US20090040718A1 - Heat dissipating assembly having a fan duct - Google Patents
Heat dissipating assembly having a fan duct Download PDFInfo
- Publication number
- US20090040718A1 US20090040718A1 US11/836,718 US83671807A US2009040718A1 US 20090040718 A1 US20090040718 A1 US 20090040718A1 US 83671807 A US83671807 A US 83671807A US 2009040718 A1 US2009040718 A1 US 2009040718A1
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- Prior art keywords
- fan duct
- fan
- inlet
- heat dissipating
- heat
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to a heat dissipating assembly, and more particularly to a heat dissipating assembly incorporating a fan duct for guiding airflow generated by fans to cool at least two different electronic components.
- the central processing unit (CPU) mounted on the motherboard in a computer is the center of operations of the computer. During the operation of the computer, the CPU produces heat. The heat must be quickly carried away from the CPU during the operation of the computer. Excessively high temperature causes the CPU to work abnormally.
- a voltage regulator module (VRM) near to the CPU is also a source of heat that needs to be cooled.
- a related heat sink having a fan duct is mounted on the CPU to remove heat therefrom.
- a fan is often mounted on the fan duct to provide forced airflow to the heat sink.
- U.S. Pat. No. 6,304,445 B1 One example of the related art is disclosed in U.S. Pat. No. 6,304,445 B1.
- the related heat sink mounted in the computer can only dissipate heat generated by the CPU, and cannot dissipate the heat generated by other heat-generating electronic components, such as a VRM next to the CPU because the airflow generated by the fan is not guided to flow through the other heat-generating electronic components.
- a heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously; the heat dissipating assembly includes a base contacting the CPU, a heat sink mounted on the base, a pair of fans attached on a front side of the heat sink, and a fan duct secured to the fans.
- the fan duct includes a first inlet through which a part of airflow flows into the fan duct, a second inlet through which another part of the airflow flows into the fan duct.
- the airflow in the fan duct flows to the heat sink via an outlet of the fan duct, thereby to dissipate heat absorbed by the heat sink from the CPU.
- the another part of the airflow flows through the VRM when it is drawn into the fan duct via the second inlet, whereby heat generated by the VRM is dissipated.
- FIG. 1 is an assembled, isometric view of a heat dissipating assembly in accordance with a preferred embodiment of the present invention
- FIG. 2 is a partly exploded view of FIG. 1 ;
- FIG. 3 is an isometric view of a fan duct of FIG. 1 ;
- FIG. 4 is an inverted view of the fan duct of FIG. 3 .
- a heat dissipating assembly in accordance with a preferred embodiment of the present invention comprises a base 10 for absorbing heat generated by a CPU (not shown), a heat sink 20 contacting the base 10 , a pair of fans 30 attached to a front side of the heat sink 20 , and a fan duct 40 secured to the fans 30 .
- the CPU is mounted on a printed circuit board (not shown); a VRM (not shown) is also mounted on the printed circuit board near the CPU.
- the base 10 has a rectangular configuration with four locking feet 12 (only three being shown) extending downwardly and perpendicularly from a bottom face at four corners thereof, wherein the bottom face of the base 10 contacts the CPU for absorbing heat therefrom.
- Each locking foot 12 defines a through hole (not labeled) therein for providing a passage of a screw 50 therethrough.
- the screws 50 are used for extending through the printed circuit board and threadedly engage with a back plate (not shown) underneath the printed circuit board, thereby attaching the heat dissipating assembly to the printed circuit board.
- the heat sink 20 comprises a cubic body 22 and a rectangular protrusion 24 projecting from a rear face at a bottom of the body 22 .
- the body 22 and the protrusion 24 cooperatively define a rectangular bottom face of the heat sink 20 to contact and thermally connect with a top face of the base 10 .
- the bottom face of the heat sink 20 has an area less than that of the base 10 to thereby form a border portion 14 of the base 10 outside reach of the heat sink 20 .
- Eight threaded holes (not shown) are defined at a front face of the heat sink 20 and adjacent to a periphery of the heat sink 20 . The eight threaded holes are used for mounting the two fans 30 to the heat sink 20 .
- the fans 30 are axial fans. Each fan 30 has a substantially square shape with four through holes 32 defined at four corners thereof, corresponding to four of the eight threaded holes of the heat sink 20 .
- the fans 30 are attached to the front face of the heat sink 20 and approximate to each other in a manner such that one of the fans 30 is located at a lower position and the other one of the fans 30 is located at an upper position along a height direction of the heat sink 20 .
- the fans 30 occupy almost a total area of the front face of the heat sink 20 .
- Six screws (not shown) are brought to extend through upper six through holes 32 of the fans 30 to threadedly engage in corresponding threaded holes of the heat sink 20 , thereby securing the fans 30 to the heat sink 20 firmly.
- the fan duct 40 comprises a rectangular top plate 42 , a front plate 44 , a baffle plate 46 , and a pair of lateral plates 48 .
- the top plate 42 is parallel to the base 10 and defines a pair of through holes 420 at two lateral sides thereof.
- the front plate 44 is formed perpendicularly and downwardly from a front side of the top plate 42 and parallel to the front face of the heat sink 20 .
- a first inlet 440 is defined in the front plate 44 with a protective cage 442 covering the first inlet 440 , thus preventing an operator from injury by carelessly touching blades of an impeller (not labeled) of the upper fan 30 when the fans are in operation.
- the protective cage 442 defines a central hole 444 in alignment with a hub of the impeller of the upper fan 30 .
- the protective cage 442 comprises a plurality of annular strips (not labeled) concentrically surrounding the hole 444 , and a plurality of elongated strips (not labeled) slantwise interconnecting the annular strips, wherein the elongated strips are arranged in volute respective to the hole 444 .
- the first inlet 440 provides an entry of airflow into the fan duct 40 .
- the baffle plate 46 extends downwardly and outwardly from a bottom side of the front plate 44 , wherein the baffle plate 46 has an arced, downwardly gradually expanding portion 462 attached to the front plate 44 , and a planar portion 464 parallel to the front plate 44 and connecting to a bottom edge of the arced portion 462 to define an outward, downwardly expanding port for the airflow.
- the lateral plates 48 couple the top plate 42 with the front plate 44 and the baffle plate 46 .
- the lateral plates 48 and the top plate 42 cooperatively define a rectangular outlet 480 for the fan duct 40 in a rear side thereof.
- the outlet 480 has an area similar to that the fans 30 occupy.
- Bottoms of the lateral plates 48 and the baffle plate 46 cooperatively define a rectangular second inlet 460 for the fan duct 40 .
- the lateral plates 48 are oriented perpendicular to the top plate 42 and the front plate 44 , so that the second inlet 460 is parallel to the top plate 42 and the outlet 480 is parallel to the front plate 44 .
- the second inlet 460 is oriented perpendicular to the outlet 480 .
- the first inlet 440 is oriented parallel to the outlet 480 .
- the second inlet 460 communicates with the outlet 480 for providing a passage of the airflow.
- flanges 482 extend inwardly and vertically from inner sides of the lateral plates 48 and the top plate 42 at the rear side of the fan duct 40 , wherein two flanges 482 are located at junctions of the top plate 42 and the lateral plates 48 , and the other two flanges 482 are located at central portions of the lateral plates 48 respectively.
- a pair of engaging tabs 484 are formed inwardly and perpendicularly from the lateral plates 48 and at the rear side of the fan duct 40 adjacent to the second inlet 460 thereof.
- the engaging tabs 484 are coplanar with the flanges 482 and parallel to the front plate 44 .
- a through hole 486 is defined in each engaging tab 484 .
- the flanges 482 are glued to the fans 30 at positions corresponding to the upper six through holes 32 of the fans 30 .
- the engaging tabs 484 are secured to the lower fan 30 by extending a pair of screws 60 through the through holes 486 of the fan duct 40 and lower two through holes 32 of the lower fan 30 to threadedly engage in corresponding threaded holes of the heat sink 20 .
- the fan duct 40 is securely attached to the fans 30 .
- the outlet 480 is adjacent to and oriented towards the fans 30 ; the first inlet 440 and the second inlet 460 are spaced from the fans 30 via the outlet 480 in a manner such that the first inlet 440 is located in a front of the upper fan 30 , and the second inlet 460 is located below the lower fan 30 and above the base 10 and oriented toward the VRM on the printed circuit board.
- the heat generated by the CPU is conducted to the heat sink 20 via the base 10 .
- a part of the airflow is drawn into the fan duct 40 via the first inlet 440 by the upper fan 30 , and passes through the outlet 480 to blow an upper portion of the heat sink 20 , thereby removing the heat from the heat sink 20 .
- Another part of the airflow is driven into the fan duct 40 via the second inlet 460 by the lower fan 30 .
- the another part of the airflow flows through the VRM on the printed circuit board to thereby cool the VRM.
- the another part of airflow in the fan duct 40 is reflected by the baffle plate 46 of the fan duct 40 and drawn by the lower fan 30 into a lower portion of the heat sink 20 .
- the heat in the heat sink 20 from the CPU is also taken away by the another part of the airflow. Therefore, the airflow generated by the fans 30 can cool not only the CPU, but also the VRM beside the CPU.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a heat dissipating assembly, and more particularly to a heat dissipating assembly incorporating a fan duct for guiding airflow generated by fans to cool at least two different electronic components.
- 2. Description of Related Art
- The central processing unit (CPU) mounted on the motherboard in a computer is the center of operations of the computer. During the operation of the computer, the CPU produces heat. The heat must be quickly carried away from the CPU during the operation of the computer. Excessively high temperature causes the CPU to work abnormally. In addition to the CPU, a voltage regulator module (VRM) near to the CPU is also a source of heat that needs to be cooled.
- Typically, a related heat sink having a fan duct is mounted on the CPU to remove heat therefrom. A fan is often mounted on the fan duct to provide forced airflow to the heat sink. One example of the related art is disclosed in U.S. Pat. No. 6,304,445 B1. However, the related heat sink mounted in the computer can only dissipate heat generated by the CPU, and cannot dissipate the heat generated by other heat-generating electronic components, such as a VRM next to the CPU because the airflow generated by the fan is not guided to flow through the other heat-generating electronic components.
- What is needed, therefore, is a heat dissipating assembly which can overcome the above-mentioned disadvantage.
- A heat dissipating assembly is disclosed for dissipating heat from a CPU and a VRM simultaneously; the heat dissipating assembly includes a base contacting the CPU, a heat sink mounted on the base, a pair of fans attached on a front side of the heat sink, and a fan duct secured to the fans. The fan duct includes a first inlet through which a part of airflow flows into the fan duct, a second inlet through which another part of the airflow flows into the fan duct. The airflow in the fan duct flows to the heat sink via an outlet of the fan duct, thereby to dissipate heat absorbed by the heat sink from the CPU. The another part of the airflow flows through the VRM when it is drawn into the fan duct via the second inlet, whereby heat generated by the VRM is dissipated.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
- Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat dissipating assembly in accordance with a preferred embodiment of the present invention; -
FIG. 2 is a partly exploded view ofFIG. 1 ; -
FIG. 3 is an isometric view of a fan duct ofFIG. 1 ; and -
FIG. 4 is an inverted view of the fan duct ofFIG. 3 . - Referring to
FIG. 1 , a heat dissipating assembly in accordance with a preferred embodiment of the present invention comprises abase 10 for absorbing heat generated by a CPU (not shown), aheat sink 20 contacting thebase 10, a pair offans 30 attached to a front side of theheat sink 20, and afan duct 40 secured to thefans 30. The CPU is mounted on a printed circuit board (not shown); a VRM (not shown) is also mounted on the printed circuit board near the CPU. - As shown in
FIG. 2 , thebase 10 has a rectangular configuration with four locking feet 12 (only three being shown) extending downwardly and perpendicularly from a bottom face at four corners thereof, wherein the bottom face of thebase 10 contacts the CPU for absorbing heat therefrom. Eachlocking foot 12 defines a through hole (not labeled) therein for providing a passage of ascrew 50 therethrough. Thescrews 50 are used for extending through the printed circuit board and threadedly engage with a back plate (not shown) underneath the printed circuit board, thereby attaching the heat dissipating assembly to the printed circuit board. - The
heat sink 20 comprises acubic body 22 and arectangular protrusion 24 projecting from a rear face at a bottom of thebody 22. Thebody 22 and theprotrusion 24 cooperatively define a rectangular bottom face of theheat sink 20 to contact and thermally connect with a top face of thebase 10. The bottom face of theheat sink 20 has an area less than that of thebase 10 to thereby form aborder portion 14 of thebase 10 outside reach of theheat sink 20. Eight threaded holes (not shown) are defined at a front face of theheat sink 20 and adjacent to a periphery of theheat sink 20. The eight threaded holes are used for mounting the twofans 30 to theheat sink 20. - The
fans 30 are axial fans. Eachfan 30 has a substantially square shape with four throughholes 32 defined at four corners thereof, corresponding to four of the eight threaded holes of theheat sink 20. Thefans 30 are attached to the front face of theheat sink 20 and approximate to each other in a manner such that one of thefans 30 is located at a lower position and the other one of thefans 30 is located at an upper position along a height direction of theheat sink 20. Thefans 30 occupy almost a total area of the front face of theheat sink 20. Six screws (not shown) are brought to extend through upper six throughholes 32 of thefans 30 to threadedly engage in corresponding threaded holes of theheat sink 20, thereby securing thefans 30 to the heat sink 20 firmly. - Also referring to
FIGS. 3-4 , thefan duct 40 comprises arectangular top plate 42, afront plate 44, abaffle plate 46, and a pair oflateral plates 48. Thetop plate 42 is parallel to thebase 10 and defines a pair of throughholes 420 at two lateral sides thereof. Thefront plate 44 is formed perpendicularly and downwardly from a front side of thetop plate 42 and parallel to the front face of theheat sink 20. Afirst inlet 440 is defined in thefront plate 44 with aprotective cage 442 covering thefirst inlet 440, thus preventing an operator from injury by carelessly touching blades of an impeller (not labeled) of theupper fan 30 when the fans are in operation. Theprotective cage 442 defines acentral hole 444 in alignment with a hub of the impeller of theupper fan 30. Theprotective cage 442 comprises a plurality of annular strips (not labeled) concentrically surrounding thehole 444, and a plurality of elongated strips (not labeled) slantwise interconnecting the annular strips, wherein the elongated strips are arranged in volute respective to thehole 444. Thefirst inlet 440 provides an entry of airflow into thefan duct 40. Thebaffle plate 46 extends downwardly and outwardly from a bottom side of thefront plate 44, wherein thebaffle plate 46 has an arced, downwardly gradually expandingportion 462 attached to thefront plate 44, and aplanar portion 464 parallel to thefront plate 44 and connecting to a bottom edge of thearced portion 462 to define an outward, downwardly expanding port for the airflow. Thelateral plates 48 couple thetop plate 42 with thefront plate 44 and thebaffle plate 46. Thelateral plates 48 and thetop plate 42 cooperatively define arectangular outlet 480 for thefan duct 40 in a rear side thereof. Theoutlet 480 has an area similar to that thefans 30 occupy. Bottoms of thelateral plates 48 and thebaffle plate 46 cooperatively define a rectangularsecond inlet 460 for thefan duct 40. Thelateral plates 48 are oriented perpendicular to thetop plate 42 and thefront plate 44, so that thesecond inlet 460 is parallel to thetop plate 42 and theoutlet 480 is parallel to thefront plate 44. In other words, thesecond inlet 460 is oriented perpendicular to theoutlet 480. Moreover, thefirst inlet 440 is oriented parallel to theoutlet 480. Thesecond inlet 460 communicates with theoutlet 480 for providing a passage of the airflow. Fourflanges 482 extend inwardly and vertically from inner sides of thelateral plates 48 and thetop plate 42 at the rear side of thefan duct 40, wherein twoflanges 482 are located at junctions of thetop plate 42 and thelateral plates 48, and the other twoflanges 482 are located at central portions of thelateral plates 48 respectively. A pair of engagingtabs 484 are formed inwardly and perpendicularly from thelateral plates 48 and at the rear side of thefan duct 40 adjacent to thesecond inlet 460 thereof. The engagingtabs 484 are coplanar with theflanges 482 and parallel to thefront plate 44. A throughhole 486 is defined in each engagingtab 484. Theflanges 482 are glued to thefans 30 at positions corresponding to the upper six throughholes 32 of thefans 30. The engagingtabs 484 are secured to thelower fan 30 by extending a pair ofscrews 60 through the throughholes 486 of thefan duct 40 and lower two throughholes 32 of thelower fan 30 to threadedly engage in corresponding threaded holes of theheat sink 20. Thus, thefan duct 40 is securely attached to thefans 30. Theoutlet 480 is adjacent to and oriented towards thefans 30; thefirst inlet 440 and thesecond inlet 460 are spaced from thefans 30 via theoutlet 480 in a manner such that thefirst inlet 440 is located in a front of theupper fan 30, and thesecond inlet 460 is located below thelower fan 30 and above thebase 10 and oriented toward the VRM on the printed circuit board. - In use, the heat generated by the CPU is conducted to the
heat sink 20 via thebase 10. As rotations of the impellers of thefans 30, a part of the airflow is drawn into thefan duct 40 via thefirst inlet 440 by theupper fan 30, and passes through theoutlet 480 to blow an upper portion of theheat sink 20, thereby removing the heat from theheat sink 20. Another part of the airflow is driven into thefan duct 40 via thesecond inlet 460 by thelower fan 30. The another part of the airflow flows through the VRM on the printed circuit board to thereby cool the VRM. Moreover, the another part of airflow in thefan duct 40 is reflected by thebaffle plate 46 of thefan duct 40 and drawn by thelower fan 30 into a lower portion of theheat sink 20. Thus, the heat in theheat sink 20 from the CPU is also taken away by the another part of the airflow. Therefore, the airflow generated by thefans 30 can cool not only the CPU, but also the VRM beside the CPU. - It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (16)
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US11/836,718 US7495913B1 (en) | 2007-08-09 | 2007-08-09 | Heat dissipating assembly having a fan duct |
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US11/836,718 US7495913B1 (en) | 2007-08-09 | 2007-08-09 | Heat dissipating assembly having a fan duct |
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US20090040718A1 true US20090040718A1 (en) | 2009-02-12 |
US7495913B1 US7495913B1 (en) | 2009-02-24 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20110026219A1 (en) * | 2009-07-31 | 2011-02-03 | Hewlett-Packard Development Company, L.P. | Heat transfer systems and methods |
US20130319641A1 (en) * | 2012-06-01 | 2013-12-05 | Asustek Computer Inc. | Heat dissipating module |
US20140133102A1 (en) * | 2012-11-13 | 2014-05-15 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating assembly and electronic device assembly with heat dissipating assembly |
CN114007352A (en) * | 2021-09-28 | 2022-02-01 | 广州市力驰微电子科技有限公司 | A/D conversion circuit module structure and heat dissipation method |
Families Citing this family (4)
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US7633755B2 (en) * | 2007-11-15 | 2009-12-15 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board |
CN101730451B (en) * | 2008-10-24 | 2013-02-20 | 富准精密工业(深圳)有限公司 | Heat radiation device |
EP2412215A1 (en) * | 2009-03-25 | 2012-02-01 | Hewlett-Packard Development Company, L.P. | Grid heat sink |
EP3756430B1 (en) | 2018-05-31 | 2023-11-08 | Hewlett-Packard Development Company, L.P. | Thermal modules for electronic devices |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6021042A (en) * | 1997-08-06 | 2000-02-01 | Intel Corporation | Cooling duct for a computer cooling system with redundant air moving units |
US6155920A (en) * | 1998-12-18 | 2000-12-05 | Lite-On Enclosure Inc. | Air ducts structure of a radiating fan |
US6163453A (en) * | 1998-12-28 | 2000-12-19 | Foxconn Precision Components Co., Ltd. | Heat dissipation enhancing device |
US6256197B1 (en) * | 2000-01-14 | 2001-07-03 | Oscar Galis | Retrofit Computer Cooler |
US6304445B1 (en) * | 2000-04-27 | 2001-10-16 | Sun Microsystems, Inc. | Fan heat sink and method |
US6370023B1 (en) * | 2000-07-21 | 2002-04-09 | Inventec Corporation | Case assembly for computer mainframe |
US6400568B1 (en) * | 2001-07-11 | 2002-06-04 | Sun Microsystems, Inc. | Method and apparatus for cooling electronic components |
US6496368B2 (en) * | 2001-05-14 | 2002-12-17 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US20050280990A1 (en) * | 2004-06-21 | 2005-12-22 | Goodenough Ryan K | Fan module |
US7042722B2 (en) * | 2003-05-29 | 2006-05-09 | Hitachi, Ltd. | Electronic equipment |
US7113403B2 (en) * | 2004-04-07 | 2006-09-26 | Asia Vital Component Co., Ltd. | Centrifugal fan type cooling module |
US7261516B2 (en) * | 2005-07-09 | 2007-08-28 | Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd. | Fan holder assembly |
US7304845B2 (en) * | 2005-11-02 | 2007-12-04 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink assembly |
US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
-
2007
- 2007-08-09 US US11/836,718 patent/US7495913B1/en not_active Expired - Fee Related
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6021042A (en) * | 1997-08-06 | 2000-02-01 | Intel Corporation | Cooling duct for a computer cooling system with redundant air moving units |
US6155920A (en) * | 1998-12-18 | 2000-12-05 | Lite-On Enclosure Inc. | Air ducts structure of a radiating fan |
US6163453A (en) * | 1998-12-28 | 2000-12-19 | Foxconn Precision Components Co., Ltd. | Heat dissipation enhancing device |
US6256197B1 (en) * | 2000-01-14 | 2001-07-03 | Oscar Galis | Retrofit Computer Cooler |
US6304445B1 (en) * | 2000-04-27 | 2001-10-16 | Sun Microsystems, Inc. | Fan heat sink and method |
US6370023B1 (en) * | 2000-07-21 | 2002-04-09 | Inventec Corporation | Case assembly for computer mainframe |
US6496368B2 (en) * | 2001-05-14 | 2002-12-17 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US6400568B1 (en) * | 2001-07-11 | 2002-06-04 | Sun Microsystems, Inc. | Method and apparatus for cooling electronic components |
US7042722B2 (en) * | 2003-05-29 | 2006-05-09 | Hitachi, Ltd. | Electronic equipment |
US7113403B2 (en) * | 2004-04-07 | 2006-09-26 | Asia Vital Component Co., Ltd. | Centrifugal fan type cooling module |
US20050280990A1 (en) * | 2004-06-21 | 2005-12-22 | Goodenough Ryan K | Fan module |
US7261516B2 (en) * | 2005-07-09 | 2007-08-28 | Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd. | Fan holder assembly |
US7304845B2 (en) * | 2005-11-02 | 2007-12-04 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink assembly |
US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110026219A1 (en) * | 2009-07-31 | 2011-02-03 | Hewlett-Packard Development Company, L.P. | Heat transfer systems and methods |
US7933119B2 (en) | 2009-07-31 | 2011-04-26 | Hewlett-Packard Development Company, L.P. | Heat transfer systems and methods |
US20130319641A1 (en) * | 2012-06-01 | 2013-12-05 | Asustek Computer Inc. | Heat dissipating module |
US9383787B2 (en) * | 2012-06-01 | 2016-07-05 | Asustek Computer Inc. | Heat dissipating module |
US20140133102A1 (en) * | 2012-11-13 | 2014-05-15 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating assembly and electronic device assembly with heat dissipating assembly |
CN114007352A (en) * | 2021-09-28 | 2022-02-01 | 广州市力驰微电子科技有限公司 | A/D conversion circuit module structure and heat dissipation method |
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