US20060045777A1 - Fans and electronic devices utilizing the same - Google Patents

Fans and electronic devices utilizing the same Download PDF

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Publication number
US20060045777A1
US20060045777A1 US11/214,808 US21480805A US2006045777A1 US 20060045777 A1 US20060045777 A1 US 20060045777A1 US 21480805 A US21480805 A US 21480805A US 2006045777 A1 US2006045777 A1 US 2006045777A1
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United States
Prior art keywords
fan
frame
extended portion
airflow
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/214,808
Inventor
Yu-Chien Kao
Yi-Fang Chou
Tsu-Liang Lin
Wen-Shi Huang
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Delta Electronics Inc
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Delta Electronics Inc
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Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOU, YI-FANG, HUANG, WEN-SHI, KAO, YU-CHIEN, LIN, TSU-LIANG
Publication of US20060045777A1 publication Critical patent/US20060045777A1/en
Abandoned legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/52Casings; Connections of working fluid for axial pumps
    • F04D29/54Fluid-guiding means, e.g. diffusers
    • F04D29/541Specially adapted for elastic fluid pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/52Casings; Connections of working fluid for axial pumps
    • F04D29/54Fluid-guiding means, e.g. diffusers
    • F04D29/541Specially adapted for elastic fluid pumps
    • F04D29/545Ducts
    • F04D29/547Ducts having a special shape in order to influence fluid flow

Definitions

  • the invention relates to fans, and in particular, to fans for electronic devices.
  • airflow outlet/inlet size thereof is increased to raise airflow.
  • conventional fans utilize a square frame, as shown in FIG. 1A . Due to limitations of the frame 10 , the extended ramp 11 design of the airflow outlet/inlet cannot be optimized to maximize airflow.
  • FIG. 1B is a sectional diagram of the fan frame in FIG. 1A along line a-a.
  • FIG. 1B shows an airflow field generated by the fan in FIG. 1A .
  • the notation ‘w’ represents the airflow field
  • ‘ 13 ’ represents the center line of the fan
  • ‘ 1 a ’ represents a heat source.
  • the fan is disposed in system 1 , and the heat source la is on the center line 13 .
  • the heat source 1 a cannot always be directly on the center line 13 of the fan because other components in the system occupy the same space. In such cases, a new fan of a larger size or with a higher rotational speed is required, raising production costs and generating relatively more noise.
  • U.S. Pat. No. 6,386,843 discloses a fan capable of dissipating heat from a plurality of heat sources.
  • the fan 20 has a ramp 21 formed on the frame and an extended portion 22 on its side, thereby improving heat dissipation capability.
  • the shape of the frame is basically square. Thus, the square frame is not suitable when system space is limited.
  • An exemplary embodiment of an electronic device comprises a housing, a heat source, and a fan.
  • the housing comprises a fan cavity.
  • the heat source is disposed in the housing.
  • the fan is disposed in the fan cavity.
  • the fan comprises a frame.
  • the frame comprises an airflow outlet, an airflow inlet, and a first extended portion.
  • the first extended portion is disposed at the airflow outlet or the airflow inlet.
  • An inclined angle, an entending direction or a position of the first extended portion is adjusted according to a position or a shape of the fan cavity or the heat source.
  • An exemplary embodiment of a fan for dissipating heat from a heat source, comprises a frame and a blade.
  • the frame comprises an airflow outlet, an airflow inlet, and a first extended portion.
  • the first extended portion is disposed at the airflow outlet or the airflow inlet.
  • An inclined angle, an entending direction or a position of the first extended portion is adjusted according to the position of the heat source.
  • the blade is disposed on the frame.
  • an electronic device comprise a housing, a heat source, and a fan.
  • the heat source is disposed in the housing.
  • the fan is disposed in the housing.
  • the fan comprises a frame with an extended portion near the heat source.
  • an electronic device comprise a housing, a plurality of heat sources, and a fan.
  • the heat sources are disposed in the housing.
  • the fan is disposed in the housing.
  • the fan comprises a frame with an extended portion near each heat source. The extended portion is disposed at an airflow inlet or an airflow outlet of the fan.
  • an electronic device comprise a housing and a fan, wherein the housing comprises a fan cavity with a fan disposed therein.
  • the fan comprises a frame, and the shape of the frame is adjusted according to that of the fan cavity.
  • a fan comprise a frame and a blade.
  • the frame comprises an airflow outlet, an airflow inlet, a first extended portion, and a second extended portion.
  • the first extended portion is disposed at the airflow outlet.
  • the second extended portion is disposed at the airflow inlet.
  • the blade is disposed on the frame. Inclined angles of the first and the second extended portions are different. Extended depths of the first and the second extended portions are different.
  • a fan for dissipating heat from a heat source, comprise a frame and a blade.
  • the frame comprises an airflow outlet, an airflow inlet, and a first extended portion.
  • the first extended portion is disposed at the airflow outlet.
  • An inclined angle or an entending direction of the first extended portion is adjusted according to a position of the heat source.
  • the blade is disposed on the frame. Sectional areas of the airflow inlet and the airflow outlet are different. Shapes of the airflow inlet and the airflow outlet are different.
  • a fan comprise a frame and a blade.
  • the frame comprises an airflow outlet, an airflow inlet, a first extended portion, and a second extended portion.
  • the first extended portion is disposed at the airflow outlet.
  • the second extended portion is disposed at the airflow inlet.
  • the blade is disposed on the frame.
  • the frame is circular, oval, equilateral polygonal, scalene polygonal, trapezoidal, sectorial, or irregular shaped.
  • FIG. 1A is a three-dimensional diagram of a conventional fan frame.
  • FIG. 1B is a sectional diagram of the fan frame in FIG. 1A along line a-a.
  • FIG. 2 is a top view of a fan disclosed in U.S. Pat. No. 6,386,843.
  • FIG. 3A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 3B is a three-dimensional diagram of the fan frame in FIG. 3A .
  • FIG. 3C is a sectional diagram of the fan frame in FIG. 3B along line b-b.
  • FIG. 4A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 4B is a top view of the fan frame in FIG. 4A .
  • FIG. 4C is a sectional diagram of the fan frame in FIG. 4B along line c-c.
  • FIG. 5 is a top view of an embodiment of a fan.
  • FIG. 6 is a diagram of an embodiment of a fan frame.
  • FIG. 7A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 7B is a top view of the fan in FIG. 7A .
  • FIG. 7C is a sectional diagram of the fan frame in FIG. 7B along line d-d.
  • FIG. 7D is a sectional diagram of the fan frame in FIG. 7B along line e-e.
  • FIG. 7E is a diagram of an embodiment of a fan frame.
  • FIG. 7F is a sectional diagram of the fan frame in FIG. 7E along line f-f.
  • FIG. 8A is a top view of an embodiment of a fan frame.
  • FIG. 8B is a schematic diagram of an embodiment of an electronic device utilizing the fan in FIG. 8A .
  • FIG. 3A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 3B is a three-dimensional diagram of the fan frame in FIG. 3A .
  • FIG. 3C is a sectional diagram of the fan frame in FIG. 3B along line b-b. A stator and a blade are not shown in FIGS. 3 B ⁇ 3 C for simplicity.
  • the electronic device 2 comprises a housing 2 a , a plurality of heat sources 2 b and 2 c , and a fan 30 .
  • the heat sources 2 b and 2 c and the fan 30 are disposed in the housing 2 a . Due to space limitations, the heat sources 2 b and 2 c are disposed separately.
  • the housing 2 a comprises a fan cavity 2 d for accommodating the fan 30 .
  • the scope of an airflow field w is modified by adjusting the shape of a frame 31 of the fan for heat dissipation in a limited space.
  • the fan 30 is an axial fan with a rectangular frame 31 .
  • the frame 31 comprises an airflow outlet 31 b , an airflow inlet 31 c , two extended portions 31 d and 31 e , and a bushing 33 .
  • a stator coil 32 is wound at the bushing 33 , and a blade 35 is connected with the bushing 33 through a pivot 34 .
  • the extended portion 31 d is disposed at the airflow outlet 31 b .
  • the inclined angle of the extended portion 31 d is adjusted according to the relative position of the fan cavity 2 d and the heat sources 2 b and 2 c .
  • the airflow field w in FIG. 3A is larger due to the extended portion 31 d.
  • the extended portion 31 e is disposed at the airflow outlet 31 c .
  • the two extended portions 31 d and 31 e are on the same side.
  • the inclined angle of the extended portion 31 e is adjusted according to the position of the fan cavity 2 d for increasing airflow to improve heat dissipation.
  • FIG. 3B four positioning holes are formed at the four corners of the frame 31 respectively.
  • the frame 31 can be positioned in the electronic device 2 via the four positioning holes.
  • the locations of the four positioning holes can be adjusted when necessary.
  • the four positioning holes are omitted for simplicity.
  • FIG. 4A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 4B is a top view of the fan frame in FIG. 4A .
  • FIG. 4C is a sectional diagram of the fan frame in FIG. 4B along line c-c. A stator and a blade are not shown in FIGS. 4 B ⁇ 4 C for simplicity.
  • the electronic device 3 comprises a housing 3 a , a major heat source 3 b , a minor heat source 3 c , and a fan 40 .
  • the heat sources 3 b and 3 c and the fan 40 are disposed in the housing 3 a .
  • the fan faces the major heat source 3 b .
  • the two heat sources 3 b and 3 c are spaced farther (D>p), the fan 40 has an extended portions with larger inclined angles, and thus the scope of the airflow field w in FIG. 4A is larger.
  • the frame 41 of the fan 40 is similar to the previously described frame 31 .
  • the frame 41 is rectangular.
  • the frame 41 comprises an airflow outlet 41 c , an airflow inlet 41 d , and two extended portions 41 a and 41 b .
  • the extended portions 41 a and 41 b are disposed at the airflow outlet 41 c and the airflow inlet 41 d respectively.
  • the main difference between this and previously described frames is that the extended portions 41 a and 41 b have different inclined angles ( ⁇ 1 and ⁇ 2 ) and extended depths (d 1 and d 2 ). As shown in FIG.
  • the extended depths ( ⁇ 1 and ⁇ 2 ) are distances from the airflow outlet 41 c or the airflow inlet 41 d to the extended portions 41 a or 41 b .
  • the inclined angles ( ⁇ 1 and ⁇ 2 ) represent the included angle between the wall of the extended portions and the connected vertical walls.
  • the extended portions 41 a and 41 b are formed with different inclined angles ( ⁇ 1 and ⁇ 2 ).
  • the airflow outlet 41 c and the airflow inlet 41 d have different sectional areas and shapes, and the center of the blade is not located at the center of the frame.
  • the frame design can be modified according to positions and sizes of heat sources and the fan cavity, thus optimizing heat dissipation.
  • FIG. 5 is a top view of an embodiment of a fan.
  • the fan 50 comprises a frame 51 and a blade 52 , and the frame 51 comprises an extended portion 51 a .
  • the main difference between this and previously described frames is described in the following.
  • the frame 51 is trapezoidal.
  • the extended portion 51 a is formed along the edges of the airflow outlet or the airflow inlet.
  • the shapes of the airflow outlet and the airflow inlet are basically sectorial for dissipating heat from separated heat sources.
  • FIG. 6 is a diagram of an embodiment of a fan frame.
  • the frame 61 comprises an extended portion 61 a on its two sides, thus adjusting the scope of the airflow field to suit various kinds of heat sources.
  • FIG. 7A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 7B is a top view of the fan in FIG. 7A .
  • FIG. 7C is a sectional diagram of the fan frame in FIG. 7B along line d-d.
  • FIG. 7D is a sectional diagram of the fan frame in FIG. 7B along line e-e.
  • the electronic device 4 comprises a housing 4 a and a plurality of heat sources 4 b and 4 c .
  • the heat sources 4 b and 4 c and the fan 70 are disposed in the housing 4 a . Due to space limitations, the heat sources 4 b and 4 c are disposed separately.
  • the housing 4 a comprises a fan cavity 4 d on its side for accommodating the fan 70 .
  • the airflow inlet and the airflow outlet are not parallel, so the airflow direction is changed.
  • the scope of an airflow field w is modified by adjusting the shape of a frame 71 of the fan for heat dissipation in limited space.
  • the frame 71 comprises an extended portion 71 a formed at the airflow outlet 71 c and another extended portion 71 b formed at the airflow inlet 71 d .
  • the main difference between this and previously described frames is described in the following.
  • the frame 71 is oval.
  • the inclined angles and depths of the extended portions are adjusted according to the heat sources 4 b and 4 c and the fan cavity 4 d in the housing 4 a , thus changing the scope of the airflow field to suit various kinds of heat sources.
  • FIG. 7E is a diagram of an embodiment of a fan frame.
  • FIG. 7F is a sectional diagram of the fan frame in FIG. 7E along line f-f.
  • the frame 71 of the fan 70 comprises a plurality of segments of different inclined angles. Shapes of any two adjacent segments are different, and axial heights of any two adjacent segments are different.
  • the extended portions 71 a and 71 b are disposed at the airflow outlet 71 c .
  • the extended portions 71 a and 71 b can comprise a plurality of segments. The distance between each segment and the end of the blade can be different, and height of each segment can be different.
  • the scope of the airflow field can be adjusted to suit various kinds of heat sources.
  • FIG. 8A is a top view of an embodiment of a fan frame.
  • FIG. 8B is a schematic diagram of an embodiment of an electronic device utilizing the fan in FIG. 8A .
  • the electronic device 5 comprises a fan cavity 5 a for accommodation of the fan 80 in FIG. 8A .
  • the fan cavity 5 a has an irregular shape.
  • the shape of the frame 81 is changed to suit the fan cavity 5 a .
  • the fan 8 dissipates heat generated by heat sources 5 b , 5 c , and 5 d.
  • the fan cavity 5 a in FIG. 8B can be circular, oval, rectangular, trapezoidal, sectorial, equilateral polygonal, scalene polygonal, or irregular shaped, and the shape of the frame 81 can be changed accordingly.

Abstract

Electronic devices and fans thereof are provided. An electronic device comprises a fan cavity and separately disposed heat sources. A fan is disposed in the fan cavity with a frame shaped according to the profile of the fan cavity. The frame also includes an extended portion formed according to the relative position of the fan cavity and separated heat sources, optimizing the heat dissipation.

Description

    BACKGROUND
  • The invention relates to fans, and in particular, to fans for electronic devices.
  • Typically, when designing an axial fan, airflow outlet/inlet size thereof is increased to raise airflow. Generally, conventional fans utilize a square frame, as shown in FIG. 1A. Due to limitations of the frame 10, the extended ramp 11 design of the airflow outlet/inlet cannot be optimized to maximize airflow.
  • Conventionally, the center of the fan is aligned with a heat source to optimize heat dissipation. FIG. 1B is a sectional diagram of the fan frame in FIG. 1A along line a-a. FIG. 1B shows an airflow field generated by the fan in FIG. 1A. In FIG. 1B, the notation ‘w’ represents the airflow field, ‘13’ represents the center line of the fan, and ‘1 a’ represents a heat source. The fan is disposed in system 1, and the heat source la is on the center line 13.
  • The heat source 1 a cannot always be directly on the center line 13 of the fan because other components in the system occupy the same space. In such cases, a new fan of a larger size or with a higher rotational speed is required, raising production costs and generating relatively more noise.
  • Accordingly, U.S. Pat. No. 6,386,843 discloses a fan capable of dissipating heat from a plurality of heat sources. Referring to FIG. 2, the fan 20 has a ramp 21 formed on the frame and an extended portion 22 on its side, thereby improving heat dissipation capability. The shape of the frame is basically square. Thus, the square frame is not suitable when system space is limited.
  • SUMMARY
  • Fans and electronic devices utilizing the same are provided. An exemplary embodiment of an electronic device comprises a housing, a heat source, and a fan. The housing comprises a fan cavity. The heat source is disposed in the housing. The fan is disposed in the fan cavity. The fan comprises a frame. The frame comprises an airflow outlet, an airflow inlet, and a first extended portion. The first extended portion is disposed at the airflow outlet or the airflow inlet. An inclined angle, an entending direction or a position of the first extended portion is adjusted according to a position or a shape of the fan cavity or the heat source.
  • An exemplary embodiment of a fan, for dissipating heat from a heat source, comprises a frame and a blade. The frame comprises an airflow outlet, an airflow inlet, and a first extended portion. The first extended portion is disposed at the airflow outlet or the airflow inlet. An inclined angle, an entending direction or a position of the first extended portion is adjusted according to the position of the heat source. The blade is disposed on the frame.
  • Some embodiments of an electronic device comprise a housing, a heat source, and a fan. The heat source is disposed in the housing. The fan is disposed in the housing. The fan comprises a frame with an extended portion near the heat source.
  • Some embodiments of an electronic device comprise a housing, a plurality of heat sources, and a fan. The heat sources are disposed in the housing. The fan is disposed in the housing. The fan comprises a frame with an extended portion near each heat source. The extended portion is disposed at an airflow inlet or an airflow outlet of the fan.
  • Some embodiments of an electronic device comprise a housing and a fan, wherein the housing comprises a fan cavity with a fan disposed therein. The fan comprises a frame, and the shape of the frame is adjusted according to that of the fan cavity.
  • Some embodiments of a fan comprise a frame and a blade. The frame comprises an airflow outlet, an airflow inlet, a first extended portion, and a second extended portion. The first extended portion is disposed at the airflow outlet. The second extended portion is disposed at the airflow inlet. The blade is disposed on the frame. Inclined angles of the first and the second extended portions are different. Extended depths of the first and the second extended portions are different.
  • Some embodiments of a fan, for dissipating heat from a heat source, comprise a frame and a blade. The frame comprises an airflow outlet, an airflow inlet, and a first extended portion. The first extended portion is disposed at the airflow outlet. An inclined angle or an entending direction of the first extended portion is adjusted according to a position of the heat source. The blade is disposed on the frame. Sectional areas of the airflow inlet and the airflow outlet are different. Shapes of the airflow inlet and the airflow outlet are different.
  • Some embodiments of a fan comprise a frame and a blade. The frame comprises an airflow outlet, an airflow inlet, a first extended portion, and a second extended portion. The first extended portion is disposed at the airflow outlet. The second extended portion is disposed at the airflow inlet. The blade is disposed on the frame. The frame is circular, oval, equilateral polygonal, scalene polygonal, trapezoidal, sectorial, or irregular shaped.
  • DESCRIPTION OF THE DRAWINGS
  • Fans and electronic devices can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
  • FIG. 1A is a three-dimensional diagram of a conventional fan frame.
  • FIG. 1B is a sectional diagram of the fan frame in FIG. 1A along line a-a.
  • FIG. 2 is a top view of a fan disclosed in U.S. Pat. No. 6,386,843.
  • FIG. 3A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 3B is a three-dimensional diagram of the fan frame in FIG. 3A.
  • FIG. 3C is a sectional diagram of the fan frame in FIG. 3B along line b-b.
  • FIG. 4A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 4B is a top view of the fan frame in FIG. 4A.
  • FIG. 4C is a sectional diagram of the fan frame in FIG. 4B along line c-c.
  • FIG. 5 is a top view of an embodiment of a fan.
  • FIG. 6 is a diagram of an embodiment of a fan frame.
  • FIG. 7A is a schematic diagram of airflow field related to an embodiment of an electronic device.
  • FIG. 7B is a top view of the fan in FIG. 7A.
  • FIG. 7C is a sectional diagram of the fan frame in FIG. 7B along line d-d.
  • FIG. 7D is a sectional diagram of the fan frame in FIG. 7B along line e-e.
  • FIG. 7E is a diagram of an embodiment of a fan frame.
  • FIG. 7F is a sectional diagram of the fan frame in FIG. 7E along line f-f.
  • FIG. 8A is a top view of an embodiment of a fan frame.
  • FIG. 8B is a schematic diagram of an embodiment of an electronic device utilizing the fan in FIG. 8A.
  • DETAILED DESCRIPTION
  • FIG. 3A is a schematic diagram of airflow field related to an embodiment of an electronic device. FIG. 3B is a three-dimensional diagram of the fan frame in FIG. 3A. FIG. 3C is a sectional diagram of the fan frame in FIG. 3B along line b-b. A stator and a blade are not shown in FIGS. 33C for simplicity.
  • As shown in FIG. 3A, the electronic device 2 comprises a housing 2 a, a plurality of heat sources 2 b and 2 c, and a fan 30. The heat sources 2 b and 2 c and the fan 30 are disposed in the housing 2 a. Due to space limitations, the heat sources 2 b and 2 c are disposed separately. The housing 2 a comprises a fan cavity 2 d for accommodating the fan 30. The scope of an airflow field w is modified by adjusting the shape of a frame 31 of the fan for heat dissipation in a limited space.
  • As shown in FIGS. 3A=18 3C, the fan 30 is an axial fan with a rectangular frame 31. The frame 31 comprises an airflow outlet 31 b, an airflow inlet 31 c, two extended portions 31 d and 31 e, and a bushing 33. A stator coil 32 is wound at the bushing 33, and a blade 35 is connected with the bushing 33 through a pivot 34. The extended portion 31 d is disposed at the airflow outlet 31 b. The inclined angle of the extended portion 31 d is adjusted according to the relative position of the fan cavity 2 d and the heat sources 2 b and 2 c. Suppose two heat sources spaced the same distance are disposed in FIGS. 1B and 3A, the airflow field w in FIG. 3A is larger due to the extended portion 31 d.
  • Referring to FIGS. 3A and 3D, the extended portion 31 e is disposed at the airflow outlet 31 c. The two extended portions 31 d and 31 e are on the same side. The inclined angle of the extended portion 31 e is adjusted according to the position of the fan cavity 2 d for increasing airflow to improve heat dissipation.
  • In FIG. 3B, four positioning holes are formed at the four corners of the frame 31 respectively. The frame 31 can be positioned in the electronic device 2 via the four positioning holes. The locations of the four positioning holes can be adjusted when necessary. In the following disclosed embodiments, the four positioning holes are omitted for simplicity.
  • FIG. 4A is a schematic diagram of airflow field related to an embodiment of an electronic device. FIG. 4B is a top view of the fan frame in FIG. 4A. FIG. 4C is a sectional diagram of the fan frame in FIG. 4B along line c-c. A stator and a blade are not shown in FIGS. 44C for simplicity.
  • As shown in FIG. 4A, the electronic device 3 comprises a housing 3 a, a major heat source 3 b, a minor heat source 3 c, and a fan 40. The heat sources 3 b and 3 c and the fan 40 are disposed in the housing 3 a. The fan faces the major heat source 3 b. In comparison of FIGS. 3A and 4A, the two heat sources 3 b and 3 c are spaced farther (D>p), the fan 40 has an extended portions with larger inclined angles, and thus the scope of the airflow field w in FIG. 4A is larger.
  • As shown in FIGS. 44C, the frame 41 of the fan 40 is similar to the previously described frame 31. The frame 41 is rectangular. The frame 41 comprises an airflow outlet 41 c, an airflow inlet 41 d, and two extended portions 41 a and 41 b. The extended portions 41 a and 41 b are disposed at the airflow outlet 41 c and the airflow inlet 41 d respectively. The main difference between this and previously described frames is that the extended portions 41 a and 41 b have different inclined angles (θ1 and θ2) and extended depths (d1 and d2). As shown in FIG. 4C, the extended depths (θ1 and θ2) are distances from the airflow outlet 41 c or the airflow inlet 41 d to the extended portions 41 a or 41 b. The inclined angles (θ1 and θ2) represent the included angle between the wall of the extended portions and the connected vertical walls.
  • Referring to FIG. 4A, the extended portions 41 a and 41 b are formed with different inclined angles (θ1 and θ2). Thus, the airflow outlet 41 c and the airflow inlet 41 d have different sectional areas and shapes, and the center of the blade is not located at the center of the frame. The frame design can be modified according to positions and sizes of heat sources and the fan cavity, thus optimizing heat dissipation.
  • FIG. 5 is a top view of an embodiment of a fan. The fan 50 comprises a frame 51 and a blade 52, and the frame 51 comprises an extended portion 51 a. The main difference between this and previously described frames is described in the following. The frame 51 is trapezoidal. The extended portion 51 a is formed along the edges of the airflow outlet or the airflow inlet. The shapes of the airflow outlet and the airflow inlet are basically sectorial for dissipating heat from separated heat sources.
  • FIG. 6 is a diagram of an embodiment of a fan frame. The frame 61 comprises an extended portion 61 a on its two sides, thus adjusting the scope of the airflow field to suit various kinds of heat sources.
  • FIG. 7A is a schematic diagram of airflow field related to an embodiment of an electronic device. FIG. 7B is a top view of the fan in FIG. 7A. FIG. 7C is a sectional diagram of the fan frame in FIG. 7B along line d-d. FIG. 7D is a sectional diagram of the fan frame in FIG. 7B along line e-e.
  • As shown in FIG. 7A, the electronic device 4 comprises a housing 4 a and a plurality of heat sources 4 b and 4 c. The heat sources 4 b and 4 c and the fan 70 are disposed in the housing 4 a. Due to space limitations, the heat sources 4 b and 4 c are disposed separately. The housing 4 a comprises a fan cavity 4 d on its side for accommodating the fan 70. The airflow inlet and the airflow outlet are not parallel, so the airflow direction is changed. The scope of an airflow field w is modified by adjusting the shape of a frame 71 of the fan for heat dissipation in limited space.
  • As shown in FIGS. 77D, the frame 71 comprises an extended portion 71 a formed at the airflow outlet 71 c and another extended portion 71 b formed at the airflow inlet 71 d. The main difference between this and previously described frames is described in the following. The frame 71 is oval. The inclined angles and depths of the extended portions are adjusted according to the heat sources 4 b and 4 c and the fan cavity 4 d in the housing 4 a, thus changing the scope of the airflow field to suit various kinds of heat sources.
  • FIG. 7E is a diagram of an embodiment of a fan frame. FIG. 7F is a sectional diagram of the fan frame in FIG. 7E along line f-f. As shown in FIGS. 7E and 7F, the frame 71 of the fan 70 comprises a plurality of segments of different inclined angles. Shapes of any two adjacent segments are different, and axial heights of any two adjacent segments are different. The extended portions 71 a and 71 b are disposed at the airflow outlet 71 c. According to heat dissipation requirements, the extended portions 71 a and 71 b can comprise a plurality of segments. The distance between each segment and the end of the blade can be different, and height of each segment can be different. Thus, the scope of the airflow field can be adjusted to suit various kinds of heat sources.
  • The shape of the frame can be optimized according to the fan cavity in the system. FIG. 8A is a top view of an embodiment of a fan frame. FIG. 8B is a schematic diagram of an embodiment of an electronic device utilizing the fan in FIG. 8A.
  • In FIG. 8B, the electronic device 5 comprises a fan cavity 5 a for accommodation of the fan 80 in FIG. 8A. The fan cavity 5 a has an irregular shape. By forming an extended portion 81 a on the frame 81, the shape of the frame 81 is changed to suit the fan cavity 5 a. The fan 8 dissipates heat generated by heat sources 5 b, 5 c, and 5 d.
  • The fan cavity 5 a in FIG. 8B can be circular, oval, rectangular, trapezoidal, sectorial, equilateral polygonal, scalene polygonal, or irregular shaped, and the shape of the frame 81 can be changed accordingly.
  • While the invention has been described by way of example and in terms of several embodiments, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (20)

1. An electronic device, comprising:
a housing;
at least a heat source disposed in the housing; and
a fan disposed in the housing, wherein the fan comprises a frame, the frame comprises an airflow outlet, an airflow inlet, and a first extended portion, the first extended portion is disposed at the airflow outlet or the airflow inlet, and an inclined angle, an extending direction or a position of the first extended portion is adjusted according to a position of the heat source.
2. The electronic device as claimed in claim 1, wherein the shape of the frame is appropriately modified according to the housing.
3. The electronic device as claimed in claim 1, wherein the frame further comprises a second extended portion, and the second extended portion is disposed at the airflow outlet or the airflow inlet where the first extended portion is not disposed.
4. The electronic device as claimed in claim 3, wherein an inclined angle of the second extended portion is adjusted according to a position of the housing for increasing airflow.
5. The electronic device as claimed in claim 3, wherein the inclined angles or the extended depths of the first and the second extended portions are different.
6. The electronic device as claimed in claim 3, wherein the second extended portion comprises a plurality of segments, and the distance between each segment and an end of a blade of the fan is different.
7. The electronic device as claimed in claim 1, wherein the sectional areas or the shape of the airflow inlet and the airflow outlet are different, or the airflow inlet and the airflow outlet are not parallel.
8. The electronic device as claimed in claim 1, wherein the frame is circular, oval, equilateral polygonal, scalene polygonal, trapezoidal, sectorial, or irregular shaped.
9. The electronic device as claimed in claim 1, wherein the first extended portion comprises a plurality of segments, and the distance between each segment and an end of a blade of the fan is different.
10. The electronic device as claimed in claim 1, wherein the frame comprises a plurality of segments with different inclined angles or axial heights.
11. A fan for dissipating heat from at least a heat source, comprising:
a frame comprising an airflow outlet, an airflow inlet, and a first extended portion, wherein the first extended portion is disposed at the airflow outlet or the airflow inlet, and an inclined angle, an extending direction or a position of the first extended portion is adjusted according to a position of the heat source; and
a blade disposed in the frame.
12. The fan as claimed in claim 11, wherein the frame further comprises a second extended portion, and the second extended portion is disposed at one of the airflow outlet or the airflow inlet where the first extended portion is not disposed.
13. The fan as claimed in claim 12, wherein the inclined angles or the extended depths of the first and the second extended portions are different.
14. The fan as claimed in claim 12, wherein the second extended portion comprises a plurality of segments, and the distance between each segment and an end of the blade is different.
15. The fan as claimed in claim 11, wherein the first extended portion comprises a plurality of segments, and the distance between each segment and an end of the blade is different.
16. The fan as claimed in claim 11, wherein the sectional areas or the shape of the airflow inlet and the airflow outlet are different, or the airflow inlet and the airflow outlet are not parallel.
17. The fan as claimed in claim 11, wherein the frame comprises a plurality of segments, and the axial heights or the inclined angles of any two adjacent segments are different.
18. The fan as claimed in claim 11, wherein the frame is circular, oval, equilateral polygonal, scalene polygonal, trapezoidal, sectorial, or irregular shaped.
19. An electronic device comprising:
a housing comprising a fan cavity; and
a fan disposed in the fan cavity, wherein the fan comprises a frame, and the shape of the frame is adjusted according to that of the fan cavity.
20. The electronic device as claimed in claim 19, wherein the frame comprises a plurality of segments, and the axial heights or the inclined angles of any two adjacent segments are different.
US11/214,808 2004-09-01 2005-08-31 Fans and electronic devices utilizing the same Abandoned US20060045777A1 (en)

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TW093126328A TW200609715A (en) 2004-09-01 2004-09-01 Electronic device and fan thereof

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130272858A1 (en) * 2010-10-13 2013-10-17 Dyson Technology Limited Fan assembly
KR20160097173A (en) * 2013-12-02 2016-08-17 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
KR101742965B1 (en) * 2013-12-02 2017-06-05 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
CN106897524A (en) * 2017-02-28 2017-06-27 郑州云海信息技术有限公司 A kind of method for designing for optimizing fan housing air outlet structure
US20170211589A1 (en) * 2016-01-22 2017-07-27 Minebea Co., Ltd. Axial Fan
GB2484502B (en) * 2010-10-13 2018-05-09 Dyson Technology Ltd A fan assembly
WO2018093115A1 (en) * 2016-11-15 2018-05-24 삼성전자주식회사 Outdoor unit for air conditioner
US20190010960A1 (en) * 2016-02-26 2019-01-10 Mitsubishi Electric Corporation Blower apparatus
US11085654B2 (en) 2016-11-15 2021-08-10 Samsung Electronics Co., Ltd. Outdoor unit for air conditioner
GB2599949A (en) * 2020-10-16 2022-04-20 Mosen Ltd Aerodynamic spoiler for jetfan bellmouth

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734015A (en) * 1982-07-24 1988-03-29 Papst-Motoren Gmbh & Co. Kg Axial-flow fan
US5803709A (en) * 1995-12-06 1998-09-08 Canarm Limited Axial flow fan
US6386843B1 (en) * 1999-12-09 2002-05-14 Nidec Corporation Housing for fan units, and electrical apparatus using a fan unit
US6411509B1 (en) * 2000-04-07 2002-06-25 Delts Electronics, Inc. Tube-conducting fan assembly
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
US20040163795A1 (en) * 2003-02-25 2004-08-26 Yi-Yung Lin Heat sink
US6890149B2 (en) * 2002-06-05 2005-05-10 Donald Metz Laminar flow air mover
US7110255B2 (en) * 2003-04-11 2006-09-19 Delta Electronics, Inc. Heat-dissipating device and a housing thereof
US7123484B2 (en) * 2004-02-04 2006-10-17 Quanta Computer, Inc. Multi-layer and multi-direction fan device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734015A (en) * 1982-07-24 1988-03-29 Papst-Motoren Gmbh & Co. Kg Axial-flow fan
US5803709A (en) * 1995-12-06 1998-09-08 Canarm Limited Axial flow fan
US6386843B1 (en) * 1999-12-09 2002-05-14 Nidec Corporation Housing for fan units, and electrical apparatus using a fan unit
US6411509B1 (en) * 2000-04-07 2002-06-25 Delts Electronics, Inc. Tube-conducting fan assembly
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
US6890149B2 (en) * 2002-06-05 2005-05-10 Donald Metz Laminar flow air mover
US20040163795A1 (en) * 2003-02-25 2004-08-26 Yi-Yung Lin Heat sink
US7110255B2 (en) * 2003-04-11 2006-09-19 Delta Electronics, Inc. Heat-dissipating device and a housing thereof
US7123484B2 (en) * 2004-02-04 2006-10-17 Quanta Computer, Inc. Multi-layer and multi-direction fan device

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2484502B (en) * 2010-10-13 2018-05-09 Dyson Technology Ltd A fan assembly
US20130272858A1 (en) * 2010-10-13 2013-10-17 Dyson Technology Limited Fan assembly
US10100836B2 (en) * 2010-10-13 2018-10-16 Dyson Technology Limited Fan assembly
KR102582026B1 (en) * 2013-12-02 2023-09-25 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
KR101742965B1 (en) * 2013-12-02 2017-06-05 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
US9822801B2 (en) 2013-12-02 2017-11-21 Samsung Electronics Co., Ltd. Blower and outdoor unit of air conditioner comprising same
USRE49709E1 (en) 2013-12-02 2023-10-24 Samsung Electronics Co., Ltd. Blower and outdoor unit of air conditioner comprising same
EP3318766A1 (en) * 2013-12-02 2018-05-09 Samsung Electronics Co., Ltd. Blower and outdoor unit of air conditioner comprising same
KR102317333B1 (en) * 2013-12-02 2021-10-27 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
AU2014357992B2 (en) * 2013-12-02 2018-07-12 Samsung Electronics Co., Ltd. Blower and outdoor unit of air conditioner comprising same
KR102317338B1 (en) * 2013-12-02 2021-10-27 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
AU2014357992C1 (en) * 2013-12-02 2019-01-03 Samsung Electronics Co., Ltd. Blower and outdoor unit of air conditioner comprising same
KR20160097173A (en) * 2013-12-02 2016-08-17 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
KR101931357B1 (en) * 2013-12-02 2019-03-13 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
US10393150B2 (en) * 2013-12-02 2019-08-27 Samsung Electronics Co., Ltd. Blower and outdoor unit of air conditioner comprising same
KR20210133926A (en) * 2013-12-02 2021-11-08 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
KR20210006485A (en) * 2013-12-02 2021-01-18 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
KR20210006483A (en) * 2013-12-02 2021-01-18 삼성전자주식회사 Blower and outdoor unit of air conditioner having the same
US20170211589A1 (en) * 2016-01-22 2017-07-27 Minebea Co., Ltd. Axial Fan
US20190010960A1 (en) * 2016-02-26 2019-01-10 Mitsubishi Electric Corporation Blower apparatus
US10801518B2 (en) * 2016-02-26 2020-10-13 Mitsubishi Electric Corporation Blower apparatus
US11085654B2 (en) 2016-11-15 2021-08-10 Samsung Electronics Co., Ltd. Outdoor unit for air conditioner
WO2018093115A1 (en) * 2016-11-15 2018-05-24 삼성전자주식회사 Outdoor unit for air conditioner
CN106897524A (en) * 2017-02-28 2017-06-27 郑州云海信息技术有限公司 A kind of method for designing for optimizing fan housing air outlet structure
GB2599949A (en) * 2020-10-16 2022-04-20 Mosen Ltd Aerodynamic spoiler for jetfan bellmouth
GB2599949B (en) * 2020-10-16 2023-04-26 Mosen Ltd Aerodynamic spoiler for jetfan bellmouth

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STCB Information on status: application discontinuation

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