate therefrom to provide such no-power quiescent zone for high speed interconnect signals, such as those of the switching fabric boards (or, in other applications, CPU or the like).
  • the switch fabric boards D are shown occupying the upper space S, and terminating at their terminal connections at the main backplane F for connection with the interfacing terminals T, T' of the sets of boards C 1 , C 1 ', C 2 , C 2 '.
  • Substantially symmetrical plug-in connections are provided from the lower edge switching terminals T of the upper section boards C 1 and C 2 and from the upper edge switching terminals fabric board T' of the lower section boards C 1 and C 2 to the switching fabric boards D along the backplane F.
  • the three backplanes P, P' and F are preferably mounted into a metal frame G, as with precision-drilled location holes which then locate all of these backplanes very precisely and make them appear to simulate one continuous physical single backplane to all the board cards that are plugging in.
  • the switching fabric boards D connected with the backplane F are shown positioned for their interfacing terminals to be in line respectively with, though between, the interfacing terminals T, T' of the upper and lower section boards, remote from the regions of the board power terminals E and E' at backplanes P and P'.
  • the power terminals E, E' used on the power backplanes P and P' are sturdy rugged conventional heavy-duty, heavy current power connectors; whereas the terminals T and T' used to plug into the F backplane, are very delicate high-density connectors.
  • the novel construction of the invention permits the cooling in the system to be provided, all from the bottom to the top of the frame, and all unidirectionally vertically. Since no horizontal boards are used, no convection problems are present, and there are no issues with thermal heat rising off of one board and heating the successive boards above it. With the cooling air going straight up through the frame so that all air horsepower is utilized in cooling the boards, an optimized relatively small blower system may be used, even in a 19-inch rack.
  • an open egg-crate type of metal grill lid is provided over the top exhaust of the frame or housing at L and also at the air inlet at L'.
  • This not only allows for optimum unimpeded or low-impedance uniform flow of air in-line from the bottom through the top along the surfaces of the board cards, but the square or rectangular or other cell openings of the metal grill L, L' may be dimensioned relative to the wavelength of the principal electromagnetic radiation frequencies generated by the high speed switching, to serve as electromagnetic wave-guide cut-off attenuators, trapping or attenuating the radiation within the frame.
  • a cross-dimension of square grill wave-guide-like cells 1/2 inch on the side and 1/2 inch deep, will provide about 23 to 24 dB at the 12 GHz cut off frequency, and on the order of about 27 dB at frequencies well below 12 GHz.
  • the mounting slots or channels M, M' may preferably be formed of inexpensive substantially U-shaped structures as shown in FIG. 2.
  • a metal sheet is there shown folded, with the upper portion 1 of one side (right) serving as one wall of the U-shaped channel, juxtaposed against the lower portion 2 of the other side (left) of the folded sheet.
  • the other side 2 is then bent transversely at 2' to form the bottom of the U channel, along which the board cards are inserted and board cards are inserted and withdrawn, and then the sheet is bent upwardly at 2", parallel to the upper portion 1, to serve as the opposite wall of the U-shaped channel.
  • Transverse supports 3 are shown provided between adjacent channels.

Abstract

An electronic circuit board assembly and method that enable close stacking and cooling of closely positioned pluralities of similar electronic I/O or memory boards and requiring high speed communication between the boards, such as high speed switching amongst the I/O terminals of the boards or CPU processing, and having an upper and a lower set of similar spaced groups of closely spaced vertical boards; powering terminals aligned along the upper edges of the upper set of boards, and along the lower edges of the lower set of boards, and terminals for connection with a switching fabric disposed along the lower edges of the upper set of boards and the upper edges of the lower set of boards; power backing planes mounted to power and support the lateral edges of the respective sets of groups of boards and extending across the upper and lower sections of the frame; and a plurality of parallel closely spaced vertical switching fabric boards comprising switching fabric (or CPU processing boards) and centrally mounted in the central space of the frame between the groups of boards of the upper and lower sets of boards, and with a backing plane therefor extending intermediately of the frame between the upper and lower section backing plates and isolatively separate therefrom to provide a no-power quiescent zone for the switching fabric (or CPU) boards.

Description

The present invention relates to electronic circuit board mounting assemblies and techniques for closely stacking pluralities of such boards in relatively confined frames and housings; being more particularly directed to methods of packaging a significant number of high power, high frequency, very sensitive, large circuit boards into a confined width chassis and effectively cooling, managing electromagnetic radiation, and providing quiescent signal planes for high speed communication paths.
BACKGROUND
The electronic circuit board assembly mounting art is replete with varied mechanical layouts and techniques for permitting the insertion or plug-in and removal of pluralities of stacks of electronic boards or cards within confined frames, cages and housings.
With the use of large pluralities or banks of boards such as memory, CPU or I/O boards in computer systems, or line interface boards, switch fabrics, and control processors in networking equipment, problems attendant upon the cooling of proximally mounted boards requiring large amounts of power have arisen, along with the requirement for benign signaling environments for very high speed, low voltage signals. These very high-speed circuits, moreover, can generate strong electromagnetic radiation fields that must also be contained with the enclosure system. As more boards are required, they must be mounted closer and closer together, greatly increasing the airflow impedance and decreasing the allowable maximum component height on each board. This creates difficult cooling problems such as hot spots and dead zones on the boards, and this is additionally complicated by the increased power requirement for today's high-speed integrated circuits. These high-power, high-speed circuits require large amounts of airflow volume and very small enclosure openings to contain electromagnetic radiation; and these two requirements, unfortunately, are diametrically opposed.
Most current computers and networking equipment are constrained to be packaged in fixed width cabinets, such as 19-inch EIA racks. Designers have thus been forced to find ways of packaging more and more boards into such a fixed width chassis. One obvious method is to decrease the space between boards hence increasing the number of vertical boards in a chassis. Beyond sixteen boards, however, this become extremely difficult as the pitch of the boards falls below 1-inch, leaving little height on boards for taller components (and heat sinks) and dramatically increasing the airflow impedance, thereby requiring very powerful blower systems.
Another approach currently being used is to mount some boards vertically and others horizontally, either above or below the vertical boards. While many networking vendors are employing this approach, it has serious drawbacks. Such an approach, indeed, requires cooling air to be forced in two directions, vertically and horizontally within the chassis or housing, with the horizontal air intake and exhaust developing convection effects, and deleteriously exhausting air from the sides into adjacent equipments as in central offices and the like; and with side-exhausted air becoming pulled in by the blowers or fans providing the vertical cooling air for the vertical boards. When air is forced to turn corners or bend, however, energy is wasted and thermal performance is sacrificed. Further drawbacks of this approach revolve around the distance between the horizontal boards and the vertical boards. To provide an adequate air intake plenum, this space should be as large as possible. The larger the space between the boards, however, the greater the distance of the electrical path. Since many vendors are installing their switch fabric boards horizontally, this increases the distance between the I/O boards and the switch fabric.
Through the novel mounting approach of the present invention, on the other hand, all boards may be vertically mounted and with high densities in standard width enclosures; all airflow is strictly vertical, a low impedance airflow path is maintained; and a power distribution scheme is used to separate high current noisy supply voltages from low voltage sensitive interface logic, and with tight electromagnetic radiation containment.
OBJECTS OF INVENTION
A primary object of the invention, accordingly, is to provide a new and improved method of assembling and a novel mounting assembly for, closely positioned pluralities of similar electronic circuit boards containing high speed, sensitive interconnect circuits and also requiring large power supply currents, and that are not subject to the above-described and other disadvantages of prior art constructions, but that, to the contrary, enable high packing densities with all vertical board mounting and air cooling, and with isolated quiescent zones for the high speed interconnect circuits.
A further object is to provide in such a novel assembly, a low impedance airflow design along with a superior electromagnetic radiation suppression technique.
Other and further objects will be explained hereinafter and are more clearly set forth in the appended claims.
SUMMARY
In summary, from one of its viewpoints, the invention embraces a method of assembling closely positioned pluralities of similar electronic circuit boards (I/O or memory, for example) provided with powering terminals and requiring high speed communication (such as switching or other logic interfacing as later more fully described) between said circuit boards and adapted for substantially uniform cooling of the closely positioned boards. The method comprises, parallely stacking an upper set of similar spaced groups of closely spaced boards in an upper section of a frame with an intermediate space provided between the groups, and with the powering terminals aligned near the upper edges of the boards, and terminals provided for high speed interfacing near the lower edges of the boards; parallely stacking a lower set of similar spaced groups of closely spaced boards in a lower section of the frame with a similar intermediate space provided between the groups, and with the powering terminals of the boards aligned near the lower edges of the boards, and terminals provided for high speed logic interfacing, aligned near the upper edges of the boards facing the high speed interfacing terminals of the lower edges of the boards of the upper groups of boards; mounting a power backplane to support the set of groups of upper section boards and extending across the upper section of the frame, and mounting a similar power backplane to support the set of groups of the lower section boards and extending across the lower section of the frame; and positioning a plurality of parallel closely spaced high speed logic boards (such as a switching fabric, CPU, etc.) substantially centrally of the frame and disposed in the spaces between the groups of boards of the upper and lower section sets of boards, and with a backplane therefor extending intermediately of the frame between the upper and lower section backplanes and isolatively separate therefrom to provide a no-power quiescent zone for the high speed logic board signals; and substantially symmetrically connecting the lower edge logic interfacing terminals of the upper section boards and the upper edge logic interfacing terminals of the lower section boards to the high speed logic boards.
The resulting preferred assembly thus comprises a card cage system containing circuit boards that is divided into four equal-size outer quadrants surrounding a center column. Boards installed in the center column are substantially larger. All boards installed in the upper two outer quadrants and the upper half of the central column are installed upwards, and all similar boards installed in the lower two outer quadrants and the lower half of the central column are installed upside down, rotated 180°. All boards have their power terminals located in the same position (their outer edges), with the power terminals at the top for the upper boards and at the bottom for the lower boards. All boards have their high speed interfaces at the inner edges of the board such that all high speed interfaces with the logic boards are placed in the center of the card cage where the high speed logic boards (switch fabric or CPU) are located such that all high speed inter-board communication occurs in a very small area.
Backplanes that span the upper and lower halves of the card cage are comprised of three separate printed circuit boards (PCBs) stacked one on top of the other and mounted to a frame which makes them appear to be boards as one uniform backplane. The top and bottom backplanes are identical with the bottom rotated 180° from the top. The top and bottom backplanes distribute power only and contain no logic signals. The center backplane, which carries all logic signals, contains no power distribution voltages, only logic signals. Each one of these two different PCBs can be optimized for the function it must perform.
Preferred and best mode assembly structures and designs are later more fully described.
DRAWINGS
The invention will now be described with reference to the accompanying drawings,
FIG. 1A of which is a diagrammatic view of the board placement in accordance with the principles of the invention;
FIGS. 1B and 1C are isometric views of a mounting assembly embodying the technique of the invention in the preferred form of the format of FIG. 1A; and
FIG. 2 is an isometric view upon an enlarged scale of a preferred mounting channel structure particularly useful in the assembly of FIGS. 1B and C.
PREFERRED EMBODIMENT(S) OF INVENTION
Referring first to the diagrammatic view of FIG. 1A, an electronic circuit board assembly is shown, as in the before-mentioned standard 19-inch or other card cage frame or housing G, holding closely positioned pluralities, for example, of similar electronic I/O (or memory) boards C1, C2, etc. containing high speed signal circuits and provided with powering terminals; and, in the illustrative and preferred application of the present invention, requiring high speed switching amongst the I/O terminals of the boards as, for example, for the type of internally cached multiple DRAM switching systems described in Mukesh Chatter U.S. Pat. No. 5,799,209, issued Aug. 25, 1998, and the corresponding foreign counterpart of which appears in PCT publication-WO97/24725.
Front-to-rear mounting slots or channels M, shown in FIGS. 1B and 1C as extending transversely within the frame, receive the boards in vertical parallel stacks--an upper set of similar spaced groups C1 and C2 of closely spaced boards in an upper section of the frame (mounted in the left quadrant and in the right quadrant, respectively), and with an intermediate central column space S provided between the groups C1 and C2. Powering terminals E are shown aligned near the upper edges of the boards C1 and C2, and lower edge terminals T are provided for high-speed switching interfacing connection over the later-described main backplane F, with central logic boards here shown as a switching fabric comprising vertical logic boards D, disposed in the central space S between the boards C1 and C2.
In the lower preferably symmetrical section of the frame, similar mounting slots or channels M', FIG. 1B, hold a lower set of similar vertical spaced quadrant groups C1 ' and C2 ' of closely spaced boards, with a similar intermediate central space S' provided between the groups C1 ' and C2 '. The powering terminals E' for these groups of boards, however, are aligned near the lower edges of the lower set of boards C1 ' and C2 ' and terminals T' for interfacing connection with the switching fabric are provided near the upper edges of the boards, 180° oppositely to the mounting of the upper sets of boards C1 and C2, and facing the switching terminals T of the lower edges of the boards of the upper groups of boards. This assembly permits all of the high-speed switching signals to the upper and lower groups of I/O memory boards to end up next to each other and right at the switch fabric boards D (or, in other applications, CPU or other logic) in the area between interfacing connector terminals T and T'.
An upper power backing plane P is horizontally mounted to provide board plug-in power connection and to support the lateral edges of the set of groups C1, and C2 of the upper section boards and extends across the upper section of the frame, FIGS. 1B and 1C. This is the zone where the relatively heavy currents are being circulated (for example, driven by -48 volts at the power terminals E). A similar power backing plane P' is symmetrically mounted to support and power the set of groups C1 ' and C2 ' of the lower section boards and also extends horizontally across the lower section of the frame. These high power backplanes P and P', may be constructed, for example, of copper-clad fiberglass (FR4) and support the high power high current requirements of the operation of the I/O board system. The main backplane F between the upper and lower backplanes P and P', however, is where all the high speed interconnect circuits are routed through interfacing terminals T and T'. Not only is there high-speed communication between I/O boards in the quadrants and the switch fabric modules in the center, but also between the I/O boards themselves.
At the opposite end of the spectrum is the requirement for very high speed logic interconnect channels comprised of very sensitive signals that can be adversely affected by noise generated by the switching of large currents. The main backplane F disposed between the power backplane s P and P', contains no such power supply currents and is accordingly herein referred to as a "no-power quiescent zone". The parallel closely spaced logic switching boards D comprising the switching fabric, thus, are centrally mounted in the frame and extend in the space S, between the groups of boards of the upper and lower section sets of boards, and with the backplane F extending horizontally intermediately of the frame between the upper and lower section backplanes P and P' and isolatively separate therefrom to provide such no-power quiescent zone for high speed interconnect signals, such as those of the switching fabric boards (or, in other applications, CPU or the like). The switch fabric boards D are shown occupying the upper space S, and terminating at their terminal connections at the main backplane F for connection with the interfacing terminals T, T' of the sets of boards C1, C1 ', C2, C2 '. Substantially symmetrical plug-in connections are provided from the lower edge switching terminals T of the upper section boards C1 and C2 and from the upper edge switching terminals fabric board T' of the lower section boards C1 and C2 to the switching fabric boards D along the backplane F.
In practice, for the internally cached DRAM network application above described, where 12-16 I/O boards may be stacked in the board groups, the three backplanes P, P' and F are preferably mounted into a metal frame G, as with precision-drilled location holes which then locate all of these backplanes very precisely and make them appear to simulate one continuous physical single backplane to all the board cards that are plugging in.
The switching fabric boards D connected with the backplane F are shown positioned for their interfacing terminals to be in line respectively with, though between, the interfacing terminals T, T' of the upper and lower section boards, remote from the regions of the board power terminals E and E' at backplanes P and P'. The power terminals E, E' used on the power backplanes P and P' are sturdy rugged conventional heavy-duty, heavy current power connectors; whereas the terminals T and T' used to plug into the F backplane, are very delicate high-density connectors.
The novel construction of the invention permits the cooling in the system to be provided, all from the bottom to the top of the frame, and all unidirectionally vertically. Since no horizontal boards are used, no convection problems are present, and there are no issues with thermal heat rising off of one board and heating the successive boards above it. With the cooling air going straight up through the frame so that all air horsepower is utilized in cooling the boards, an optimized relatively small blower system may be used, even in a 19-inch rack.
Further to maintain efficient air cooling of the tightly packed board assembly, and serendipitously to provide trapping of electromagnetic radiation generated by the high speed switching within the frame from escaping therefrom, an open egg-crate type of metal grill lid, is provided over the top exhaust of the frame or housing at L and also at the air inlet at L'. This not only allows for optimum unimpeded or low-impedance uniform flow of air in-line from the bottom through the top along the surfaces of the board cards, but the square or rectangular or other cell openings of the metal grill L, L' may be dimensioned relative to the wavelength of the principal electromagnetic radiation frequencies generated by the high speed switching, to serve as electromagnetic wave-guide cut-off attenuators, trapping or attenuating the radiation within the frame. For example, with high-speed switching by the boards D in the range of 12 GHz in frequency(ies), a cross-dimension of square grill wave-guide-like cells, 1/2 inch on the side and 1/2 inch deep, will provide about 23 to 24 dB at the 12 GHz cut off frequency, and on the order of about 27 dB at frequencies well below 12 GHz.
Again, with consideration of air cooling of tightly packed boards and also of simplicity and low cost of card mounting slot or channel construction, the mounting slots or channels M, M' may preferably be formed of inexpensive substantially U-shaped structures as shown in FIG. 2. A metal sheet is there shown folded, with the upper portion 1 of one side (right) serving as one wall of the U-shaped channel, juxtaposed against the lower portion 2 of the other side (left) of the folded sheet. The other side 2 is then bent transversely at 2' to form the bottom of the U channel, along which the board cards are inserted and board cards are inserted and withdrawn, and then the sheet is bent upwardly at 2", parallel to the upper portion 1, to serve as the opposite wall of the U-shaped channel. Transverse supports 3 are shown provided between adjacent channels.
While most useful in the illustrative example of the high speed switching fabric herein described, it is to be understood, as before stated, that the techniques of the invention are not at all limited to this type of networking system or equipment. The architecture of the invention, indeed, is well suited for computer systems with processor cards (CPUs, before mentioned) located in the regions illustratively described herein for the switch fabric, and with memory or I/O cards disposed in the four quadrants. The centrally located logic boards may thus be more generically described as switch fabric/CPU cards.
Further modifications will also occur to those skilled in this art, and such are considered to fall within the spirit and scope of the invention as defined in the appended claims.

Claims (24)

What is claimed is:
1. A method of assembling closely positioned pluralities of similar electronic circuit boards provided with powering terminals and requiring high speed communication between said circuit boards and adapted for substantially uniform cooling of the closely positioned boards, that comprises, parallely stacking an upper set of similar spaced groups of closely spaced boards in an upper section of a frame with an intermediate space provided between the groups, and with the powering terminals aligned near the upper edges of the boards, and terminals provided for high speed interfacing at the lower edges of the boards; parallely stacking a lower set of similar spaced groups of closely spaced boards in a lower section of the frame with a similar intermediate space provided between the groups, and with the powering terminals of the boards aligned near the lower edges of the boards, and terminals provided for high speed interfacing aligned at the upper edges of the boards facing the high speed interfacing terminals of the lower edges of the boards of the upper groups of boards; mounting a power backplane to support the set of groups of upper section boards and extending across the upper section of the frame, and mounting a similar power backplane to support the set of groups of the lower section boards and extending across the lower section of the frame; and positioning a plurality of parallel closely spaced high speed logic boards substantially centrally of the frame and disposed in the spaces between the groups of boards of the upper and lower section sets of boards, and with a backplane therefor extending intermediately of the frame between the upper and lower section backplanes and isolatively separate therefrom to provide a no-power quiescent zone for the high speed logic board signals; and substantially symmetrically connecting the lower edge interfacing terminals of the upper section boards and the upper edge interfacing terminals of the lower section boards to the high speed logic boards at their backplane.
2. The method of claim 1 wherein the circuit boards comprise one of I/O and memory boards, and the high speed logic boards comprise one of switching fabrics and CPUs.
3. The method of claim 1 wherein cooling air flow is passed in-line through the lower, the central and upper sections of the frame.
4. The method of claim 1 wherein all the boards are substantially vertically oriented and the backplanes are extended horizontally of the frame.
5. The method of claim 1 wherein the upper and lower sets of groups of boards each comprise a left-hand quadrant group and a right-hand quadrant group respectively aligned vertically, and the high speed logic group is mounted in a central space between the upper and lower frame sections between the left and right-hand quadrant groups of upper and lower board sets.
6. The method of claim 5 wherein the lower edges of the switching fabric boards are positioned to be somewhat in line respectively with, though between, the interfacing lower and upper terminal edges, respectively, of the upper and lower section boards.
7. An electronic circuit board assembly of closely positioned pluralities of similar electronic boards provided with powering terminals and requiring high speed communication between said circuit boards, having, in combination, mounting slots within a frame for parallely stacking an upper set of similar spaced groups of closely spaced boards in an upper section of the frame and with an intermediate space provided between the groups; powering terminals aligned near the upper edges of the boards, and terminals for high speed interfacing disposed near the lower edges of the boards; mounting slots for parallely stacking a lower set of similar spaced groups of closely spaced boards in a lower section of the frame with a similar intermediate space provided between the groups; powering terminals aligned near the lower edges of the lower set of boards, and terminals for high speed interfacing near the upper edges of the boards, facing the high speed interfacing terminals of the lower edges of the boards of the upper groups of boards; a power backplane mounted to power and support the set of groups of the upper section boards and extending across the upper section of the frame, and a similar power backplane mounted to power and support the set of groups of the lower section boards and extending across the lower section of the frame; and a plurality of parallel closely spaced high speed logic boards centrally mounted in the frame and extending in the spaces between the groups of boards of the upper and lower section sets of boards, and with a backplane extending intermediately of the frame between the upper and lower section backplanes and isolatively separate therefrom to provide a no-power quiescent zone for the high speed logic board signals; and substantially symmetrical connections from the lower edge interfacing terminals of the upper section boards and from the upper edge interfacing terminals of the lower section boards to the high speed logic boards at their backplane.
8. The electronic circuit board assembly as claimed in claim 7 wherein the circuit boards comprise one of I/O and memory boards, and the high-speed logic boards comprise one of switching fabrics and CPUs.
9. An electronic circuit board assembly as claimed in claim 7 wherein the mounting slots maintain all the boards substantially vertically oriented, and the backplanes extend horizontally of the frame.
10. The electronic circuit board assembly as claimed in claim 9 wherein means is provided for passing cooling air flow in-line through the lower, the intermediate and upper sections of the frame.
11. The electronic circuit board assembly as claimed in claim 7 wherein the upper and lower sets of groups of boards each comprise a left-hand quadrant group and a right-hand quadrant group respectively aligned vertically, and the high speed logic group is mounted in a central space between the upper and lower frame sections between the left and right-hand quadrant groups of the upper and lower board sets.
12. An electronic circuit board assembly as claimed in claim 11 wherein the lower edges of the high speed logic boards are positioned to be somewhat in line respectively with, though between, the interfacing lower and upper terminal edges, respectively, of the upper and lower section sets of boards.
13. A method of assembling closely positioned pluralities of similar electronic circuit I/O boards provided with powering terminals and requiring high speed switching amongst the I/O terminals of the boards and adapted for substantially uniform cooling of the closely positioned boards, that comprises, parallely stacking upper and lower quadrant sets of similar spaced groups of closely spaced boards in a frame with an intermediate central space provided between the groups, and with the powering terminals aligned near the upper edges of the upper set of boards and near the lower edges of the lower set of boards, and with terminals provided for interfacing connection with a high speed switching fabric near the lower edges of the upper set of boards and near the upper edges of the lower set of boards, facing one another; mounting upper and lower power backplanes to power and support the respective sets of groups of boards and extending across the upper and lower quadrant sections of the frame, respectively; and providing a plurality of parallel closely spaced switching logic boards comprising said switching fabric substantially centrally of the frame in said central space between the groups of boards of the upper and lower section sets of boards, and with a backplane provided therefor and extending intermediately of the frame between the upper and lower section backplanes and isolatively separate therefrom to provide a no-power quiescent zone for the switching fabric boards; and substantially symmetrically connecting the lower edge interfacing terminals of the upper section set of boards and the upper edge interfacing terminals of the lower section set of boards to the switching fabric boards at the switching fabric backplane.
14. An electronic circuit board assembly of closely positioned pluralities of similar electronic I/O boards provided with powering terminals and requiring high speed switching amongst the I/O terminals of the boards, having, in combination, mounting slots within a frame for parallely stacking an upper and a lower quadrant set of similar spaced groups of closely spaced boards in an upper and a lower section of the frame, respectively, and with an intermediate space provided between the groups of each of the upper and lower quadrant sets of groups; powering terminals aligned near the upper edges of the upper set of boards and near the lower edges of the lower set of boards, and terminals for interfacing with a switching fabric disposed along the lower edges of the upper set of boards and the upper edges of the lower set of boards; power backplanes mounted to power and support the respective sets of groups of boards and extending across the upper and lower sections of the frame; and a plurality of parallel closely spaced switching logic boards comprising said switching fabric and centrally mounted in said central space of the frame between the groups of boards of the upper and lower sets of boards, and with a backplane therefor extending intermediately of the frame between the upper and lower section backplanes and isolatively separate therefrom to provide a no-power quiescent zone for the switching fabric boards; and substantially symmetrical connections from the lower edge interfacing terminals of the upper section boards and from the upper edge interfacing terminals of the lower set of boards to the switching fabric boards at their backplane.
15. The electronic circuit board assembly as claimed in claim 14 wherein means is provided for passing cooling air from an intake at the bottom of the frame upward through the frame along the boards mounted therein to an exhaust at the top of the frame, and a metallic egg-crate grill is mounted over each of the air intake and exhaust of the frame and the openings of which are dimensioned relative to the wavelength of the high frequency radiation generated by the high speed switching to serve as cut-off electromagnetic waveguide traps for the high frequency radiation.
16. The electronic circuit board assembly of claim 15 wherein the openings of the grill are substantially square or rectangular and of the order of 1/2-inch on a side and in depth, providing substantial trapping of high frequency radiation of the order of 12 GHz and below.
17. The electronic circuit board assembly as claimed in claim 14 wherein the mounting slots comprise U-shaped single-piece channels for receiving and mounting the upper and lower edges of the boards transversely of the frame towards the backplanes.
18. The electronic circuit board assembly as claimed in claim 17 wherein the U-shaped single piece channels are formed of a folded sheet of metal the upper portion of one side of which serves as one wall of the U-shaped channel, with the lower portion of said one side juxtaposed against the lower portion of the other side of the folded sheet and then bent transversely to form the bottom of the U and then upwardly parallel to the one side upper portion to serve as the opposite wall of the U-shaped channel.
19. The electronic circuit board assembly as claimed in claim 14 wherein the power backplanes and intermediate switching fabric backplane are mounted in a further frame to simulate the physical appearance of a single continuous backplane.
20. An assembly of closely positioned similar circuit boards such as I/O and memory boards containing high speed interconnect circuits and provided with powering terminals and requiring high speed communication between said circuit boards and centrally located high speed logic circuit boards, such as switch fabrics and CPUs, having, in combination with a circuit board card cage system divided into four equal-size outer quadrants surrounding a central column, similar pluralities of equal-size boards mounted within the four quadrants, with all the boards installed vertically within the upper two outer quadrants and the upper half of the central column installed upwards, and all the boards installed vertically in the lower two outer quadrants and the lower half of the central column installed upside down; and power terminals provided along the tops of the upper boards and the bottom of the lower boards, and high speed logic-interfacing terminals provided along the bottom of the upper boards and the top of the lower boards, connecting to the high speed logic circuit boards, in turn mounted vertically at the center of the card cage so as to limit all high speed inter-board communication to within a central area.
21. The assembly of claim 20 wherein upper and lower backplanes are provided for mounting and distributing power to the upper and lower quadrant boards and containing no logic signals; and an intermediate backplane is provided for the central high speed logic circuit boards carrying all logic signals and containing no power distribution voltages.
22. The assembly of claim 21 wherein the backplanes span the back of the card cage and are mounted to a frame that causes them to appear as one uniform backplane.
23. For use in an electronic circuit board assembly mounted within a frame and wherein high frequency radiation is generated as from high speed switching or CPU circuits disposed on the circuit boards, means for passing cooling air from an intake at the bottom of the frame upward through the frame along the circuit boards mounted therein and out an exhaust on the top of the frame, and a metallic egg-crate grill mounted over each of the air intake and exhaust of the frame and the openings of which are dimensioned relative to the wavelength of the high frequency radiation generated by the high speed switching to serve as cut-off electromagnetic waveguide traps for the high frequency radiation.
24. For use in an electronic circuit board assembly, U-shaped single-piece channels for receiving circuit boards, formed of a folded sheet of metal the upper portion of one side of which serves as one wall of the U shaped channel, with the lower portion of said one side juxtaposed against the lower portion of the other side of the folded sheet and then bent transversely to form the bottom of the U, and then upwardly parallel to the one side upper portion to serve as the opposite wall of the U-shaped channel.
US09/190,521 1998-11-12 1998-11-12 Electronic circuit board assembly and method of closely stacking boards and cooling the same Expired - Lifetime US5991163A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US09/190,521 US5991163A (en) 1998-11-12 1998-11-12 Electronic circuit board assembly and method of closely stacking boards and cooling the same
AU64831/99A AU6483199A (en) 1998-11-12 1999-11-08 Electronic circuit board
PCT/IB1999/001781 WO2000030421A1 (en) 1998-11-12 1999-11-08 Electronic circuit board
EP99952737A EP1166607A1 (en) 1998-11-12 1999-11-08 Electronic circuit board
CA002350135A CA2350135A1 (en) 1998-11-12 1999-11-08 Electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/190,521 US5991163A (en) 1998-11-12 1998-11-12 Electronic circuit board assembly and method of closely stacking boards and cooling the same

Publications (1)

Publication Number Publication Date
US5991163A true US5991163A (en) 1999-11-23

Family

ID=22701689

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/190,521 Expired - Lifetime US5991163A (en) 1998-11-12 1998-11-12 Electronic circuit board assembly and method of closely stacking boards and cooling the same

Country Status (5)

Country Link
US (1) US5991163A (en)
EP (1) EP1166607A1 (en)
AU (1) AU6483199A (en)
CA (1) CA2350135A1 (en)
WO (1) WO2000030421A1 (en)

Cited By (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163454A (en) * 1999-02-22 2000-12-19 Hewlett-Packard Company Electromagnetic interference (EMI) shield for electrical components, an internal EMI barrier, and a storage enclosure for electrical/electronic components
US6169658B1 (en) * 1999-10-13 2001-01-02 Trw Inc. Plenumless air cooled avionics rack
US6285546B1 (en) * 1998-12-03 2001-09-04 Hitachi, Ltd. Mounting structure for electronic device
US6293828B1 (en) 1999-02-25 2001-09-25 Power-One, Inc. Methods and systems for a power supply housing
US6332198B1 (en) 2000-05-20 2001-12-18 Equipe Communications Corporation Network device for supporting multiple redundancy schemes
US20020001307A1 (en) * 2000-05-20 2002-01-03 Equipe Communications Corporation VPI/VCI availability index
US6356444B1 (en) * 1999-06-03 2002-03-12 Fujitsu Network Communications, Inc. Card shelf heat transfer system and method
US6362417B2 (en) * 1998-02-17 2002-03-26 Parker-Hannifin Corporation EMI shielded vent panel and method
US6392901B1 (en) * 1999-02-25 2002-05-21 Power-One, Inc. Methods and systems for a power supply rack
US6425488B1 (en) * 2000-04-12 2002-07-30 International Business Machines Corporation Integrated flexible frame tie down retention system for raised and non-raised floor applications
US20020116485A1 (en) * 2001-02-21 2002-08-22 Equipe Communications Corporation Out-of-band network management channels
US6452789B1 (en) * 2000-04-29 2002-09-17 Hewlett-Packard Company Packaging architecture for 32 processor server
US20020165961A1 (en) * 2001-04-19 2002-11-07 Everdell Peter B. Network device including dedicated resources control plane
US20020173278A1 (en) * 2001-05-18 2002-11-21 Fritz Gregory J. Telecommunications chassis and card
US6490157B2 (en) * 1999-09-01 2002-12-03 Intel Corporation Method and apparatus for providing managed modular sub-environments in a personal computer
US6525527B1 (en) * 1999-11-19 2003-02-25 Mirae Corporation Cooling system for a module IC handler
WO2003030606A1 (en) * 2001-10-04 2003-04-10 Avici Systems, Inc. Rack mounted routers
US6548753B1 (en) * 2000-06-06 2003-04-15 Marconi Communications, Inc. Flame suppression cabinet
US20030126195A1 (en) * 2000-05-20 2003-07-03 Reynolds Daniel A. Common command interface
US6601186B1 (en) 2000-05-20 2003-07-29 Equipe Communications Corporation Independent restoration of control plane and data plane functions
US20030142483A1 (en) * 2002-01-30 2003-07-31 Ofer Iny Switching device and a method for the configuration thereof
US6639910B1 (en) 2000-05-20 2003-10-28 Equipe Communications Corporation Functional separation of internal and external controls in network devices
US6637845B2 (en) * 2001-02-28 2003-10-28 Adc Telecommunications, Inc. Telecommunications chassis and card with flame spread containment
US6654903B1 (en) 2000-05-20 2003-11-25 Equipe Communications Corporation Vertical fault isolation in a computer system
US6658580B1 (en) 2000-05-20 2003-12-02 Equipe Communications Corporation Redundant, synchronous central timing systems with constant master voltage controls and variable slave voltage controls
US6658579B1 (en) 2000-05-20 2003-12-02 Equipe Communications Corporation Network device with local timing systems for automatic selection between redundant, synchronous central timing systems
US20030223193A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Method and apparatus for rack mounting computer components
US20030224645A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Rack mountable computer component power distribution unit and method
US20030221817A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Rack mountable computer component cooling method and device
US20030223199A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Rack mountable computer component and method of making same
WO2003103359A1 (en) * 2002-05-31 2003-12-11 Racksaver Inc. Methods and apparatus for mounting computer components
US6671699B1 (en) 2000-05-20 2003-12-30 Equipe Communications Corporation Shared database usage in network devices
US6708291B1 (en) 2000-05-20 2004-03-16 Equipe Communications Corporation Hierarchical fault descriptors in computer systems
US6715097B1 (en) 2000-05-20 2004-03-30 Equipe Communications Corporation Hierarchical fault management in computer systems
US6718415B1 (en) 1999-05-14 2004-04-06 Acqis Technology, Inc. Computer system and method including console housing multiple computer modules having independent processing units, mass storage devices, and graphics controllers
US20040070937A1 (en) * 2002-08-29 2004-04-15 Barsun Stephan K. Card support assembly
US6742134B1 (en) 2000-05-20 2004-05-25 Equipe Communications Corporation Maintaining a local backup for data plane processes
US6760339B1 (en) 2000-05-20 2004-07-06 Equipe Communications Corporation Multi-layer network device in one telecommunications rack
US6768640B2 (en) * 2002-06-28 2004-07-27 Sun Microsystems, Inc. Computer system employing redundant cooling fans
US20040174676A1 (en) * 2002-12-04 2004-09-09 Chen Shi-Tsung Computer chassis for dissipating heat and shielding electromagnetic emissions
US6801428B2 (en) 2002-05-31 2004-10-05 Racksaver, Inc. Rack mountable computer component fan cooling arrangement and method
US20040252464A1 (en) * 2003-06-11 2004-12-16 Hewlett-Packard Development Company, L.P. Computer system
US20040252467A1 (en) * 2003-06-11 2004-12-16 Hewlett-Packard Development Company, L.P. Multi-computer system
US20040264123A1 (en) * 2003-06-26 2004-12-30 International Business Machines Corporation Server packaging architecture utilizing a blind docking processor-to-midplane mechanism
US6868092B1 (en) 2000-05-20 2005-03-15 Ciena Corporation Network device with embedded timing synchronization
US6876652B1 (en) 2000-05-20 2005-04-05 Ciena Corporation Network device with a distributed switch fabric timing system
US6880086B2 (en) 2000-05-20 2005-04-12 Ciena Corporation Signatures for facilitating hot upgrades of modular software components
US6934749B1 (en) 2000-05-20 2005-08-23 Ciena Corporation Tracking distributed data retrieval in a network device
US6940730B1 (en) 2001-02-28 2005-09-06 Adc Telecommunications, Inc. Telecommunications chassis and card
US7016201B1 (en) * 1999-07-30 2006-03-21 Alstom Device for protecting a drawer electromagnetically
US7020696B1 (en) 2000-05-20 2006-03-28 Ciena Corp. Distributed user management information in telecommunications networks
US7023845B1 (en) 2000-06-13 2006-04-04 Ciena Corporation Network device including multiple mid-planes
US7039046B1 (en) 2000-05-20 2006-05-02 Ciena Corporation Network device including central and distributed switch fabric subsystems
US7051097B1 (en) 2000-05-20 2006-05-23 Ciena Corporation Embedded database for computer system management
US7054272B1 (en) 2000-07-11 2006-05-30 Ciena Corporation Upper layer network device including a physical layer test port
US7062642B1 (en) 2000-05-20 2006-06-13 Ciena Corporation Policy based provisioning of network device resources
DE102005009078A1 (en) * 2005-02-28 2006-09-07 Siemens Ag Circuit board rack apparatus with mid-plane, has one or two housing units selectively arranged on screened rack units for cooling e.g. by ventilation
US7111053B1 (en) 2000-05-20 2006-09-19 Ciena Corporation Template-driven management of telecommunications network via utilization of operations support services clients
US7130870B1 (en) 2000-05-20 2006-10-31 Ciena Corporation Method for upgrading embedded configuration databases
US20060248380A1 (en) * 2005-04-27 2006-11-02 Hitachi, Ltd. Disk array device
US7143153B1 (en) 2000-11-09 2006-11-28 Ciena Corporation Internal network device dynamic health monitoring
US20060278023A1 (en) * 2004-02-25 2006-12-14 Mts Sensortechnologie Gmbh & Co. Kg Magnetostrictive elongation sensor
US20070030630A1 (en) * 2005-08-04 2007-02-08 Diaz Elizabeth Brandon S Upside down PC
US20070083690A1 (en) * 2005-10-07 2007-04-12 Hitachi, Ltd. Storage controller
US7222147B1 (en) 2000-05-20 2007-05-22 Ciena Corporation Processing network management data in accordance with metadata files
US7225240B1 (en) 2000-05-20 2007-05-29 Ciena Corporation Decoupling processes from hardware with logical identifiers
US7240364B1 (en) 2000-05-20 2007-07-03 Ciena Corporation Network device identity authentication
US7266595B1 (en) 2000-05-20 2007-09-04 Ciena Corporation Accessing network device data through user profiles
US7349960B1 (en) 2000-05-20 2008-03-25 Ciena Corporation Throttling distributed statistical data retrieval in a network device
US20080205028A1 (en) * 2007-02-22 2008-08-28 Tellabs Operations, Inc. Stackable cable tray
US20090129014A1 (en) * 2007-11-19 2009-05-21 Ortronics, Inc. Equipment Rack and Associated Ventilation System
US20090237880A1 (en) * 2007-11-19 2009-09-24 Ortronics, Inc. Equipment Rack And Associated Ventilation System
US20090264819A1 (en) * 2008-04-16 2009-10-22 Cardiatis S.A. Method for controlling the systemic pressure in cardiac operations
USRE41076E1 (en) 1998-10-30 2010-01-12 Acqis Technology, Inc. Password protected modular computer method and device
USRE41092E1 (en) 1999-05-14 2010-01-26 Acqis Technology, Inc. Data security method and device for computer modules
US20100165565A1 (en) * 2008-12-31 2010-07-01 Hellriegal Stephen V R Data center
US20100332804A1 (en) * 2009-06-29 2010-12-30 Golla Robert T Unified high-frequency out-of-order pick queue with support for speculative instructions
US20110078697A1 (en) * 2009-09-30 2011-03-31 Smittle Matthew B Optimal deallocation of instructions from a unified pick queue
US20120019115A1 (en) * 2010-07-21 2012-01-26 GraphStream Incorporated Mobile universal hardware platform
US8410364B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Universal rack cable management system
US8411440B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Cooled universal hardware platform
US8441793B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal rack backplane system
US8441792B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal conduction cooling platform
US20130208413A1 (en) * 2012-02-10 2013-08-15 Yi-Kuei Huang Network attached storage device and assembling method thereof
US20140301499A1 (en) * 2008-11-25 2014-10-09 Micron Technology, Inc. Methods for bypassing faulty connections
US9295169B1 (en) 2013-09-16 2016-03-22 Advanced Testing Technologies, Inc. Common chassis for instrumentation
US9345172B2 (en) 2007-11-19 2016-05-17 Ortronics, Inc. Equipment rack and associated ventilation system
US9488673B1 (en) 2013-09-16 2016-11-08 Advanced Testing Technologies, Inc. Multi-standard instrumentation chassis
USRE48365E1 (en) 2006-12-19 2020-12-22 Mobile Motherboard Inc. Mobile motherboard

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022326A (en) * 1976-04-22 1977-05-10 Joseph Marconi Dual action retaining guide for printed circuit card racks
US4454566A (en) * 1981-11-27 1984-06-12 Bell Telephone Laboratories, Incorporated Heat removal from cabinets housing electronic equipment
US4511950A (en) * 1983-06-27 1985-04-16 Northern Telecom Limited Backpanel assemblies
US4777615A (en) * 1986-02-28 1988-10-11 Scientific Computer Systems Corporation Backplane structure for a computer superpositioning scalar and vector operations
US4860163A (en) * 1988-08-05 1989-08-22 American Telephone And Telegraph Company Communication equipment cabinet cooling arrangement
US4872212A (en) * 1987-05-15 1989-10-03 Eip Microwave, Inc. Microwave main frame
US5289340A (en) * 1991-06-25 1994-02-22 Nec Corporation Structure of an electronic device including a number of printed circuit boards
US5467254A (en) * 1993-11-04 1995-11-14 Synoptics Communications, Inc. Supportive guide for circuit-card grounding including tracks having staggered protrusions at the proximal end of the tracks
US5533631A (en) * 1994-10-12 1996-07-09 Unitrack Industries, Inc. Composite printed circuit card guide and holding device
US5603044A (en) * 1995-02-08 1997-02-11 International Business Machines Corporation Interconnection network for a multi-nodal data processing system which exhibits incremental scalability
US5708552A (en) * 1995-11-14 1998-01-13 Electronics And Telecommunications Research Institute Electrostatic discharge protection guide rail system for printed circuit board
US5782546A (en) * 1996-04-10 1998-07-21 Nec Corporation Door structure for cabinets
US5887158A (en) * 1992-06-08 1999-03-23 Quickturn Design Systems, Inc. Switching midplane and interconnecting system for interconnecting large numbers of signals

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3502295A1 (en) * 1985-01-24 1986-07-24 ANT Nachrichtentechnik GmbH, 7150 Backnang CONSTRUCTION SYSTEM FOR ELECTRICAL COMMUNICATION DEVICES
WO1993015595A1 (en) * 1992-02-04 1993-08-05 Digital Equipment Corporation Structural frames for electrically shielded enclosures
US5799209A (en) * 1995-12-29 1998-08-25 Chatter; Mukesh Multi-port internally cached DRAM system utilizing independent serial interfaces and buffers arbitratively connected under a dynamic configuration
EP0886992B1 (en) * 1996-03-13 1999-08-11 Siemens Nixdorf Informationssysteme AG Equipment chassis for electronic equipment
US5982634A (en) * 1996-11-14 1999-11-09 Systran Corporation High speed switch package provides reduced path lengths for electrical paths through the package

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022326A (en) * 1976-04-22 1977-05-10 Joseph Marconi Dual action retaining guide for printed circuit card racks
US4454566A (en) * 1981-11-27 1984-06-12 Bell Telephone Laboratories, Incorporated Heat removal from cabinets housing electronic equipment
US4511950A (en) * 1983-06-27 1985-04-16 Northern Telecom Limited Backpanel assemblies
US4777615A (en) * 1986-02-28 1988-10-11 Scientific Computer Systems Corporation Backplane structure for a computer superpositioning scalar and vector operations
US4872212A (en) * 1987-05-15 1989-10-03 Eip Microwave, Inc. Microwave main frame
US4860163A (en) * 1988-08-05 1989-08-22 American Telephone And Telegraph Company Communication equipment cabinet cooling arrangement
US5289340A (en) * 1991-06-25 1994-02-22 Nec Corporation Structure of an electronic device including a number of printed circuit boards
US5887158A (en) * 1992-06-08 1999-03-23 Quickturn Design Systems, Inc. Switching midplane and interconnecting system for interconnecting large numbers of signals
US5467254A (en) * 1993-11-04 1995-11-14 Synoptics Communications, Inc. Supportive guide for circuit-card grounding including tracks having staggered protrusions at the proximal end of the tracks
US5533631A (en) * 1994-10-12 1996-07-09 Unitrack Industries, Inc. Composite printed circuit card guide and holding device
US5603044A (en) * 1995-02-08 1997-02-11 International Business Machines Corporation Interconnection network for a multi-nodal data processing system which exhibits incremental scalability
US5708552A (en) * 1995-11-14 1998-01-13 Electronics And Telecommunications Research Institute Electrostatic discharge protection guide rail system for printed circuit board
US5782546A (en) * 1996-04-10 1998-07-21 Nec Corporation Door structure for cabinets

Cited By (168)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6362417B2 (en) * 1998-02-17 2002-03-26 Parker-Hannifin Corporation EMI shielded vent panel and method
USRE41294E1 (en) 1998-10-30 2010-04-27 Acqis Techonology, Inc. Password protected modular computer method and device
USRE43119E1 (en) 1998-10-30 2012-01-17 Acqis Llc Password protected modular computer method and device
USRE41076E1 (en) 1998-10-30 2010-01-12 Acqis Technology, Inc. Password protected modular computer method and device
USRE42814E1 (en) 1998-10-30 2011-10-04 Acqis Technology, Inc. Password protected modular computer method and device
USRE41961E1 (en) 1998-10-30 2010-11-23 Acqis Technology, Inc. Password protected modular computer method and device
US6285546B1 (en) * 1998-12-03 2001-09-04 Hitachi, Ltd. Mounting structure for electronic device
US6163454A (en) * 1999-02-22 2000-12-19 Hewlett-Packard Company Electromagnetic interference (EMI) shield for electrical components, an internal EMI barrier, and a storage enclosure for electrical/electronic components
US6293828B1 (en) 1999-02-25 2001-09-25 Power-One, Inc. Methods and systems for a power supply housing
US6392901B1 (en) * 1999-02-25 2002-05-21 Power-One, Inc. Methods and systems for a power supply rack
US7328297B2 (en) 1999-05-14 2008-02-05 Acqis Technology, Inc. Computer system utilizing multiple computer modules functioning independently
US7146446B2 (en) 1999-05-14 2006-12-05 Acqis Technology, Inc. Multiple module computer system and method
US7676624B2 (en) 1999-05-14 2010-03-09 Acqis Llc Multiple module computer system and method including differential signal channel comprising undirectional serial bit channels
US20080244149A1 (en) * 1999-05-14 2008-10-02 Acqis Technology, Inc. Multiple module computer system and method
US20040177200A1 (en) * 1999-05-14 2004-09-09 Acqis Technology, Inc. Multiple module computer system and method
USRE46947E1 (en) 1999-05-14 2018-07-10 Acqis Llc Data security method and device for computer modules
US7818487B2 (en) 1999-05-14 2010-10-19 Acqis Llc Multiple module computer system and method using differential signal channel including unidirectional, serial bit channels
US7376779B2 (en) 1999-05-14 2008-05-20 Acqis Technology, Inc. Multiple module computer system and method
US7363416B2 (en) 1999-05-14 2008-04-22 Acqis Technology, Inc. Computer system utilizing multiple computer modules with password protection
US7363415B2 (en) 1999-05-14 2008-04-22 Acqis Technology, Inc. Computer system utilizing multiple computer modules with serial interface
US9703750B2 (en) 1999-05-14 2017-07-11 Acqis Llc Computer system including CPU or peripheral bridge directly connected to a low voltage differential signal channel that communicates serial bits of a peripheral component interconnect bus transaction in opposite directions
US9529769B2 (en) 1999-05-14 2016-12-27 Acqis Llc Computer system including CPU or peripheral bridge directly connected to a low voltage differential signal channel that communicates serial bits of a peripheral component interconnect bus transaction in opposite directions
USRE41092E1 (en) 1999-05-14 2010-01-26 Acqis Technology, Inc. Data security method and device for computer modules
US8041873B2 (en) 1999-05-14 2011-10-18 Acqis Llc Multiple module computer system and method including differential signal channel comprising unidirectional serial bit channels to transmit encoded peripheral component interconnect bus transaction data
USRE42984E1 (en) 1999-05-14 2011-11-29 Acqis Technology, Inc. Data security method and device for computer modules
US20050174729A1 (en) * 1999-05-14 2005-08-11 Acqis Technology, Inc. Multiple module computer system and method
US6718415B1 (en) 1999-05-14 2004-04-06 Acqis Technology, Inc. Computer system and method including console housing multiple computer modules having independent processing units, mass storage devices, and graphics controllers
USRE43171E1 (en) 1999-05-14 2012-02-07 Acqis Llc Data security method and device for computer modules
US8234436B2 (en) 1999-05-14 2012-07-31 Acqis Llc Computer system including peripheral bridge to communicate serial bits of peripheral component interconnect bus transaction and low voltage differential signal channel to convey the serial bits
US9529768B2 (en) 1999-05-14 2016-12-27 Acqis Llc Computer system including CPU or peripheral bridge directly connected to a low voltage differential signal channel that communicates serial bits of a peripheral component interconnect bus transaction in opposite directions
US7099981B2 (en) 1999-05-14 2006-08-29 Acqis Technology, Inc. Multiple module computer system and method
US20050195575A1 (en) * 1999-05-14 2005-09-08 Acqis Technology, Inc. Multiple module computer system and method
US20050246469A1 (en) * 1999-05-14 2005-11-03 Acqis Technology, Inc. Multiple module computer system and method
US20050204083A1 (en) * 1999-05-14 2005-09-15 Acqis Technology, Inc. Multiple module computer system and method
US6356444B1 (en) * 1999-06-03 2002-03-12 Fujitsu Network Communications, Inc. Card shelf heat transfer system and method
US7016201B1 (en) * 1999-07-30 2006-03-21 Alstom Device for protecting a drawer electromagnetically
US6490157B2 (en) * 1999-09-01 2002-12-03 Intel Corporation Method and apparatus for providing managed modular sub-environments in a personal computer
US6169658B1 (en) * 1999-10-13 2001-01-02 Trw Inc. Plenumless air cooled avionics rack
US6525527B1 (en) * 1999-11-19 2003-02-25 Mirae Corporation Cooling system for a module IC handler
US6425488B1 (en) * 2000-04-12 2002-07-30 International Business Machines Corporation Integrated flexible frame tie down retention system for raised and non-raised floor applications
US6452789B1 (en) * 2000-04-29 2002-09-17 Hewlett-Packard Company Packaging architecture for 32 processor server
US7225244B2 (en) 2000-05-20 2007-05-29 Ciena Corporation Common command interface
US6601186B1 (en) 2000-05-20 2003-07-29 Equipe Communications Corporation Independent restoration of control plane and data plane functions
US6332198B1 (en) 2000-05-20 2001-12-18 Equipe Communications Corporation Network device for supporting multiple redundancy schemes
US6760339B1 (en) 2000-05-20 2004-07-06 Equipe Communications Corporation Multi-layer network device in one telecommunications rack
US20020001307A1 (en) * 2000-05-20 2002-01-03 Equipe Communications Corporation VPI/VCI availability index
US6742134B1 (en) 2000-05-20 2004-05-25 Equipe Communications Corporation Maintaining a local backup for data plane processes
US20030126195A1 (en) * 2000-05-20 2003-07-03 Reynolds Daniel A. Common command interface
US6868092B1 (en) 2000-05-20 2005-03-15 Ciena Corporation Network device with embedded timing synchronization
US6876652B1 (en) 2000-05-20 2005-04-05 Ciena Corporation Network device with a distributed switch fabric timing system
US6880086B2 (en) 2000-05-20 2005-04-12 Ciena Corporation Signatures for facilitating hot upgrades of modular software components
US7349960B1 (en) 2000-05-20 2008-03-25 Ciena Corporation Throttling distributed statistical data retrieval in a network device
US7280529B1 (en) 2000-05-20 2007-10-09 Ciena Corporation Providing network management access through user profiles
US7266595B1 (en) 2000-05-20 2007-09-04 Ciena Corporation Accessing network device data through user profiles
US6930890B1 (en) 2000-05-20 2005-08-16 Ciena Corporation Network device including reverse orientated modules
US6934749B1 (en) 2000-05-20 2005-08-23 Ciena Corporation Tracking distributed data retrieval in a network device
US7240364B1 (en) 2000-05-20 2007-07-03 Ciena Corporation Network device identity authentication
US6715097B1 (en) 2000-05-20 2004-03-30 Equipe Communications Corporation Hierarchical fault management in computer systems
US6639910B1 (en) 2000-05-20 2003-10-28 Equipe Communications Corporation Functional separation of internal and external controls in network devices
US6708291B1 (en) 2000-05-20 2004-03-16 Equipe Communications Corporation Hierarchical fault descriptors in computer systems
US7225240B1 (en) 2000-05-20 2007-05-29 Ciena Corporation Decoupling processes from hardware with logical identifiers
US6671699B1 (en) 2000-05-20 2003-12-30 Equipe Communications Corporation Shared database usage in network devices
US7020696B1 (en) 2000-05-20 2006-03-28 Ciena Corp. Distributed user management information in telecommunications networks
US7222147B1 (en) 2000-05-20 2007-05-22 Ciena Corporation Processing network management data in accordance with metadata files
US7039046B1 (en) 2000-05-20 2006-05-02 Ciena Corporation Network device including central and distributed switch fabric subsystems
US7051097B1 (en) 2000-05-20 2006-05-23 Ciena Corporation Embedded database for computer system management
US6654903B1 (en) 2000-05-20 2003-11-25 Equipe Communications Corporation Vertical fault isolation in a computer system
US7062642B1 (en) 2000-05-20 2006-06-13 Ciena Corporation Policy based provisioning of network device resources
US6658580B1 (en) 2000-05-20 2003-12-02 Equipe Communications Corporation Redundant, synchronous central timing systems with constant master voltage controls and variable slave voltage controls
US6658579B1 (en) 2000-05-20 2003-12-02 Equipe Communications Corporation Network device with local timing systems for automatic selection between redundant, synchronous central timing systems
US7111053B1 (en) 2000-05-20 2006-09-19 Ciena Corporation Template-driven management of telecommunications network via utilization of operations support services clients
US7130870B1 (en) 2000-05-20 2006-10-31 Ciena Corporation Method for upgrading embedded configuration databases
US6548753B1 (en) * 2000-06-06 2003-04-15 Marconi Communications, Inc. Flame suppression cabinet
US7023845B1 (en) 2000-06-13 2006-04-04 Ciena Corporation Network device including multiple mid-planes
US7054272B1 (en) 2000-07-11 2006-05-30 Ciena Corporation Upper layer network device including a physical layer test port
US7143153B1 (en) 2000-11-09 2006-11-28 Ciena Corporation Internal network device dynamic health monitoring
US20020116485A1 (en) * 2001-02-21 2002-08-22 Equipe Communications Corporation Out-of-band network management channels
US20080204995A1 (en) * 2001-02-28 2008-08-28 Adc Telecommunications Inc. Telecommunications Chassis and Card
US6940730B1 (en) 2001-02-28 2005-09-06 Adc Telecommunications, Inc. Telecommunications chassis and card
US6637845B2 (en) * 2001-02-28 2003-10-28 Adc Telecommunications, Inc. Telecommunications chassis and card with flame spread containment
US7324348B2 (en) * 2001-02-28 2008-01-29 Adc Telecommunications, Inc. Telecommunications chassis and card
US7639510B2 (en) 2001-02-28 2009-12-29 Adc Telecommunications, Inc. Telecommunications chassis having a repeater card
US20060002098A1 (en) * 2001-02-28 2006-01-05 Adc Telecommunications, Inc. Telecommunications chassis and card
US20020165961A1 (en) * 2001-04-19 2002-11-07 Everdell Peter B. Network device including dedicated resources control plane
US7263597B2 (en) 2001-04-19 2007-08-28 Ciena Corporation Network device including dedicated resources control plane
US20070265039A1 (en) * 2001-05-18 2007-11-15 Adc Telecommunications, Inc. Telecommunications Chassis and Card
US7245717B2 (en) * 2001-05-18 2007-07-17 Adc Telecommunications, Inc. Telecommunications chassis and card
US20020173278A1 (en) * 2001-05-18 2002-11-21 Fritz Gregory J. Telecommunications chassis and card
US7725142B2 (en) 2001-05-18 2010-05-25 Adc Telecommunications, Inc. Telecommunications chassis and card
US20100195298A1 (en) * 2001-05-18 2010-08-05 Adc Telecommunications, Inc. Telecommunications Chassis and Card
US8014837B2 (en) 2001-05-18 2011-09-06 Adc Telecommunications, Inc. Telecommunications chassis and card
WO2003030606A1 (en) * 2001-10-04 2003-04-10 Avici Systems, Inc. Rack mounted routers
US20030142483A1 (en) * 2002-01-30 2003-07-31 Ofer Iny Switching device and a method for the configuration thereof
US6711028B2 (en) * 2002-01-30 2004-03-23 Dune Networks Switching device and a method for the configuration thereof
US6836030B2 (en) 2002-05-31 2004-12-28 Verari Systems, Inc. Rack mountable computer component power distribution unit and method
US6909611B2 (en) 2002-05-31 2005-06-21 Verari System, Inc. Rack mountable computer component and method of making same
WO2003103359A1 (en) * 2002-05-31 2003-12-11 Racksaver Inc. Methods and apparatus for mounting computer components
US20030223199A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Rack mountable computer component and method of making same
US6801428B2 (en) 2002-05-31 2004-10-05 Racksaver, Inc. Rack mountable computer component fan cooling arrangement and method
US7420805B2 (en) 2002-05-31 2008-09-02 Verari Systems, Inc. Method and apparatus for rack mounting computer components
US20050024825A1 (en) * 2002-05-31 2005-02-03 Smith John V. Rack mountable computer component fan cooling arrangement and method
KR100913513B1 (en) * 2002-05-31 2009-08-21 베라리 시스템즈, 인코포레이티드 A power distribution unit for supplying electrical power to upright computer blades
US20030221817A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Rack mountable computer component cooling method and device
US20030223193A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Method and apparatus for rack mounting computer components
US20030224645A1 (en) * 2002-05-31 2003-12-04 Racksaver, Inc. Rack mountable computer component power distribution unit and method
US20050083651A1 (en) * 2002-05-31 2005-04-21 Smith John V. Method and apparatus for rack mounting computer components
KR100911700B1 (en) 2002-05-31 2009-08-10 베라리 시스템즈, 인코포레이티드 A rack system for mounting components
KR100913511B1 (en) 2002-05-31 2009-08-21 베라리 시스템즈, 인코포레이티드 A heat sink for an active component
US6768640B2 (en) * 2002-06-28 2004-07-27 Sun Microsystems, Inc. Computer system employing redundant cooling fans
US20040070937A1 (en) * 2002-08-29 2004-04-15 Barsun Stephan K. Card support assembly
US20040174676A1 (en) * 2002-12-04 2004-09-09 Chen Shi-Tsung Computer chassis for dissipating heat and shielding electromagnetic emissions
US7136283B2 (en) 2003-06-11 2006-11-14 Hewlett-Packard Development Company, L.P. Multi-computer system
US20040252464A1 (en) * 2003-06-11 2004-12-16 Hewlett-Packard Development Company, L.P. Computer system
US20040252467A1 (en) * 2003-06-11 2004-12-16 Hewlett-Packard Development Company, L.P. Multi-computer system
US7236358B2 (en) 2003-06-11 2007-06-26 Hewlett-Packard Development Company, L.P. Computer system
US7180753B2 (en) 2003-06-26 2007-02-20 International Business Machines Corporation Server packaging architecture utilizing a blind docking processor-to-midplane mechanism
US20040264123A1 (en) * 2003-06-26 2004-12-30 International Business Machines Corporation Server packaging architecture utilizing a blind docking processor-to-midplane mechanism
US8035372B2 (en) 2004-02-25 2011-10-11 Birgit Garneyer Magnetostrictive elongation sensor
US20060278023A1 (en) * 2004-02-25 2006-12-14 Mts Sensortechnologie Gmbh & Co. Kg Magnetostrictive elongation sensor
DE102005009078A1 (en) * 2005-02-28 2006-09-07 Siemens Ag Circuit board rack apparatus with mid-plane, has one or two housing units selectively arranged on screened rack units for cooling e.g. by ventilation
EP1724660A1 (en) * 2005-04-27 2006-11-22 Hitachi, Ltd. Disk array device
US20060248380A1 (en) * 2005-04-27 2006-11-02 Hitachi, Ltd. Disk array device
US7436659B2 (en) * 2005-08-04 2008-10-14 Hewlett-Packard Development Company, L.P. Upside down PC
US20070030630A1 (en) * 2005-08-04 2007-02-08 Diaz Elizabeth Brandon S Upside down PC
US7839653B2 (en) 2005-10-07 2010-11-23 Hitachi, Ltd. Storage controller
US20070083690A1 (en) * 2005-10-07 2007-04-12 Hitachi, Ltd. Storage controller
US7522426B2 (en) * 2005-10-07 2009-04-21 Hitachi, Ltd. Storage controller
USRE48365E1 (en) 2006-12-19 2020-12-22 Mobile Motherboard Inc. Mobile motherboard
US8328026B2 (en) 2007-02-22 2012-12-11 Tellabs Operations, Inc. Apparatus and method for configuring a dual rack-mountable chassis
US20080205028A1 (en) * 2007-02-22 2008-08-28 Tellabs Operations, Inc. Stackable cable tray
US20080233858A1 (en) * 2007-02-22 2008-09-25 Tellabs Operations, Inc. Apparatus, system, and method for venting a chassis
US20110132855A1 (en) * 2007-02-22 2011-06-09 Tellabs Operations, Inc. Stackable cable tray
US20080217962A1 (en) * 2007-02-22 2008-09-11 Tellabs Operations, Inc. Apparatus and method for configuring a dual rack-mountable chassis
US7916502B2 (en) 2007-02-22 2011-03-29 Tellabs Operations, Inc. Stackable cable tray
US8944896B2 (en) 2007-02-22 2015-02-03 Tellabs Operations, Inc. Apparatus, system, and method for venting a chassis
US8605459B2 (en) 2007-02-22 2013-12-10 Tellabs Operations, Inc. Stackable cable tray
US20100246122A1 (en) * 2007-11-19 2010-09-30 Ortronics, Inc. Equipment Rack and Associated Ventilation System
US8526181B2 (en) 2007-11-19 2013-09-03 Ortronics, Inc. Cable management system including airflow functionality
US20090237880A1 (en) * 2007-11-19 2009-09-24 Ortronics, Inc. Equipment Rack And Associated Ventilation System
US20090129014A1 (en) * 2007-11-19 2009-05-21 Ortronics, Inc. Equipment Rack and Associated Ventilation System
USD803789S1 (en) 2007-11-19 2017-11-28 Ortronics, Inc. Cable management rack
US7983038B2 (en) 2007-11-19 2011-07-19 Ortronics, Inc. Equipment rack and associated ventilation system
US9345172B2 (en) 2007-11-19 2016-05-17 Ortronics, Inc. Equipment rack and associated ventilation system
US8130494B2 (en) 2007-11-19 2012-03-06 Ortronics, Inc. Equipment rack and associated ventilation system
US20090264819A1 (en) * 2008-04-16 2009-10-22 Cardiatis S.A. Method for controlling the systemic pressure in cardiac operations
US20140301499A1 (en) * 2008-11-25 2014-10-09 Micron Technology, Inc. Methods for bypassing faulty connections
US9270506B2 (en) * 2008-11-25 2016-02-23 Micron Technology, Inc. Methods for bypassing faulty connections
US7990710B2 (en) * 2008-12-31 2011-08-02 Vs Acquisition Co. Llc Data center
US8833094B2 (en) 2008-12-31 2014-09-16 Cirrascale Corporation Data center
US8842430B2 (en) 2008-12-31 2014-09-23 Cirrascale Corporation Data center
US8842420B2 (en) 2008-12-31 2014-09-23 Cirrascale Corporation Data center
US20100165565A1 (en) * 2008-12-31 2010-07-01 Hellriegal Stephen V R Data center
US20100332804A1 (en) * 2009-06-29 2010-12-30 Golla Robert T Unified high-frequency out-of-order pick queue with support for speculative instructions
US9058180B2 (en) 2009-06-29 2015-06-16 Oracle America, Inc. Unified high-frequency out-of-order pick queue with support for triggering early issue of speculative instructions
US20110078697A1 (en) * 2009-09-30 2011-03-31 Smittle Matthew B Optimal deallocation of instructions from a unified pick queue
US9286075B2 (en) 2009-09-30 2016-03-15 Oracle America, Inc. Optimal deallocation of instructions from a unified pick queue
US8410364B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Universal rack cable management system
US8441793B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal rack backplane system
US8441792B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal conduction cooling platform
US8411440B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Cooled universal hardware platform
US9113580B2 (en) 2010-07-21 2015-08-18 Birchbridge Incorporated Cooled universal hardware platform
US8259450B2 (en) * 2010-07-21 2012-09-04 Birchbridge Incorporated Mobile universal hardware platform
US20120019115A1 (en) * 2010-07-21 2012-01-26 GraphStream Incorporated Mobile universal hardware platform
US20130208413A1 (en) * 2012-02-10 2013-08-15 Yi-Kuei Huang Network attached storage device and assembling method thereof
US9295169B1 (en) 2013-09-16 2016-03-22 Advanced Testing Technologies, Inc. Common chassis for instrumentation
US9480184B1 (en) 2013-09-16 2016-10-25 Advanced Testing Technologies, Inc. Instrumentation chassis within a module
US9488673B1 (en) 2013-09-16 2016-11-08 Advanced Testing Technologies, Inc. Multi-standard instrumentation chassis
US9961787B1 (en) 2013-09-16 2018-05-01 Advanced Testing Technologies, Inc. Multi-standard instrumentation chassis

Also Published As

Publication number Publication date
EP1166607A1 (en) 2002-01-02
CA2350135A1 (en) 2000-05-25
AU6483199A (en) 2000-06-05
WO2000030421A1 (en) 2000-05-25

Similar Documents

Publication Publication Date Title
US5991163A (en) Electronic circuit board assembly and method of closely stacking boards and cooling the same
US4454566A (en) Heat removal from cabinets housing electronic equipment
US8613632B1 (en) Electrical connector assembly having thermal vents
US7430117B2 (en) Airflow system for electronics chassis
US9603289B1 (en) Chassis arrangement systems and methods for dual depth cards and dual depth faraday cages
US11088715B2 (en) Communication system having a receptacle cage with an airflow channel
TW201841433A (en) Pluggable module having cooling channel
US5933343A (en) Multi-deck power converter module
US4731698A (en) Mechanical and electrical assembling device for high-density electronic cards with thermal conduction cooling
US6879486B1 (en) Central inlet circuit board assembly
EP0611068B1 (en) Circuit card assembly
US20150181760A1 (en) Axially aligned electronic chassis
US6814582B2 (en) Rear interconnect blade for rack mounted systems
JP3720732B2 (en) Vent port and EMI waveguide for electronic devices
US4382271A (en) Electrical and thermal interconnection system for electronic circuit boards and an electrical cabinet fitted with such a system
US5436794A (en) Industrial controller card rack with heat transfer across card edges
US11735846B2 (en) Stacked card edge connector having inner contact assembly and outer contact assembly
US9681572B2 (en) System with stepped three dimensional profile and venting
US6683787B1 (en) Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US20050141200A1 (en) Backside cooling apparatus for modular platforms
US6831844B1 (en) Electronic circuit unit providing EMI shielding
KR100668588B1 (en) A device for protecting a drawer electromagnetically
US6697255B1 (en) Circuit board assembly with integrated shaping and control of flow resistance curve
CN115499391A (en) Switch, cabinet and data center
US11665857B2 (en) Heat sink assembly for an electrical connector assembly

Legal Events

Date Code Title Description
AS Assignment

Owner name: NEXABIT NETWORKS, INC., MASSACHUSETTS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MARCONI, PETER;BILODEAU, THEODORE W.;RIGBY, MICHAEL J.;REEL/FRAME:009702/0441

Effective date: 19981031

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FEPP Fee payment procedure

Free format text: PAT HOLDER NO LONGER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: STOL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

REFU Refund

Free format text: REFUND - SURCHARGE, PETITION TO ACCEPT PYMT AFTER EXP, UNINTENTIONAL (ORIGINAL EVENT CODE: R2551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12

AS Assignment

Owner name: OMEGA CREDIT OPPORTUNITIES MASTER FUND, LP, NEW YORK

Free format text: SECURITY INTEREST;ASSIGNOR:WSOU INVESTMENTS, LLC;REEL/FRAME:043966/0574

Effective date: 20170822

Owner name: OMEGA CREDIT OPPORTUNITIES MASTER FUND, LP, NEW YO

Free format text: SECURITY INTEREST;ASSIGNOR:WSOU INVESTMENTS, LLC;REEL/FRAME:043966/0574

Effective date: 20170822

AS Assignment

Owner name: WSOU INVESTMENTS, LLC, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ALCATEL LUCENT;REEL/FRAME:044000/0053

Effective date: 20170722

AS Assignment

Owner name: WSOU INVESTMENTS, LLC, CALIFORNIA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:OCO OPPORTUNITIES MASTER FUND, L.P. (F/K/A OMEGA CREDIT OPPORTUNITIES MASTER FUND LP;REEL/FRAME:049246/0405

Effective date: 20190516

AS Assignment

Owner name: OT WSOU TERRIER HOLDINGS, LLC, CALIFORNIA

Free format text: SECURITY INTEREST;ASSIGNOR:WSOU INVESTMENTS, LLC;REEL/FRAME:056990/0081

Effective date: 20210528