DE3886721T2 - Chipkartenstruktur. - Google Patents
Chipkartenstruktur.Info
- Publication number
- DE3886721T2 DE3886721T2 DE88403290T DE3886721T DE3886721T2 DE 3886721 T2 DE3886721 T2 DE 3886721T2 DE 88403290 T DE88403290 T DE 88403290T DE 3886721 T DE3886721 T DE 3886721T DE 3886721 T2 DE3886721 T2 DE 3886721T2
- Authority
- DE
- Germany
- Prior art keywords
- smart card
- card structure
- smart
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8717902A FR2625000B1 (fr) | 1987-12-22 | 1987-12-22 | Structure de carte a puce |
Publications (3)
Publication Number | Publication Date |
---|---|
DE3886721D1 DE3886721D1 (de) | 1994-02-10 |
DE3886721T2 true DE3886721T2 (de) | 1994-04-28 |
DE3886721T3 DE3886721T3 (de) | 2000-01-27 |
Family
ID=9358144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3886721T Expired - Lifetime DE3886721T3 (de) | 1987-12-22 | 1988-12-22 | Chipkartenstruktur. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4990759A (de) |
EP (1) | EP0322320B2 (de) |
JP (1) | JP2757309B2 (de) |
DE (1) | DE3886721T3 (de) |
ES (1) | ES2051883T5 (de) |
FR (1) | FR2625000B1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19534480A1 (de) * | 1995-09-18 | 1997-03-20 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie Verfahren zur Herstellung einer IC-Karte |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5227338A (en) * | 1990-04-30 | 1993-07-13 | International Business Machines Corporation | Three-dimensional memory card structure with internal direct chip attachment |
FR2664721B1 (fr) * | 1990-07-10 | 1992-09-25 | Gemplus Card Int | Carte a puce renforcee. |
FR2665281B1 (fr) * | 1990-07-30 | 1993-11-19 | Gemplus Card International | Procede de fabrication d'une carte a microcircuit et carte obtenue par ce procede. |
FR2686996B1 (fr) * | 1992-01-31 | 1996-02-02 | Solaic Sa | Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. |
FR2695234B1 (fr) * | 1992-08-26 | 1994-11-04 | Gemplus Card Int | Procédé de marquage d'une carte à puce. |
US5498859A (en) * | 1993-02-20 | 1996-03-12 | Farmont Technik Gmbh & Co. | Parking card for the charge-related actuation of a parking barrier |
US5487459A (en) * | 1993-02-20 | 1996-01-30 | Farmont Tecknik Gmbh & Co. Kg | Collection and issuing apparatus for round parking cards |
US5437901A (en) * | 1993-06-29 | 1995-08-01 | Farmont; Johann | Parking card for the charge-related actuation of a parking barrier |
US5500515A (en) * | 1993-06-29 | 1996-03-19 | Farmont; Johann | Method of using a parking card for operating a parking barrier for pay parking |
US5504314A (en) * | 1993-06-29 | 1996-04-02 | Farmont; Johann | Monitoring and/or directing system for parking areas |
US7137011B1 (en) | 1993-09-01 | 2006-11-14 | Sandisk Corporation | Removable mother/daughter peripheral card |
JPH07101188A (ja) * | 1993-10-05 | 1995-04-18 | Canon Inc | 複合カード |
DE4340847A1 (de) * | 1993-11-26 | 1995-06-01 | Optosys Gmbh Berlin | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
DE4414303C2 (de) * | 1994-04-23 | 1998-07-23 | Farmont Technik | Ausgabevorrichtung für scheibenförmige Parktickets |
DE69529440T2 (de) * | 1994-07-25 | 2003-11-20 | Dainippon Printing Co Ltd | Optische Karte |
FR2724477B1 (fr) * | 1994-09-13 | 1997-01-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
WO1996032696A1 (fr) * | 1995-04-13 | 1996-10-17 | Dai Nippon Printing Co., Ltd. | Carte et module de circuit integre |
FR2734983B1 (fr) * | 1995-05-29 | 1997-07-04 | Sgs Thomson Microelectronics | Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant |
FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
EP0836155A3 (de) * | 1996-10-09 | 1999-03-31 | Canon Kabushiki Kaisha | Informationsaufzeignungsträger |
DE19703990A1 (de) * | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular aufgebauter, elektronischer Datenträger |
FR2762115B1 (fr) * | 1997-04-10 | 1999-12-03 | Schlumberger Ind Sa | Procede d'insertion d'un module electronique dans un corps de carte a memoire electronique |
WO1998052772A1 (fr) * | 1997-05-19 | 1998-11-26 | Hitachi Maxell, Ltd. | Module de circuit integre flexible et son procede de production, procede de production de support d'information comprenant ledit module |
US6131811A (en) * | 1998-05-29 | 2000-10-17 | E-Micro Corporation | Wallet consolidator |
US7357312B2 (en) | 1998-05-29 | 2008-04-15 | Gangi Frank J | System for associating identification and personal data for multiple magnetic stripe cards or other sources to facilitate a transaction and related methods |
US6040622A (en) * | 1998-06-11 | 2000-03-21 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
US6109530A (en) * | 1998-07-08 | 2000-08-29 | Motorola, Inc. | Integrated circuit carrier package with battery coin cell |
US6239976B1 (en) | 1998-11-24 | 2001-05-29 | Comsense Technologies, Ltd. | Reinforced micromodule |
EP1033677A1 (de) * | 1999-03-04 | 2000-09-06 | ESEC Management SA | Verfahren für die Herstellung eines Chipobjektes |
EP1033676A1 (de) * | 1999-03-04 | 2000-09-06 | Sempac SA | Verfahren für die Herstellung eines Chipobjektes |
US7487908B1 (en) * | 1999-10-23 | 2009-02-10 | Ultracard, Inc. | Article having an embedded accessible storage member, apparatus and method for using same |
US6755341B1 (en) | 2000-05-15 | 2004-06-29 | Jacob Y. Wong | Method for storing data in payment card transaction |
US6592044B1 (en) | 2000-05-15 | 2003-07-15 | Jacob Y. Wong | Anonymous electronic card for generating personal coupons useful in commercial and security transactions |
US6805288B2 (en) | 2000-05-15 | 2004-10-19 | Larry Routhenstein | Method for generating customer secure card numbers subject to use restrictions by an electronic card |
US6609654B1 (en) | 2000-05-15 | 2003-08-26 | Privasys, Inc. | Method for allowing a user to customize use of a payment card that generates a different payment card number for multiple transactions |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
US7195154B2 (en) * | 2001-09-21 | 2007-03-27 | Privasys, Inc. | Method for generating customer secure card numbers |
CA2470094C (en) | 2001-12-18 | 2007-12-04 | Digimarc Id Systems, Llc | Multiple image security features for identification documents and methods of making same |
FR2834103B1 (fr) * | 2001-12-20 | 2004-04-02 | Gemplus Card Int | Carte a puce a module de surface etendue |
CA2471457C (en) * | 2001-12-24 | 2011-08-02 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
EP1467834A4 (de) | 2001-12-24 | 2005-04-06 | Digimarc Id Systems Llc | Lasergeätzte sicherheitsmerkmale zur identifikation von dokumenten und herstellungsverfahren dafür |
WO2003056499A2 (en) * | 2001-12-24 | 2003-07-10 | Digimarc Id Systems Llc | Pet based multi-multi-layer smart cards |
CA2470600C (en) * | 2001-12-24 | 2009-12-22 | Digimarc Id Systems, Llc | Systems, compositions, and methods for full color laser engraving of id documents |
US7728048B2 (en) | 2002-12-20 | 2010-06-01 | L-1 Secure Credentialing, Inc. | Increasing thermal conductivity of host polymer used with laser engraving methods and compositions |
US7694887B2 (en) * | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
WO2003088144A2 (en) * | 2002-04-09 | 2003-10-23 | Digimarc Id Systems, Llc | Image processing techniques for printing identification cards and documents |
US7824029B2 (en) * | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
US7804982B2 (en) | 2002-11-26 | 2010-09-28 | L-1 Secure Credentialing, Inc. | Systems and methods for managing and detecting fraud in image databases used with identification documents |
DE602004030434D1 (de) | 2003-04-16 | 2011-01-20 | L 1 Secure Credentialing Inc | Dreidimensionale datenspeicherung |
JP4651332B2 (ja) * | 2004-04-26 | 2011-03-16 | ルネサスエレクトロニクス株式会社 | メモリカード |
KR101175830B1 (ko) * | 2006-06-19 | 2012-08-24 | 나그라아이디 에스.에이. | 하나 이상의 전자 모듈을 포함하는 카드를 조립하기 위한 방법, 상기 방법에서의 조립체 및 중간물 |
SG172719A1 (en) * | 2006-06-19 | 2011-07-28 | Nagraid Sa | Method of fabricating cards comprising at least one electronic module, assembly involved in this method and intermediate product |
JP4620011B2 (ja) * | 2006-08-14 | 2011-01-26 | 株式会社東芝 | Icカード |
PL2132684T3 (pl) | 2007-02-09 | 2013-03-29 | Nagravision Sa | Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór |
JP4599370B2 (ja) * | 2007-02-19 | 2010-12-15 | 株式会社東芝 | Icカード |
MY177316A (en) * | 2008-02-22 | 2020-09-11 | Toppan Printing Co Ltd | Transponder and booklet |
EP2426627B1 (de) * | 2010-09-02 | 2016-10-12 | Oberthur Technologies | Leuchtmodul für Mikroschaltungsvorrichtung |
FR2964487B1 (fr) * | 2010-09-02 | 2013-07-12 | Oberthur Technologies | Carte a microcircuit comprenant un moyen lumineux |
USD691610S1 (en) | 2011-11-07 | 2013-10-15 | Blackberry Limited | Device smart card |
US8950681B2 (en) | 2011-11-07 | 2015-02-10 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
JP6090006B2 (ja) * | 2013-06-25 | 2017-03-08 | 凸版印刷株式会社 | Icモジュール、デュアルicカードおよびicモジュールの製造方法 |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
US9997005B1 (en) * | 2016-12-09 | 2018-06-12 | Capital One Services, Llc | Soft touch resin and transaction card comprising the same |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3153769C2 (de) * | 1981-04-14 | 1995-10-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
FR2538930B1 (fr) * | 1983-01-05 | 1989-05-19 | Seiichiro Aigo | Carte d'information |
JPS6146655U (ja) * | 1984-08-31 | 1986-03-28 | カシオ計算機株式会社 | Icカ−ド |
FR2584235B1 (fr) * | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
FR2599165A1 (fr) * | 1986-05-21 | 1987-11-27 | Michot Gerard | Objet associe a un element electronique et procede d'obtention |
-
1987
- 1987-12-22 FR FR8717902A patent/FR2625000B1/fr not_active Expired - Lifetime
-
1988
- 1988-12-16 US US07/285,712 patent/US4990759A/en not_active Expired - Lifetime
- 1988-12-22 ES ES88403290T patent/ES2051883T5/es not_active Expired - Lifetime
- 1988-12-22 EP EP88403290A patent/EP0322320B2/de not_active Expired - Lifetime
- 1988-12-22 JP JP63324768A patent/JP2757309B2/ja not_active Expired - Lifetime
- 1988-12-22 DE DE3886721T patent/DE3886721T3/de not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19534480A1 (de) * | 1995-09-18 | 1997-03-20 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie Verfahren zur Herstellung einer IC-Karte |
DE19534480C2 (de) * | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
US6310778B1 (en) | 1995-09-18 | 2001-10-30 | David Finn | IC board module for producing an IC board and process for producing an IC board |
Also Published As
Publication number | Publication date |
---|---|
ES2051883T3 (es) | 1994-07-01 |
US4990759A (en) | 1991-02-05 |
EP0322320B1 (de) | 1993-12-29 |
EP0322320B2 (de) | 1999-08-25 |
FR2625000B1 (fr) | 1991-08-16 |
EP0322320A1 (de) | 1989-06-28 |
JP2757309B2 (ja) | 1998-05-25 |
ES2051883T5 (es) | 2000-01-01 |
FR2625000A1 (fr) | 1989-06-23 |
DE3886721D1 (de) | 1994-02-10 |
JPH022100A (ja) | 1990-01-08 |
DE3886721T3 (de) | 2000-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings |