US5272599A - Microprocessor heat dissipation apparatus for a printed circuit board - Google Patents
Microprocessor heat dissipation apparatus for a printed circuit board Download PDFInfo
- Publication number
- US5272599A US5272599A US08/034,346 US3434693A US5272599A US 5272599 A US5272599 A US 5272599A US 3434693 A US3434693 A US 3434693A US 5272599 A US5272599 A US 5272599A
- Authority
- US
- United States
- Prior art keywords
- circuit board
- printed circuit
- metal
- thermally conductive
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Definitions
- the present invention generally relates to printed circuit board apparatus and, in a preferred embodiment thereof, more particularly relates to apparatus for dissipating heat from a printed circuit board-mounted microprocessor.
- Microprocessors are normally encased in a ceramic material which, as is well known, is a relatively poor conductor of heat. Accordingly, heat generated within the chip during its operation is difficult to remove through the insulation-like ceramic shroud within which the chip circuitry is encased.
- a conventional approach to dissipating the internal chip heat has been to mount cooling fins on the top or outer side of the ceramic outer chip body portion.
- top-mounted cooling fins on modern, higher speed microprocessor chips has not proven to be entirely successful in adequately removing internally generated heat from the chips due to the relatively low heat transfer coefficient of the ceramic material between the microprocessor's core silicon and the top-mounted cooling fins. Additionally, the use of these top mounted cooling fins tends to block from view the trademark, serial number and other important information typically stamped on the top side of the chip by its manufacturer.
- apparatus for dissipating internal operating heat generated by a computer microprocessor chip operatively and removably mounted on a top side of a printed circuit board disposed within a metal housing chassis.
- the microprocessor chip is spaced upwardly apart from the top side of the circuit board in a generally parallel relationship therewith and is of a conventional construction, having a ceramic body portion and a metal underside cover section.
- the heat dissipation apparatus comprises an opening formed through the printed circuit board and underlying the metal underside section of the microprocessor chip, and a thermally conductive heat dissipation structure operative to receive internal operating heat generated by the microprocessor chip and conductively and convectively dissipate the received heat.
- the heat dissipation structure extends through the printed circuit board opening and has a first end portion secured to the metal underside section of the microprocessor chip in thermal communication thereof, and a second end portion secured to the metal housing chassis in thermal communication therewith.
- the heat dissipation structure includes a sheet metal heat transfer plate and a metal heat conductor block.
- the heat conductor block is removably received in the printed circuit board opening and has an upper end surface fixedly secured to a central portion of the metal underside section of the chip with heat conductive cement, and a lower end surface spaced downwardly apart from the bottom side of the circuit board.
- the heat transfer plate is fixedly secured to an edge portion of the printed circuit board and has a first portion which underlies and is removably secured to the lower end surface of the heat conductor block with a threaded fastener, a layer of heat conductive grease being preferably interposed between the first heat transfer portion and the lower end surface of the heat conductor block.
- a second portion of the heat transfer plate extends outwardly beyond the edge portion of the printed circuit board, representatively in the plane of the circuit board, and has an outer end secured to a wall of the metal housing chassis by bracket structures.
- the convective heat transfer from the heat dissipation structure may be augmented by connecting a cooling fin structure to the second heat transfer plate portion in thermal communication therewith.
- FIG. 1 is a simplified top plan view of a portion of a printed circuit board having a representative high speed computer microprocessor chip mounted on the top side thereof and thermally coupled to a unique heat dissipation structure embodying principles of the present invention
- FIG. 2 is a simplified, partly elevational cross-sectional view through the printed circuit board taken along line 2--2 of FIG. 1.
- FIGS. 1 and 2 Illustrated in FIGS. 1 and 2 is a printed circuit board 10 mounted within a metal computer chassis, one wall 12 of which is shown in phantom.
- a representative high speed microprocessor chip 16 of conventional construction Removably mounted on the top side of the printed circuit board 10, by means of a conventional pin connector structure 14, is a representative high speed microprocessor chip 16 of conventional construction.
- Chip 16 has a thin rectangular configuration defined by a hollow rectangular ceramic body portion 18, within which the internal chip circuitry is encased, and a thin metal cover portion 20 over the die on the underside of the chip body 18.
- the installed chip 16 is an upwardly spaced, parallel relationship with the top side of the printed circuit board 10.
- the pin connector structure 14 operatively couples the internal chip circuitry to the circuitry of the board 10.
- the board circuitry has not been shown on the drawings.
- Assembly 22 includes a heat transfer plate 24, formed from a highly conductive sheet metal material such as aluminum or nickel-plated copper; and a highly conductive rectangular metal block 26, preferably a copper block, having a threaded circular bore 28 extending upwardly through its bottom side.
- the heat transfer plate 24 has an upturned right end portion 24a; a flat portion 24b positioned to the right of the printed circuit board 10 and lying generally in the same plane therewith; a downwardly and leftwardly sloped portion 24c; a flat portion 24d underlying a right edge portion of the printed circuit board 10 and secured thereto with rivets 30 or other suitable fastening members; a downwardly and leftwardly sloped portion 24e; and a flat left end portion 24f extending beneath the printed circuit board in a parallel, downwardly spaced relationship therewith.
- the upturned right end portion 24a of the heat transfer plate 24 is secured to the metal chassis wall 12, in a thermally conductive relationship with, by means of a spaced plurality of metal brackets 32.
- a metal cooling fin structure 34 defined by a mutually spaced series of prefabricated or sheet metal punched fins 34a, is preferably secured atop the heat transfer plate portion 24b.
- the heat transfer plate portion 24f underlies a rectangular opening 36 formed through the printed circuit board 10 beneath a central portion of the metal underside cover section 20 of the microprocessor chip 16.
- Metal block 26 is complementarily received in the circuit board opening 36, with the top side of the block being secured to the underside of the metal chip cover section 20 with a layer of a suitable heat conducting cement material 38.
- the bottom side of the metal block 26 is spaced downwardly apart from the circuit board 10 and is secured to the top side of the heat transfer plate portion 24f by a screw 40 or other type of threaded fastener upwardly extended through an optional spacer 42, and an opening in the heat transfer plate portion 24f, and threaded into the metal block bore 28.
- the underside of the metal block 26 is maintained in intimate heat conductive contact with the top side of the heat transfer plate portion 24f using a layer of heat conductive grease 44.
- heat generated by the internal chip die is sequentially conducted to the heat transfer plate portion 24f through the metal bottom chip cover portion 20, the heat conducting cement 38, the metal block 26 and the heat conductive grease 44.
- Heat transferred downwardly to the plate 24 in this manner is dissipated by convection (assisted in this heat transfer mode by the optional cooling fin structure 34) from the plate, and by conduction through the plate 24 to the metal housing chassis (via its illustrated wall 12) which serves as a heat sink for even greater heat dissipation.
- the downward spacing of the plate portion 24f from the underside of the printed circuit board 10 exposes both sides of this portion of the plate to air within the chassis housing, thereby enhancing convective heat dissipation from the plate portion 24f.
- This heat dissipation technique of the present invention uniquely avoids the problems and limitations associated with the prior art method of attempting to dissipate heat from the top side of the ceramic body portion 18 of the microprocessor chip 16 using cooling fins attached thereto.
- the chip heat is removed instead directly from much more thermally conductive metal underside portion 20 of the chip and dissipated through an extended heat sink collectively defined by the block 26, the plate 24, the cooling fin structure 34 (if used), and the metal housing chassis.
- the important indicia typically imprinted thereon is conveniently left unobscured by cooling apparatus.
- the configuration and structure of the heat dissipation assembly 22 permits the microprocessor chip 16 to be easily and quickly installed on and removed from the printed circuit board 10.
- the metal block 26 is extended downwardly through the circuit board opening 36 and secured to the heat transfer plate portion 24f using the screw 40 and, if desired, the heat conductive grease 44.
- the heat conducting cement 38 is then applied to the top side of the installed metal block 26 (or to a central portion of the metal chip cover 20) and the chip is operatively inserted into its associated pin connector structure 14. This engages the metal underside portion 20 of the chip with the top side of the metal block 26, thereby slightly deflecting the plate portion 24f in a downward direction and cementing the chip 16 to the block 26.
- the screw 40 is simply removed from the block 26 and the chip is pulled upwardly out of its connector structure 14, carrying the metal block 26 with it.
- a replacement chip may then be installed as described above, using another metal block 26.
Abstract
Description
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US08/034,346 US5272599A (en) | 1993-03-19 | 1993-03-19 | Microprocessor heat dissipation apparatus for a printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/034,346 US5272599A (en) | 1993-03-19 | 1993-03-19 | Microprocessor heat dissipation apparatus for a printed circuit board |
Publications (1)
Publication Number | Publication Date |
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US5272599A true US5272599A (en) | 1993-12-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US08/034,346 Expired - Lifetime US5272599A (en) | 1993-03-19 | 1993-03-19 | Microprocessor heat dissipation apparatus for a printed circuit board |
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PCT/US91/03839 Heat Sink for Heat Generating Components Dec. 1991. * |
Cited By (200)
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